| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 08/31/2006 | US20060194519 Wafer carrier with pressurized membrane and retaining ring actuator |
| 08/31/2006 | US20060194518 Methods for planarization of Group VIII metal-containing surfaces using a fixed abrasive article |
| 08/31/2006 | US20060194515 Methods and systems for conditioning planarizing pads used in planarizing substrates |
| 08/31/2006 | US20060194512 Thickness control method and double side polisher |
| 08/31/2006 | US20060194511 Thickness control method and double side polisher |
| 08/30/2006 | EP1694466A1 A polishing pad for chemical mechanical polishing |
| 08/30/2006 | EP1694464A2 Retaining ring with shaped surface |
| 08/30/2006 | EP1200532B1 Cmp composition containing silane modified abrasive particles |
| 08/30/2006 | CN2812290Y Protection structure for wafer mill |
| 08/30/2006 | CN2810885Y Horizontal iron ball lapping machine |
| 08/30/2006 | CN2810884Y Apparatus for grinding ball joint part |
| 08/30/2006 | CN1826684A Method for polishing wafer |
| 08/30/2006 | CN1826210A Method of preparing a surface of a semiconductor wafer to make it epiready |
| 08/30/2006 | CN1272845C Method for producing contact plug of semiconductor device |
| 08/29/2006 | US7099013 System and method of broad band optical end point detection for film change indication |
| 08/29/2006 | US7097755 Electrochemical mechanical processing with advancible sweeper |
| 08/29/2006 | US7097686 Generating an aerosol including a liquid comprising a nickel precursor and a reducing agent and moving the droplets through a heating zone by means of a carrier gas to form nickel particles having small particle size, narrow size distribution, spherical morphology and high crystallinity; pyrometallurgy |
| 08/29/2006 | US7097550 Chemical mechanical polishing pad |
| 08/29/2006 | US7097549 Polishing pad |
| 08/29/2006 | US7097546 System and method for reducing surface defects in integrated circuits |
| 08/29/2006 | US7097544 Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion |
| 08/29/2006 | US7097542 Method and apparatus for conditioning a polishing pad |
| 08/29/2006 | US7097541 CMP method for noble metals |
| 08/29/2006 | US7097538 Advanced chemical mechanical polishing system with smart endpoint detection |
| 08/29/2006 | US7097536 Electrically enhanced surface planarization |
| 08/29/2006 | US7097535 Method and configuration for conditioning a polishing pad surface |
| 08/29/2006 | US7096937 Flow completion system |
| 08/29/2006 | US7096567 Method for measuring amount of grinding in magnetic head producing process |
| 08/24/2006 | WO2006089293A1 Customized polishing pads for cmp and methods of fabrication and use thereof |
| 08/24/2006 | WO2006089291A1 Use of phosphorescent materials for two-dimensional wafer mapping in a chemical mechanical polishing |
| 08/24/2006 | US20060189264 Apparatus and method for conditioning polishing surface, and polishing apparatus and method of operation |
| 08/24/2006 | US20060189259 Polishing apparatus and related polishing methods |
| 08/24/2006 | US20060189257 Systems and methods for wafer polishing |
| 08/24/2006 | US20060189256 Systems and methods for wafer polishing |
| 08/24/2006 | US20060189140 Insulated pad conditioner and method of using same |
| 08/24/2006 | US20060189139 Methods and apparatuses for electrochemical-mechanical polishing |
| 08/24/2006 | US20060186372 For planarizing the surface of a substrate, storage stability |
| 08/24/2006 | US20060185784 Apparatus, system and method to reduce wafer warpage |
| 08/24/2006 | DE102005062935A1 Gerät und Verfahren zur Untersuchung von Metallüberresten auf Halbleiter Wafern Apparatus and method for the examination of metal remains on semiconductor wafers |
| 08/24/2006 | DE10157452B4 Verfahren zum chemisch-mechanischen Polieren von Wafern A method for chemical mechanical polishing of wafers |
| 08/24/2006 | CA2598272A1 Customized polishing pads for cmp and methods of fabrication and use thereof |
| 08/23/2006 | EP1693883A2 A brush assembly apparatus |
| 08/23/2006 | EP1138438B1 Polishing pad and polishing device |
| 08/23/2006 | CN1822919A Hydrodynamic radial flux tool for polishing and grinding optical and semiconductor surfaces |
| 08/23/2006 | CN1821339A Abrasive, method of polishing target member and process for producing semiconductor device |
| 08/23/2006 | CN1820897A Crystal plate carrying apparatus |
| 08/22/2006 | US7094695 Apparatus and method for conditioning a polishing pad used for mechanical and/or chemical-mechanical planarization |
| 08/22/2006 | US7094139 Retaining ring with flange for chemical mechanical polishing |
| 08/22/2006 | US7094134 Off-line tool for breaking in multiple pad conditioning disks used in a chemical mechanical polishing system |
| 08/17/2006 | WO2006085614A2 Cushioning material for polishing pad |
