| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 07/21/2005 | US20050155868 Electrolytic processing apparatus and electrolytic processing method |
| 07/21/2005 | US20050155296 Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for chemical mechanical planarization |
| 07/20/2005 | EP1555089A1 Polishing apparatus |
| 07/20/2005 | EP1554098A2 Brazed diamond tools and methods for making the same |
| 07/20/2005 | CN1643662A System and method of broad band optical end point detection for film change indication |
| 07/20/2005 | CN1643660A Tantalum barrier removal solution |
| 07/20/2005 | CN1643658A Double side polishing device for wafer and double side polishing method |
| 07/20/2005 | CN1642692A Polishing pad support that improves polishing performance and longevity |
| 07/20/2005 | CN1640974A 抛光组合物和抛光方法 Polishing composition and polishing method |
| 07/20/2005 | CN1640621A Polishing apparatus |
| 07/20/2005 | CN1211448C Compositions for and methods for reducing/eliminating scratches and defects in silicon dioxide CMP process |
| 07/19/2005 | US6918824 Uniform fluid distribution and exhaust system for a chemical-mechanical planarization device |
| 07/19/2005 | US6918821 Materials and methods for low pressure chemical-mechanical planarization |
| 07/19/2005 | US6918819 Method for defect reduction |
| 07/19/2005 | US6918814 Polishing apparatus |
| 07/14/2005 | US20050153643 Polyelectrolyte dispensing polishing pad |
| 07/14/2005 | US20050153634 Negative poisson's ratio material-containing CMP polishing pad |
| 07/14/2005 | US20050153633 Polishing pad, polishing apparatus, and polishing method |
| 07/14/2005 | US20050153632 Methods of preparing semiconductor workpiece process fluid |
| 07/14/2005 | US20050153631 System and method for monitoring quality control of chemical mechanical polishing pads |
| 07/14/2005 | US20050153561 Chemical mechanical polishing a substrate having a filler layer and a stop layer |
| 07/14/2005 | US20050153560 Performing first and second polishing steps, polishing mixtures used in first and second steps include ceria abrasives of different grain concentrations; polishing rate being changed between steps; dishing is prevented |
| 07/14/2005 | US20050153557 Apparatus and method for treating susbtrates |
| 07/14/2005 | US20050153556 Methods for polishing copper features of semiconductor devices structures |
| 07/14/2005 | US20050150777 Method and system for material removal and planarization |
| 07/14/2005 | US20050150599 Devices and methods for optical endpoint detection during semiconductor wafer polishing |
| 07/14/2005 | US20050150594 Layered support and method for laminating CMP pads |
| 07/14/2005 | US20050150173 Methanol-silica interaction adds colloidal stability to the chemical mechanical polishing (CMP) formulation; acidic pH |
| 07/14/2005 | US20050150172 Resin structure and abrasive grains, wherein a critical surface tension of the resin is within a specified range; for chemical mechanical polishing; polishing efficiency, quality without any slurry |
| 07/14/2005 | DE10255652B4 Schleifkissen, Vorrichtung zum chemisch-mechanischen Polieren und Verfahren zum nasschemischen Schleifen einer Substratoberfläche Abrasive pad, apparatus for chemical mechanical polishing, and wet chemical method of grinding a substrate surface |
| 07/13/2005 | EP1551593A1 Polishing state monitoring apparatus and polishing apparatus and method |
| 07/13/2005 | EP1117506B1 Cmp polishing head with three chambers and method for using the same |
| 07/13/2005 | CN1639848A Polishing pad, lap hole cover, polishing device, polishing method, and method of manufacturing semiconductor device |
| 07/13/2005 | CN1639288A CMP formulations for the use on nickel-phosphorus alloys |
| 07/13/2005 | CN1639034A Reinforced chemical mechanical planarization belt |
| 07/13/2005 | CN1638919A Improved method and apparatus for bi-directionally polishing a workpiece |
| 07/13/2005 | CN1638057A Pneumatic diaphragm head having independent retaining ring and multi-region pressure control, and method to use the same |
| 07/13/2005 | CN1638056A 抛光垫 Polishing pad |
| 07/13/2005 | CN1637110A High selectivity colloidal silica slurry |
| 07/13/2005 | CN1637102A Slurry compositions and CMP methods using the same |
| 07/13/2005 | CN1637101A 抛光组合物和抛光方法 Polishing composition and polishing method |
| 07/13/2005 | CN1637100A Compositions and methods for chemical mechanical polishing silica and silicon nitride |
| 07/13/2005 | CN1636845A Stabilizing substrate carriers during overhead transport |
| 07/13/2005 | CN1210767C Chemical solution conveying device and method for preparing suspension liquid |
| 07/12/2005 | US6916525 Method of using films having optimized optical properties for chemical mechanical polishing endpoint detection |
| 07/12/2005 | US6916234 Polishing machine |
| 07/12/2005 | US6916233 Polishing and cleaning compound device |
| 07/12/2005 | US6916231 Polishing apparatus |
| 07/12/2005 | US6916228 Wafer holding plate for wafer grinding apparatus and method for manufacturing the same |
| 07/12/2005 | US6916227 Method and apparatus for processing sliders for use in disk drives and the like |
