Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
06/2006
06/15/2006US20060124595 Method of polishing film to be polished
06/15/2006US20060124591 Cerium oxide, acetylene compound, and water; flattening dielectrics; semiconductors
06/15/2006US20060124474 Method and apparatus for local polishing control
06/14/2006EP1670047A1 Polishing composition and polishing method
06/14/2006EP1667816A1 Polishing pad with recessed window
06/14/2006CN1788070A Polishing fluid for metal and polishing Method
06/14/2006CN1787966A Silica and silica-based slurry
06/14/2006CN1787181A Method for processing chip capable of improving semiconductor chip geometric parameter
06/13/2006US7060621 Slurry for CMP, polishing method and method of manufacturing semiconductor device
06/13/2006US7060620 Method of preparing a surface of a semiconductor wafer to make it epiready
06/13/2006US7060606 Method and apparatus for chemical mechanical polishing of semiconductor substrates
06/13/2006US7059951 Polishing pad, method of manufacturing glass substrate for use in data recording medium using the pad, and glass substrate for use in data recording medium obtained by using the method
06/13/2006US7059948 Articles for polishing semiconductor substrates
06/13/2006US7059943 Method and apparatus for recycling slurry
06/13/2006US7059937 Systems including differential pressure application apparatus
06/13/2006US7059936 Low surface energy CMP pad
06/08/2006WO2006059627A1 Slurry for chemical mechanical polishing, composite particle having inorganic particle coating, method for preparation thereof, chemical mechanical polishing method and method for manufacturing electronic device
06/08/2006WO2006059537A1 Process for producing abrasive material, abrasive material produced by the same, and process for producing silicon wafer
06/08/2006WO2006022452A3 Polishing apparatus and polishing method
06/08/2006US20060122287 Polyol composition of the two-part system for foam grindstone, two-part curable composition for foam grindstone, foam grindstone, and process for production thereof
06/08/2006US20060121835 Polishing method
06/08/2006US20060121632 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
06/08/2006US20060118525 Apparatus and method for reducing removal forces for CMP pads
06/08/2006US20060118524 Cerium oxide abrasive and method of polishing substrates
06/07/2006EP1666202A1 Polishing cloth, polishing cloth processing method, and substrate manufacturing method using same
06/07/2006EP1665335A1 Eddy current system for in-situ profile measurement
06/07/2006EP1663576A1 Polished state monitoring apparatus and polishing apparatus using the same
06/07/2006CN1784719A Method of texture processing on glass substrate for magnetic hard disk and slurry therefor
06/07/2006CN1782014A Polishing composition and polishing method using said composition
06/07/2006CN1782013A Polishing composition for a semiconductor substrate
06/07/2006CN1781971A Polishing composition
06/07/2006CN1781665A Rolling slide member
06/07/2006CN1258433C Wafer carrier with groove for decoupling retainer ring from wafer
06/07/2006CN1258432C Projected gimbal point drive
06/06/2006US7057744 Method and apparatus for measuring thickness of thin film and device manufacturing method using same
06/06/2006US7056829 Polishing composition for semiconductor wafers
06/06/2006US7056196 Wafer polisher
06/06/2006US7056194 Semiconductor processing methods of removing conductive material
06/06/2006US7055376 Method and a pump apparatus for the generation of an adjustable, substantially constant volume flow of a fluid and a use of this method
06/06/2006US7055229 Support system for semiconductor wafers and methods thereof
06/01/2006WO2005072338A3 Multi-step pad conditioningh system and method for chemical planarization
06/01/2006US20060116059 Fiber embedded polishing pad
06/01/2006US20060116057 Method and apparatus for cleaning a web-based chemical mechanical planarization system
06/01/2006US20060116056 Apparatus and methods for polishing a semiconductor wafer
06/01/2006US20060116054 Polishing body
06/01/2006US20060116051 Polishing pad with built-in optical sensor
06/01/2006US20060115973 Metal polishing composition and method of polishing using the same
06/01/2006US20060113705 Method of manufacturing polishing pad
06/01/2006US20060113283 Polishing composition for a semiconductor substrate
06/01/2006US20060113036 Computer integrated manufacturing control system for oxide chemical mechanical polishing
