Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
07/2006
07/11/2006US7074114 Carrier assemblies, polishing machines including carrier assemblies, and methods for polishing micro-device workpieces
07/06/2006WO2006071651A2 Spectral imaging of substrates
07/06/2006WO2006070629A1 Polishing pad
07/06/2006WO2006070607A1 Silicon wafer polishing method and silicon wafer producing method, apparatus for polishing disc-like work and silicon wafer
07/06/2006US20060148667 Cmp polishing compound and polishing method
07/06/2006US20060148393 Polishing pad and cushion layer for polishing pad
07/06/2006US20060148392 Method of producing polishing pad
07/06/2006US20060148391 Polishing pad and cushion layer for polishing pad
07/06/2006US20060148387 Vibration damping in chemical mechanical polishing system
07/06/2006US20060148384 Polishing apparatus, method of manufacturing semiconductor device using the same, and semiconductor device manufactured by this method
07/06/2006US20060148383 Methods and systems for detecting a presence of blobs on a specimen during a polishing process
07/06/2006US20060148382 Polishing apparatus
07/06/2006US20060148381 Pad assembly for electrochemical mechanical processing
07/06/2006US20060148374 Transmitter for wireless control
07/06/2006US20060148261 Methods and apparatus for polishing control
07/06/2006US20060144825 Dual reduced agents for barrier removal in chemical mechanical polishing
07/06/2006DE112004001568T5 Polierzusammensetzung und Polierverfahren unter Verwendung derselben Polishing composition and polishing method using the same
07/05/2006EP1676673A1 Attitude control device and precision machining apparatus comprising same
07/05/2006EP1676672A1 Wafer-retaining carrier, double side-grinding device using the same, and double side-grinding method for wafer
07/05/2006EP1448340B1 Assembly system for stationing semiconductor wafer and process for manufactoring semiconductor wafer
07/05/2006CN1799090A Substrate for a stamper and preparing method for a substrate for a stamper
07/05/2006CN1796482A Composition for selectively polishing silicon nitride layer and polishing method employing it
07/05/2006CN1796050A Tools for grinding samples of detection for electron microscope
07/05/2006CN1796047A Attitude control device and precision machining apparatus comprising same
07/05/2006CN1263100C Wafer cleaning module and method for cleaning the surface of a substrate
07/05/2006CN1263099C Chemically machinery polishing serum
07/05/2006CN1263087C Infrared end-point detecting system
07/05/2006CN1262766C Pump device and method for generating adjustable constant fluid volume flow and its application
07/05/2006CN1262392C Process of grinding
07/04/2006US7072050 Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus
07/04/2006US7071108 Chemical mechanical polishing slurry containing abrasive particles exhibiting photocatalytic function
07/04/2006US7071106 Method for CMP removal rate compensation
07/04/2006US7070490 Vacuum suction membrane for holding silicon wafer
07/04/2006US7070486 Polishing apparatus and method of polishing work piece
07/04/2006US7070485 Polishing composition
07/04/2006US7070484 Pad break-in method for chemical mechanical polishing tool which polishes with ceria-based slurry
07/04/2006US7070480 Method and apparatus for polishing substrates
07/04/2006US7070479 Arrangement and method for conditioning a polishing pad
07/04/2006US7070478 Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces
07/04/2006US7070477 Method of polishing semiconductor wafer
07/04/2006US7070475 Process control in electrochemically assisted planarization
07/04/2006US7069988 Flow completion system
06/2006
06/29/2006WO2006068328A1 Polishing composition and polishing method
06/29/2006WO2006031366A3 Full sequence metal and barrier layer electrochemical mechanical processing
06/29/2006US20060141910 Methods and systems for conditioning polishing pads
06/29/2006US20060138368 Apparatus and method for inspecting semiconductor wafers for metal residue
06/29/2006US20060137170 Turning tool for grooving polishing pad, apparatus and method of producing polishing pad using the tool, and polishing pad produced by using the tool
06/29/2006DE102004062799A1 Kunststoffmaterial zur Herstellung von Halteringen Plastic material for the production of retaining rings
