B24B 37 - Lapping machines or devices; Accessories

Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
11/2006
11/29/2006	CN2841245Y Two-part fixing-ring
11/29/2006	CN2841244Y Holding ring with flange for chemical machinery polishing
11/29/2006	CN1870244A Method for reducing saucerization and etching of conductor structure in chemical mechanical lapping
11/29/2006	CN1868675A Ultrafine fiber polishing sheet and its manufacturing method
11/29/2006	CN1868674A Method of surface treatment, crystal substrate, and semiconductor device
11/29/2006	CN1868670A Mending method of poard-shaped cut component surface
11/28/2006	US7141155 Polishing article for electro-chemical mechanical polishing
11/28/2006	US7141146 Means to improve center to edge uniformity of electrochemical mechanical processing of workpiece surface
11/28/2006	US7140955 Polishing apparatus
11/28/2006	US7140088 Turning tool for grooving polishing pad, apparatus and method of producing polishing pad using the tool, and polishing pad produced by using the tool
11/23/2006	WO2006123562A1 Process for producing composition for polishing
11/23/2006	WO2006123559A1 Polishing pad
11/23/2006	WO2006123463A1 Polishing pad, process for producing the same, and process for producing semiconductor device using said polishing pad
11/23/2006	WO2006081589A3 Tungsten electroprocessing
11/23/2006	US20060264158 Apparatus for polishing wafer and process for polishing wafer
11/23/2006	US20060264157 Wafer polishing apparatus and method for polishing wafers
11/23/2006	US20060264052 Method of forming a platinum pattern
11/23/2006	US20060263909 Methods of fabricating thin ferroelectric layers and capacitors having ferroelectric dielectric layers therein
11/23/2006	US20060261041 Method for manufacturing metal line contact plug of semiconductor device
11/22/2006	EP1724819A1 Polishing agent and polishing method
11/22/2006	EP1724062A1 Apparatus for polishing wafer and process for polishing wafer
11/22/2006	EP1722926A1 Undulated pad conditioner and method of using same
11/22/2006	EP1722925A1 Insulated pad conditioner and method of using same
11/22/2006	CN1867424A Polishing apparatus
11/22/2006	CN1864929A Chemical mechanical polishing pad and method
11/22/2006	CN1864928A Stirring mill
11/22/2006	CN1285979C Automatic control device and method for grinding slurry feed arm
11/22/2006	CN1285686C 抛光组合物 The polishing composition
11/22/2006	CN1285634C Polyurethane composition and polishing pad
11/22/2006	CN1285457C Making process of grinding pad with detection window
11/21/2006	US7138073 Slurry for chemical mechanical polishing for copper and method of manufacturing semiconductor device using the slurry
11/21/2006	US7138072 making lubricating polishing solution by mixing nonabrasive solutions containing water and ammonia, with homopolymers and copolymers of acrylic acid crosslinked with polyoxyalkylene glycols
11/21/2006	US7137879 Conductive polishing article for electrochemical mechanical polishing
11/21/2006	US7137874 Semiconductor wafer, polishing apparatus and method
11/21/2006	US7137868 Pad assembly for electrochemical mechanical processing
11/21/2006	US7137867 Thickness control method and double side polisher
11/21/2006	US7137866 Polishing apparatus and method for producing semiconductors using the apparatus
11/16/2006	WO2006119709A1 Composition for removing photoresist layer and method for using it
11/16/2006	US20060258277 Single-layer polishing pad and method of producing the same
11/16/2006	US20060258273 Process for producing improved membranes
11/16/2006	US20060258268 Manufacturing method for semiconductor wafers, slicing method for slicing work and wire saw used for the same
11/16/2006	US20060258267 Polishing composition and polishing method using same
11/16/2006	US20060257659 Small particle size, narrow particle size distribution, spherical morphology and good crystallinity; for making electroluminescent display devices
11/16/2006	US20060255016 Method for polishing copper on a workpiece surface
11/16/2006	US20060255015 Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for chemical mechanical planarization
11/16/2006	DE112004002610T5 Haltesystem für Halbleiterwafer und Verfahren davon Holding system for semiconductor wafer and method thereof
11/15/2006	EP1205965B1 Use of cmp abrasive
11/15/2006	CN1863644A Polishing pad for chemical mechanical polishing
11/15/2006	CN1862391A Composition of removing photoresistance layer and use method thereof
11/15/2006	CN1861322A Five-purpose grinder
11/15/2006	CN1284838C CMP formulations for the use on nickel-phosphorus alloys
