| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 07/05/2005 | US6913514 Chemical mechanical polishing endpoint detection system and method |
| 07/05/2005 | US6913513 Polishing apparatus |
| 07/05/2005 | US6913511 Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers |
| 07/05/2005 | US6913509 Method and apparatus for polishing, and lapping jig |
| 06/30/2005 | WO2005059970A2 Controlling removal rate uniformity of an electropolishing process in integrated circuit fabrication |
| 06/30/2005 | WO2005058545A1 Retaining ring with slurry transport grooves |
| 06/30/2005 | WO2005058544A1 Device and method for surface working |
| 06/30/2005 | WO2005058543A1 Method of electrochemical chemical mechanical planarization process |
| 06/30/2005 | WO2004084287A9 Material for purification of semiconductor polishing slurry, module for purification of semiconductor polishing slurry and process for producing semiconductor polishing slurry |
| 06/30/2005 | US20050142996 Polishing pad and method of producing same |
| 06/30/2005 | US20050142995 Method of controlling carrier head with multiple chambers |
| 06/30/2005 | US20050142993 Multi-chamber carrier head with a flexible membrane |
| 06/30/2005 | US20050142989 Polishing body, polishing apparatus, semiconductor device, and semiconductor device manufacturing method |
| 06/30/2005 | US20050142988 CMP process using slurry containing abrasive of low concentration |
| 06/30/2005 | US20050142987 Method and system for controlling the chemical mechanical polishing by using a seismic signal of a seismic sensor |
| 06/30/2005 | US20050142882 Semiconductor water manufacturing method and wafer |
| 06/30/2005 | US20050142807 Differential pressure application apparatus for use in polishing layers of semiconductor device structures and method |
| 06/30/2005 | US20050139803 polishes comprising alumina, colloidal silica, anoxidizing agents, water succinic acid and citric or malic acid, used for polishing magnetic disc heads |
| 06/30/2005 | US20050139228 Support system for semiconductor wafers and methods thereof |
| 06/30/2005 | US20050139119 Polishing composition |
| 06/30/2005 | DE10354263A1 Polishing method for multiple semiconductor disks has a number of polishing speeds and polishing-cloths to operate with rotary movements |
| 06/30/2005 | DE10007389B4 Vorrichtung zur Entnahme von Halbleiterscheiben aus Läuferscheiben in einer doppelseitigen Poliermaschine An apparatus for removing semiconductor wafers from the rotor discs in a double-sided polishing machine |
| 06/29/2005 | EP1548076A1 Compositions and methods for low downforce pressure polishing of copper |
| 06/29/2005 | EP1548075A2 Compositons and methods for barrier removal |
| 06/29/2005 | EP1545836A1 Retaining ring for holding semiconductor wafers in a chemical-mechanical polishing device |
| 06/29/2005 | EP1545835A2 Flow control system |
| 06/29/2005 | EP1545832A1 Partial-membrane carrier head |
| 06/29/2005 | CN1633698A Chemical-mechanical polishing slurry and method |
| 06/29/2005 | CN1633486A Process for chemical-mechanical polishing of metal substrates |
| 06/29/2005 | CN1208812C Polishing progress monitoring method and device thereof, polishing device, semiconductor device production method, and semiconductor device |
| 06/28/2005 | US6911662 Chemical-mechanical polishing apparatus and method for controlling the same |
| 06/28/2005 | US6911111 Inline monitoring of pad loading for CuCMP and developing an endpoint technique for cleaning |
| 06/28/2005 | US6911059 Abrasive pad and process for the wet-chemical grinding of a substrate surface |
| 06/28/2005 | US6910954 Method of supplying slurry and a slurry supply apparatus having a mixing unit at a point of use |
| 06/28/2005 | US6910951 The method improves ability to control the planarization process, increased uniformity of the planarized surface produced, reduced cost and increased throughput |
| 06/28/2005 | US6910949 Spherical cap-shaped polishing head in a chemical mechanical polishing apparatus for semiconductor wafers |
| 06/28/2005 | US6910947 Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life |
| 06/28/2005 | US6910944 Method of forming a transparent window in a polishing pad |
| 06/28/2005 | US6910943 Planarization apparatus and method |
| 06/28/2005 | US6910942 Semiconductor wafer chemical-mechanical planarization process monitoring and end-point detection method and apparatus |
| 06/23/2005 | US20050136808 Apparatus, systems, and methods for conditioning chemical-mechanical polishing pads |
| 06/23/2005 | US20050136807 Polishing composition for magnetic disk |
| 06/23/2005 | US20050136806 Apparatus for polishing a semiconductor wafer and method therefor |
| 06/23/2005 | US20050136804 Method for polishing workpiece, polishing apparatus and method for manufacturing semiconductor device |
| 06/23/2005 | US20050136803 Mixture of silicon dioxide, an acid, and water for polishing glass, magnetic disc |
| 06/23/2005 | US20050136800 Polishing endpoint detection system and method using friction sensor |