| 07/12/2005 | US6916226 Chemical mechanical polishing apparatus having a stepped retaining ring and method for use thereof |
| 07/12/2005 | US6916225 Monitor, method of monitoring, polishing device, and method of manufacturing semiconductor wafer |
| 07/07/2005 | WO2005061178A1 Chemical mechanical polishing method for reducing slurry reflux |
| 07/07/2005 | WO2005061177A1 Pad assembly for electrochemical mechanical processing |
| 07/07/2005 | WO2004111314B1 Algorithm for real-time process control of electro-polishing |
| 07/07/2005 | US20050148291 Silicon dioxide, alkaline compound and water; fine finishing glass substrates; easy removal after use; recording media |
| 07/07/2005 | US20050148289 Micromachining by chemical mechanical polishing |
| 07/07/2005 | US20050148187 Chemical mechanical polishing systems and methods for their use |
| 07/07/2005 | US20050148185 Polishing cloth and method of manufacturing semiconductor device |
| 07/07/2005 | US20050148183 Polishing pad, platen hole cover, polishing apparatus, polishing method, and method for fabricating semiconductor device |
| 07/07/2005 | US20050148182 Compositions for planarization of metal-containing surfaces using halogens and halide salts |
| 07/07/2005 | US20050148181 Method for producing a silicon wafer |
| 07/07/2005 | US20050147752 Small particle size, narrow size distribution and a spherical morphology; spray pyrolysis |
| 07/07/2005 | US20050146728 In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization |
| 07/07/2005 | US20050145879 Nitride semiconductor wafer and method of processing nitride semiconductor wafer |
| 07/07/2005 | US20050145507 Amines, amides, carboxylate, dicarboxylate or tri-carboxylate groups containing chelating agents, a substituted or unsubstituted benzotriazole or a polymeric corrosion resistance agent, sodium hydroxide or ammonium hydroxide as pH adjuster, a solvent |
| 07/07/2005 | US20050145484 Apparatus for avoiding particle accumulation in electrochemical processing |
| 07/07/2005 | US20050145464 Stabilizing substrate carriers during overhead transport |
| 07/06/2005 | EP1550152A1 Method and apparatus for applying differential removal rates to a surface of a substrate |
| 07/06/2005 | EP1549465A1 Methods and systems for controlling belt surface temperature and slurry temperature in linear chemical mechanical planarization |
| 07/06/2005 | EP1549464A2 Retaining ring for holding semiconductor wafers in a chemical-mechanical polishing device |
| 07/06/2005 | EP1349700A4 Method of making optical fluoride laser crystal components |
| 07/06/2005 | CN1636272A Method for preventing damage to wafers in a sequential multiple steps polishing process |
| 07/06/2005 | CN1636270A Methods for planarization of group VIII metal-containing surfaces using oxidizing gases |
| 07/06/2005 | CN1636046A Abrasive particles and methods of making and using the same |
| 07/06/2005 | CN1635940A 抛光组合物 The polishing composition |
| 07/06/2005 | CN1634680A Chemical and mechanical grinding method for aluminium |
| 07/06/2005 | CN1209436C Polishing composition and magnetic recording disk substrate polished with polishing composition |
| 07/06/2005 | CN1209431C Method for polishing a memory or rigid disk with an amino acid-containing composition |
| 07/06/2005 | CN1209430C Chemical mechanical polishing systems and methods for their use |
| 07/06/2005 | CN1209429C CMP composition containing silane modified abrasive particles |
| 07/06/2005 | CN1209321C Porous ceramic and method for prepartion thereof and microstrip substrate |
| 07/06/2005 | CN1209229C Weldless grinding device for chemical and mechanical grinding and method for producing grinding pad |
| 07/06/2005 | CN1209228C Polishing platen with pressurized membrane |
| 07/05/2005 | US6914337 Calibration wafer and kit |
| 07/05/2005 | US6914001 A CMP oxide slurry includes an aqueous solution containing abrasive particles and two or more different passivation agents. Preferably, the aqueous solution is made up of deionized water, and the abrasive particles are a metal oxide |
| 07/05/2005 | US6914000 Polishing method, polishing system and process-managing system |
| 07/05/2005 | US6913669 Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus |
| 07/05/2005 | US6913634 Abrasives for copper CMP and methods for making |
| 07/05/2005 | US6913528 Low amplitude, high speed polisher and method |
| 07/05/2005 | US6913527 Edge-sealed pad for CMP process |
| 07/05/2005 | US6913525 CMP device and production method for semiconductor device |
| 07/05/2005 | US6913523 Method for controlling pH during planarization and cleaning of microelectronic substrates |
| 07/05/2005 | US6913521 Methods using active retainer rings for improving edge performance in CMP applications |
| 07/05/2005 | US6913520 All-in-one polishing process for a semiconductor wafer |
| 07/05/2005 | US6913519 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates |
| 07/05/2005 | US6913518 Profile control platen |
| 07/05/2005 | US6913517 Microporous polishing pads |
| 07/05/2005 | US6913516 Dummy process and polishing-pad conditioning process for chemical mechanical polishing apparatus |
| 07/05/2005 | US6913515 System and apparatus for achieving very high crown-to-camber ratios on magnetic sliders |