Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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06/15/2006 | US20060124595 Method of polishing film to be polished |
06/15/2006 | US20060124591 Cerium oxide, acetylene compound, and water; flattening dielectrics; semiconductors |
06/15/2006 | US20060124474 Method and apparatus for local polishing control |
06/14/2006 | EP1670047A1 Polishing composition and polishing method |
06/14/2006 | EP1667816A1 Polishing pad with recessed window |
06/14/2006 | CN1788070A Polishing fluid for metal and polishing Method |
06/14/2006 | CN1787966A Silica and silica-based slurry |
06/14/2006 | CN1787181A Method for processing chip capable of improving semiconductor chip geometric parameter |
06/13/2006 | US7060621 Slurry for CMP, polishing method and method of manufacturing semiconductor device |
06/13/2006 | US7060620 Method of preparing a surface of a semiconductor wafer to make it epiready |
06/13/2006 | US7060606 Method and apparatus for chemical mechanical polishing of semiconductor substrates |
06/13/2006 | US7059951 Polishing pad, method of manufacturing glass substrate for use in data recording medium using the pad, and glass substrate for use in data recording medium obtained by using the method |
06/13/2006 | US7059948 Articles for polishing semiconductor substrates |
06/13/2006 | US7059943 Method and apparatus for recycling slurry |
06/13/2006 | US7059937 Systems including differential pressure application apparatus |
06/13/2006 | US7059936 Low surface energy CMP pad |
06/08/2006 | WO2006059627A1 Slurry for chemical mechanical polishing, composite particle having inorganic particle coating, method for preparation thereof, chemical mechanical polishing method and method for manufacturing electronic device |
06/08/2006 | WO2006059537A1 Process for producing abrasive material, abrasive material produced by the same, and process for producing silicon wafer |
06/08/2006 | WO2006022452A3 Polishing apparatus and polishing method |
06/08/2006 | US20060122287 Polyol composition of the two-part system for foam grindstone, two-part curable composition for foam grindstone, foam grindstone, and process for production thereof |
06/08/2006 | US20060121835 Polishing method |
06/08/2006 | US20060121632 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
06/08/2006 | US20060118525 Apparatus and method for reducing removal forces for CMP pads |
06/08/2006 | US20060118524 Cerium oxide abrasive and method of polishing substrates |
06/07/2006 | EP1666202A1 Polishing cloth, polishing cloth processing method, and substrate manufacturing method using same |
06/07/2006 | EP1665335A1 Eddy current system for in-situ profile measurement |
06/07/2006 | EP1663576A1 Polished state monitoring apparatus and polishing apparatus using the same |
06/07/2006 | CN1784719A Method of texture processing on glass substrate for magnetic hard disk and slurry therefor |
06/07/2006 | CN1782014A Polishing composition and polishing method using said composition |
06/07/2006 | CN1782013A Polishing composition for a semiconductor substrate |
06/07/2006 | CN1781971A Polishing composition |
06/07/2006 | CN1781665A Rolling slide member |
06/07/2006 | CN1258433C Wafer carrier with groove for decoupling retainer ring from wafer |
06/07/2006 | CN1258432C Projected gimbal point drive |
06/06/2006 | US7057744 Method and apparatus for measuring thickness of thin film and device manufacturing method using same |
06/06/2006 | US7056829 Polishing composition for semiconductor wafers |
06/06/2006 | US7056196 Wafer polisher |
06/06/2006 | US7056194 Semiconductor processing methods of removing conductive material |
06/06/2006 | US7055376 Method and a pump apparatus for the generation of an adjustable, substantially constant volume flow of a fluid and a use of this method |
06/06/2006 | US7055229 Support system for semiconductor wafers and methods thereof |
06/01/2006 | WO2005072338A3 Multi-step pad conditioningh system and method for chemical planarization |
06/01/2006 | US20060116059 Fiber embedded polishing pad |
06/01/2006 | US20060116057 Method and apparatus for cleaning a web-based chemical mechanical planarization system |
06/01/2006 | US20060116056 Apparatus and methods for polishing a semiconductor wafer |
06/01/2006 | US20060116054 Polishing body |
06/01/2006 | US20060116051 Polishing pad with built-in optical sensor |
06/01/2006 | US20060115973 Metal polishing composition and method of polishing using the same |
06/01/2006 | US20060113705 Method of manufacturing polishing pad |
06/01/2006 | US20060113283 Polishing composition for a semiconductor substrate |
06/01/2006 | US20060113036 Computer integrated manufacturing control system for oxide chemical mechanical polishing |