| 06/23/2005 | US20050136671 Compositions and methods for low downforce pressure polishing of copper |
| 06/23/2005 | US20050136670 Compositions and methods for controlled polishing of copper |
| 06/23/2005 | US20050136669 Slurry for color photoresist planarization |
| 06/23/2005 | US20050133923 Semiconductor device and method for manufacturing the same |
| 06/23/2005 | US20050133379 Electrode immersed in solution configured proximate to conductive layer having a longitudinal dimension extending to edge of wafer; elongated contact electrode configured to receive a potential difference; isolator, voltage supplier |
| 06/23/2005 | US20050133363 Conductive polishing article for electrochemical mechanical polishing |
| 06/23/2005 | US20050132660 Polishing composition |
| 06/23/2005 | US20050132659 Aluminum oxide particles |
| 06/22/2005 | EP1542832A1 Polishing pad with window for planarization |
| 06/22/2005 | EP1542831A1 Polishing pad for planarization |
| 06/22/2005 | CN1630697A Anionic abrasive particles treated with positively charged polyelectrolytes for cmp |
| 06/22/2005 | CN1630045A Compositions and methods for barrier removal |
| 06/22/2005 | CN1629238A Compositions and methods for polishing copper |
| 06/22/2005 | CN1628935A High pressure grinder |
| 06/22/2005 | CN1628934A Method for lapping and a lapping apparatus |
| 06/22/2005 | CN1207374C Grinding oil composition for polishing |
| 06/21/2005 | US6909935 Methods with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wafer |
| 06/21/2005 | US6908860 Method for manufacturing semiconductor device and apparatus for manufacturing thereof |
| 06/21/2005 | US6908512 Temperature-controlled substrate holder for processing in fluids |
| 06/21/2005 | US6908374 Chemical mechanical polishing endpoint detection |
| 06/21/2005 | US6908371 Ultrasonic conditioning device cleaner for chemical mechanical polishing systems |
| 06/21/2005 | US6908370 Rinse apparatus and method for wafer polisher |
| 06/21/2005 | US6908368 Advanced Bi-directional linear polishing system and method |
| 06/21/2005 | US6908366 Method of using a soft subpad for chemical mechanical polishing |
| 06/21/2005 | US6908362 Reel-to-reel substrate tape polishing system |
| 06/16/2005 | WO2005055302A1 Method for manufacturing single-side mirror surface wafer |
| 06/16/2005 | WO2005055301A1 Silicon wafer producing method |
| 06/16/2005 | WO2005053906A1 Method of manufacturing mirrors from joined mirror blanks, x-y interferometer and method of inspecting wafers |
| 06/16/2005 | WO2003074227A3 Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same |
| 06/16/2005 | US20050130566 Slurry distributor for chemical mechanical polishing apparatus and method of using the same |
| 06/16/2005 | US20050130562 Polishing apparatus and method for detecting foreign matter on polishing surface |
| 06/16/2005 | US20050130561 Polishing method and apparatus |
| 06/16/2005 | US20050130386 Method and apparatus for polishing a substrate |
| 06/16/2005 | US20050128490 Apparatus for imaging metrology |
| 06/16/2005 | US20050127027 CMP for corrosion-free CoFe elements for magnetic heads |
| 06/16/2005 | US20050126708 Retaining ring with slurry transport grooves |
| 06/16/2005 | US20050126080 Semiconductor polishing compound, process for its production and polishing method |
| 06/16/2005 | DE10354767A1 Fine grinding machine, to polish semiconductor workpiece surfaces by lapping, has a second tool system with a continuous grinding belt given a mechanical swing movement at the side away from the first tool system |
| 06/15/2005 | EP1542274A1 Protective structure of semiconductor wafer, method for protecting semiconductor wafer, multilayer protective sheet used therein, and method for processing semiconductor wafer |
| 06/15/2005 | EP1542267A1 Method and apparatus for polishing wafer |
| 06/15/2005 | EP1542266A1 Semiconductor abrasive, process for producing the same and method of polishing |
| 06/15/2005 | EP1541653A1 High selectivity colloidal silica slurry |
| 06/15/2005 | EP1541284A1 Planarization method |
| 06/15/2005 | EP1540327A1 System and method for mental residue detection and mapping within a multi-step sequence |
| 06/15/2005 | EP1539423A1 A polishing pad support that improves polishing performance and longevity |
| 06/15/2005 | EP1490898A4 System and method of broad band optical end point detection for film change indication |
| 06/15/2005 | CN2704445Y Grinder of ceramic core internal hole for light-guide fibre connector |
| 06/15/2005 | CN1628374A Polishing pad, polishing device, and polishing method |
| 06/15/2005 | CN1626600A Slurry for CMP, polishing method and method of manufacturing semiconductor device |
| 06/15/2005 | CN1626599A 抛光组合物和抛光方法 Polishing composition and polishing method |
| 06/15/2005 | CN1626316A Chemical mechanical polishing pad having a process-dependent groove configuration |
| 06/15/2005 | CN1626313A Polishing head and polishing apparatus |
| 06/15/2005 | CN1206081C Method for processing disc-shaped workpieces |
| 06/14/2005 | US6905957 Polishing method and polishing apparatus permitting control of polishing time at a high accuracy |