06/01/2006US20060112647 Polishing composition
05/2006
05/31/2006EP1661961A2 Metal polishing composition and method of polishing using the same
05/31/2006EP1661665A1 Viscoelastic polisher and polishing method using the same
05/31/2006EP1660606A1 Abrasive particles for chemical mechanical polishing
05/31/2006EP1381491B1 Conductive polishing article for electrochemical mechanical polishing
05/31/2006CN1781186A Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor wafer
05/30/2006US7054719 System and method for point of use delivery, control and mixing chemical and slurry for CMP/cleaning system
05/30/2006US7052995 Process of manufacturing semiconductor device including chemical-mechanical polishing
05/30/2006US7052920 Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same
05/30/2006US7052620 Polishing slurry for aluminum-based metal, and method of manufacturing semiconductor device
05/30/2006US7052522 Polishing composition and polishing method using the same
05/30/2006US7052377 Apparatus and method for feeding slurry
05/30/2006US7052375 Method of making carrier head backing plate having low-friction coating
05/30/2006US7052374 Multipurpose slurry delivery arm for chemical mechanical polishing
05/30/2006US7052372 Chemical-mechanical polisher hardware design
05/30/2006US7052369 Methods and systems for detecting a presence of blobs on a specimen during a polishing process
05/30/2006US7052368 Polishing pad for chemical mechanical polishing apparatus
05/30/2006US7052367 Polishing apparatus
05/30/2006US7052365 Semiconductor wafer chemical-mechanical planarization process monitoring and end-point detection method and apparatus
05/30/2006US7052364 Real time polishing process monitoring
05/30/2006US7052363 Method and apparatus for treating the surface of a media, such as a magnetic hard disk, while operating, such as during dynamic electrical testing
05/30/2006US7051742 Removing photoresists and etching residues; using solvents; water and chelate compound; heating; controlling temperature
05/26/2006WO2006054732A2 Polishing apparatus and polishing method
05/24/2006DE19960458B4 Vorrichtung zum Polieren von Scheiben An apparatus for polishing wafers
05/24/2006CN1777979A CMP polishing method and method for manufacturing semiconductor device
05/23/2006US7049237 Methods for planarization of Group VIII metal-containing surfaces using oxidizing gases
05/23/2006US7048615 Pad backer and CMP process using the same
05/23/2006US7048612 Method of chemical mechanical polishing
05/23/2006US7048609 Pressure control system and polishing apparatus
05/23/2006US7048607 System and method for chemical mechanical planarization
05/18/2006WO2006053057A1 Electronic die positioning device and method
05/18/2006WO2006051243A1 Method and device for measuring semiconductor plates
05/18/2006US20060105685 System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
05/18/2006US20060105679 Substrate polishing apparatus
05/18/2006US20060105678 Polishing apparatus and polishing method
05/18/2006DE10202701B4 Vorrichtung zum Polieren eines Wafers An apparatus for polishing a wafer
05/18/2006DE10131668B4 Verfahren zur abrasiven Bearbeitung von Oberflächen, auf Halbleiter-Wafern A method for the abrasive machining of surfaces on semiconductor wafers
05/18/2006DE10065380B4 Verfahren zur Charakterisierung und Simulation eines chemisch-mechanischen Polier-Prozesses A method for characterizing and simulation of a chemical mechanical polishing process
05/17/2006EP1657023A1 Grinding jig set and grinding method
05/17/2006EP1412131A4 Method for fabricating polishing pad using laser beam and mask
05/17/2006EP0985007B1 Oxygen-containing phosphor powders, methods for making phosphor powders and devices incorporating same
05/17/2006CN2780407Y Fixed ring on carrier head in polishing device used for chemical machinery
05/17/2006CN1774316A Materials and methods for chemical-mechanical planarization
05/17/2006CN1772437A Grinding process
05/17/2006CN1772433A A grinding jig set and a method for grinding a number of objects
05/16/2006US7047099 Integrating tool, module, and fab level control
05/16/2006US7046001 Frequency measuring device, polishing device using the same and eddy current sensor
05/16/2006US7044838 Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
05/16/2006US7044833 Apparatus for transporting and polishing wafers
05/16/2006US7044832 Load cup for chemical mechanical polishing