| 08/17/2006 | WO2006085423A1 Cmp method, cmp apparatus, method for manufacturing laminated board having sti structure and method for manufacturing semiconductor device |
| 08/17/2006 | US20060183412 Polishing pad |
| 08/17/2006 | US20060183410 Diamond conditioning of soft chemical mechanical planarization/polishing (CMP) polishing pads |
| 08/17/2006 | US20060183407 Platen and head rotation rates for monitoring chemical mechanical polishing |
| 08/17/2006 | US20060183334 Methods for planarization of group VIII metal-containing surfaces using oxidizing gases |
| 08/17/2006 | US20060180788 an aqueous fluid comprising an oxidizer that produces oxygen-containing free radicals when contacted with an activator comprising oxides of iron or copper coated with tin, and abrasive particles comprising alumina or alumina-coated silica, used for chemical mechanical polishing (cmp) |
| 08/17/2006 | US20060180787 Cerium oxide abrasive and method of polishing substrates |
| 08/17/2006 | US20060179632 Support system for semiconductor wafers |
| 08/16/2006 | EP1691401A2 CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive |
| 08/16/2006 | EP1341223B1 Polishing progress monitoring device and polishing device |
| 08/16/2006 | CN2807472Y Pressure spiral arms structure |
| 08/16/2006 | CN2806863Y Universal active wheel |
| 08/16/2006 | CN1819028A Method of lapping row bar in which perpendicular magnetic heads are formed and lapping machine |
| 08/16/2006 | CN1817564A Loading and unloading system and method for grinding plates |
| 08/16/2006 | CN1817563A Adhering stripping method and device for plate on clamp |
| 08/16/2006 | CN1270356C 化学机械研磨垫 The chemical mechanical polishing pad |
| 08/16/2006 | CN1270320C Apparatus and method for machining slide blocks, and loading device for machining slide blocks |
| 08/16/2006 | CN1269926C Polishing composition and polishing method |
| 08/16/2006 | CN1269615C Lapping pad containing embedded liquid trace component and its production method |
| 08/15/2006 | US7091053 In-line wafer surface mapping |
| 08/15/2006 | US7090821 Metal oxide powder for high precision polishing and method of preparation thereof |
| 08/15/2006 | US7090786 abraisive ceria particles; 2-bromo-2-nitro-1,3-propanediol, 2-bromo-2-nitro-1, 3-butanediol, 2,2-dibromo-2-nitroethanol, or 2,2-dibromo-3-nitrilopropionamide; polypotassium or ammonium acrylate, ammonium citrate or ammonium dodecylbenzenesulfonate; storage stability; effective in neutral pH ranges |
| 08/15/2006 | US7090572 Polishing pad, polishing apparatus having the same, and bonding apparatus |
| 08/15/2006 | US7090570 Chemical mechanical polishing apparatus and methods using a polishing surface with non-uniform rigidity |
| 08/15/2006 | US7090567 Method and an element for surface polishing |
| 08/15/2006 | US7089782 Polishing head test station |
| 08/10/2006 | WO2005070059A3 Layered support and method for laminating cmp pads |
| 08/10/2006 | US20060178096 Subpad support with a releasable subpad securing element and polishing apparatus including the subpad support |
| 08/10/2006 | US20060178095 Polishing media stabilizer |
| 08/10/2006 | US20060178094 Polishing apparatus |
| 08/10/2006 | US20060178089 Wafer-retaining carrier, double-side grinding device using the same, and double-side grinding method for wafer |
| 08/10/2006 | US20060175296 Method of manufacturing semiconductor device |
| 08/10/2006 | US20060175295 Abrasive partilcle for chemical mechanical polishing |
| 08/10/2006 | US20060175294 Chemical mechanical polishing method and apparatus |
| 08/10/2006 | DE102004014179B4 Polierkissen mit Überwachungsfunktionalität Polishing pad with monitoring functionality |
| 08/09/2006 | EP1688218A1 Polishing apparatus |
| 08/09/2006 | CN1816900A Manufacturing method of silicon wafer |
| 08/09/2006 | CN1816422A Synthesis of a functionally graded pad for chemical mechaical planarization |
| 08/09/2006 | CN1816251A Method of making printed wiring board and method of forming plating film |
| 08/09/2006 | CN1815696A Chemical-mechanical grinding method |
| 08/09/2006 | CN1815695A Transverse grinding method for semiconductor thin-sheet material |
| 08/09/2006 | CN1814411A Adsorption sheet for fixing polishing substrate and its manufacturing method and polishing device |
| 08/09/2006 | CN1814410A Lapping sheet and its manufacturing method and polishing device |
| 08/09/2006 | CN1268470C Method and apparatus for plating and polishing a semiconductor substrate |
| 08/08/2006 | US7089081 Modeling an abrasive process to achieve controlled material removal |
| 08/08/2006 | US7087530 Aqueous dispersion for chemical mechanical polishing |
| 08/08/2006 | US7087198 Aerosol method and apparatus, particulate products, and electronic devices made therefrom |
| 08/08/2006 | US7086939 Chemical mechanical polishing retaining ring with integral polymer backing |
| 08/08/2006 | US7086933 Flexible polishing fluid delivery system |
| 08/08/2006 | US7086932 Polishing pad |