06/01/2006 | US20060112647 Polishing composition |
05/31/2006 | EP1661961A2 Metal polishing composition and method of polishing using the same |
05/31/2006 | EP1661665A1 Viscoelastic polisher and polishing method using the same |
05/31/2006 | EP1660606A1 Abrasive particles for chemical mechanical polishing |
05/31/2006 | EP1381491B1 Conductive polishing article for electrochemical mechanical polishing |
05/31/2006 | CN1781186A Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor wafer |
05/30/2006 | US7054719 System and method for point of use delivery, control and mixing chemical and slurry for CMP/cleaning system |
05/30/2006 | US7052995 Process of manufacturing semiconductor device including chemical-mechanical polishing |
05/30/2006 | US7052920 Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same |
05/30/2006 | US7052620 Polishing slurry for aluminum-based metal, and method of manufacturing semiconductor device |
05/30/2006 | US7052522 Polishing composition and polishing method using the same |
05/30/2006 | US7052377 Apparatus and method for feeding slurry |
05/30/2006 | US7052375 Method of making carrier head backing plate having low-friction coating |
05/30/2006 | US7052374 Multipurpose slurry delivery arm for chemical mechanical polishing |
05/30/2006 | US7052372 Chemical-mechanical polisher hardware design |
05/30/2006 | US7052369 Methods and systems for detecting a presence of blobs on a specimen during a polishing process |
05/30/2006 | US7052368 Polishing pad for chemical mechanical polishing apparatus |
05/30/2006 | US7052367 Polishing apparatus |
05/30/2006 | US7052365 Semiconductor wafer chemical-mechanical planarization process monitoring and end-point detection method and apparatus |
05/30/2006 | US7052364 Real time polishing process monitoring |
05/30/2006 | US7052363 Method and apparatus for treating the surface of a media, such as a magnetic hard disk, while operating, such as during dynamic electrical testing |
05/30/2006 | US7051742 Removing photoresists and etching residues; using solvents; water and chelate compound; heating; controlling temperature |
05/26/2006 | WO2006054732A2 Polishing apparatus and polishing method |
05/24/2006 | DE19960458B4 Vorrichtung zum Polieren von Scheiben An apparatus for polishing wafers |
05/24/2006 | CN1777979A CMP polishing method and method for manufacturing semiconductor device |
05/23/2006 | US7049237 Methods for planarization of Group VIII metal-containing surfaces using oxidizing gases |
05/23/2006 | US7048615 Pad backer and CMP process using the same |
05/23/2006 | US7048612 Method of chemical mechanical polishing |
05/23/2006 | US7048609 Pressure control system and polishing apparatus |
05/23/2006 | US7048607 System and method for chemical mechanical planarization |
05/18/2006 | WO2006053057A1 Electronic die positioning device and method |
05/18/2006 | WO2006051243A1 Method and device for measuring semiconductor plates |
05/18/2006 | US20060105685 System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control |
05/18/2006 | US20060105679 Substrate polishing apparatus |
05/18/2006 | US20060105678 Polishing apparatus and polishing method |
05/18/2006 | DE10202701B4 Vorrichtung zum Polieren eines Wafers An apparatus for polishing a wafer |
05/18/2006 | DE10131668B4 Verfahren zur abrasiven Bearbeitung von Oberflächen, auf Halbleiter-Wafern A method for the abrasive machining of surfaces on semiconductor wafers |
05/18/2006 | DE10065380B4 Verfahren zur Charakterisierung und Simulation eines chemisch-mechanischen Polier-Prozesses A method for characterizing and simulation of a chemical mechanical polishing process |
05/17/2006 | EP1657023A1 Grinding jig set and grinding method |
05/17/2006 | EP1412131A4 Method for fabricating polishing pad using laser beam and mask |
05/17/2006 | EP0985007B1 Oxygen-containing phosphor powders, methods for making phosphor powders and devices incorporating same |
05/17/2006 | CN2780407Y Fixed ring on carrier head in polishing device used for chemical machinery |
05/17/2006 | CN1774316A Materials and methods for chemical-mechanical planarization |
05/17/2006 | CN1772437A Grinding process |
05/17/2006 | CN1772433A A grinding jig set and a method for grinding a number of objects |
05/16/2006 | US7047099 Integrating tool, module, and fab level control |
05/16/2006 | US7046001 Frequency measuring device, polishing device using the same and eddy current sensor |
05/16/2006 | US7044838 Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring |
05/16/2006 | US7044833 Apparatus for transporting and polishing wafers |
05/16/2006 | US7044832 Load cup for chemical mechanical polishing |