11/14/2006	US7134952 Polishing cloth
11/14/2006	US7134947 Chemical mechanical polishing system
11/14/2006	US7134944 Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces
11/14/2006	US7134939 Method for reducing wear of mechanically interacting surfaces
11/09/2006	US20060252358 Polishing pad and method of making same
11/09/2006	US20060252350 Chemical mechanical polishing system and process
11/09/2006	US20060248804 Abrasive, method of polishing target member and process for producing semiconductor device
11/08/2006	EP1719161A1 Polishing apparatus and substrate processing apparatus
11/08/2006	EP1421610B1 Slurry composition for use in chemical mechanical polishing of metal wiring
11/08/2006	EP1299489B1 Cmp polishing composition for metal
11/08/2006	CN1860592A Polishing composition and polishing method
11/08/2006	CN1860584A Eddy current system for in-situ profile measurement
11/08/2006	CN1860019A Working surface and system for production thereof
11/08/2006	CN1859998A Method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner
11/08/2006	CN1284210C Chemical mechanical polishing pad having wave shaped grooves
11/07/2006	US7132367 Polishing method
11/07/2006	US7132070 Method of manufacturing polishing pad
11/07/2006	US7132058 Tungsten polishing solution
11/07/2006	US7132035 Methods, apparatuses, and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes
11/07/2006	US7132033 Method of forming a layered polishing pad
11/07/2006	US7131901 Polishing pad and fabricating method thereof
11/07/2006	US7131892 Wafer carrier with pressurized membrane and retaining ring actuator
11/07/2006	US7131891 Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces
11/07/2006	US7131889 Method for planarizing microelectronic workpieces
11/02/2006	WO2006115924A1 Multi-layer polishing pad material for cmp
11/02/2006	WO2006115581A2 Composition and method for polishing a sapphire surface
11/02/2006	WO2006115277A1 Wafer transfer apparatus, polishing apparatus and wafer receiving method
11/02/2006	WO2006115039A1 Carrier for double side polishing apparatus, and double side polishing apparatus and double side polishing method using such carrier
11/02/2006	WO2006114854A1 Retainer ring for cmp device, method of manufacturing the same, and cmp device
11/02/2006	US20060246822 System and method for in-line metal profile measurement
11/02/2006	US20060246821 Method for controlling polishing fluid distribution
11/02/2006	US20060246724 Method for polishing wafer
11/02/2006	US20060246723 Slurry composition for chemical mechanical polishing, method for planarization of surface of semiconductor element using the same, and method for controlling selection ratio of slurry composition
11/02/2006	US20060245138 Perforated plate for water chuck
11/02/2006	US20060243702 chemical mechanical polishing (CMP) copper films via slurry of polyvinylpyrrolidone, oxidizing agent, protective film-forming agent containing complexing agent (containing quinaldinic acid, quinolinic acid, and alkylbenzene sulfonate) for forming water-insoluble complex, and colloidal sol
11/02/2006	US20060242912 Slurry composition for secondary polishing of silicon wafer
11/02/2006	EP1717286A1 Method of surface treatment of group III nitride crystal film, group III nitride crystal substrate, group III nitride crystal substrate with epitaxial layer, and semiconductor device
11/02/2006	EP1717001A1 Method for manufacturing semiconductor wafers, method for their slicing and wire saw used for the same
11/02/2006	EP1716193A1 Polyurethane polishing pad
11/02/2006	EP1715980A1 Base pad polishing pad and multi-layer pad comprising the same
11/02/2006	EP1715979A2 Multi-step, in-situ pad conditioning system and method for chemical mechanical planarization
11/02/2006	EP1295322B1 Two steps chemical mechanical polishing process
11/02/2006	DE19815837B4 Läpp-Aufspannvorrichtung Lapping fixture
11/02/2006	CA2599401A1 Composition and method for polishing a sapphire surface
11/01/2006	CN1855380A Chemical machinery polisher
11/01/2006	CN1854225A Cmp slurry for metal film, polishing method and method for manufacturing semiconductor
11/01/2006	CN1853858A Circular-hole internal-wall polishing technology and its special tool
10/2006
10/31/2006	US7130038 Method and apparatus for optical film measurements in a controlled environment
10/31/2006	US7128852 Producing large quantities of a high quality, dense aerosol for spray pyrolysis operations; multi-phase particles for use in manufacturing electrically-conductive metallic films for electronic products

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