06/28/2006EP1673201A1 Polishing apparatus
06/28/2006CN2791878Y Surface figuring machine for high power semiconductor element
06/28/2006CN2790672Y Steel plate surface grinding machine
06/28/2006CN1795545A Production method for semiconductor wafer
06/28/2006CN1795543A Abrasive and method of polishing
06/28/2006CN1795075A Viscoelastic polisher and polishing method using the same
06/28/2006CN1792554A Method for preparing grinding dish of photosensitive resin binding agent
06/28/2006CN1792553A Finishing Apparatus of polishing pat and finishing method
06/28/2006CN1792552A System and method for identifying changing of workpiece parameter
06/28/2006CN1792551A Automatic grinding device and control system thereof
06/28/2006CN1261983C Chemical mechanical polishing pad having holes and or grooves
06/28/2006CN1261520C Grinding composition and its grinding method
06/28/2006CN1261511C Chemical mechanical polishing compositions and method relating thereto
06/27/2006US7067070 Electroluminescent phosphor powders, methods for making phosphor powders, and devices incorporating same
06/27/2006US7066800 Conductive polishing article for electrochemical mechanical polishing
06/27/2006US7066791 Method and apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane
06/27/2006US7066790 Chemical-mechanical polishing methods
06/27/2006US7066788 Electronic die positioning device and method
06/27/2006US7066785 Polishing apparatus and related polishing methods
06/22/2006WO2005072332B1 Chemical mechanical planarization process control utilizing in-situ conditioning process
06/22/2006US20060135040 Method and device for the high-precision machining of the surface of an object, especially for polishing and lapping semiconductor substrates
06/22/2006US20060134908 Polishing method
06/22/2006US20060131474 Substrate for a stamper and preparing method for a substrate for a stamper
06/22/2006US20060131273 Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool
06/22/2006US20060130408 Polishing slurry for ionic materials, method for selecting a dispersant to be contained in the polishing slurring, method for determining a mixing concentration of the selected dispersant and polishing method using said polishing slurry
06/22/2006DE102005051820A1 Polierzusammensetzung Polishing composition
06/21/2006EP1672101A1 Process for the electrochemical removal of refractory metals or their alloys and use of a solution for this process
06/21/2006EP1322450B1 Activated slurry cmp system and methods for implementing the same
06/21/2006EP1278935B1 Tubing head seal assembly
06/21/2006CN2788966Y 研磨机 Grinder
06/21/2006CN1791970A Substrate holding apparatus and polishing apparatus
06/21/2006CN1791491A 基片抛光设备 Substrate polishing equipment
06/21/2006CN1791490A Substrate polishing apparatus
06/21/2006CN1789366A Polishing composition for glass substrate
06/21/2006CN1260778C Substrate processing method
06/20/2006US7064928 Method and apparatus for providing an additional ground pad and electrical connection for grounding a magnetic recording head
06/20/2006US7063605 Retaining ring for wafer carriers
06/20/2006US7063603 Method and apparatus for cleaning a web-based chemical mechanical planarization system
06/20/2006US7063600 Polishing apparatus
06/20/2006US7063599 Apparatus, systems, and methods for conditioning chemical-mechanical polishing pads
06/20/2006US7063598 Substrate delivery mechanism
06/20/2006US7063595 Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface
06/20/2006US7062838 Method of forming an embedded read element
06/15/2006WO2006062232A1 Substrate holding device and polishing apparatus
06/15/2006WO2006062158A1 Polishing pad
06/15/2006US20060128286 Polishing apparatus
06/15/2006US20060128279 Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces
06/15/2006US20060128277 Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
06/15/2006US20060128276 Carrier for double side polishing
06/15/2006US20060128273 Methods and systems for conditioning planarizing pads used in planarizing substrates
06/15/2006US20060128271 Polishing pad for semiconductor wafer and laminated body for polishing of semiconductor wafer equipped with the same as well as method for polishing of semiconductor wafer
06/15/2006US20060125133 Polishing pad containing embedded liquid microelements and method of manufacturing the same