| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 12/27/2005 | US6979251 Method and apparatus to add slurry to a polishing system |
| 12/27/2005 | US6979250 Carrier head with flexible membrane to provide controllable pressure and loading area |
| 12/27/2005 | US6979249 CMP pad having isolated pockets of continuous porosity and a method for using such pad |
| 12/27/2005 | US6979248 Conductive polishing article for electrochemical mechanical polishing |
| 12/27/2005 | US6979034 Workpiece handling end-effector and a method for processing workpieces using a workpiece handling end-effector |
| 12/27/2005 | CA2403866C Tubing hanger with annulus bore |
| 12/22/2005 | WO2005122225A1 Silicon wafer manufacturing method |
| 12/22/2005 | WO2005120775A1 Planarization of a heteroepitaxial layer |
| 12/22/2005 | WO2005052994A3 Protecting thin semiconductor wafers during back-grinding in high-volume production |
| 12/22/2005 | WO2004095516A3 Apparatus and method for polishing semiconductor wafers using one or more polishing surfaces |
| 12/22/2005 | US20050282479 Polishing pad having grooves configured to promote mixing wakes during polishing |
| 12/22/2005 | US20050282477 Apparatus for conditioning processing pads |
| 12/22/2005 | US20050282476 Off-line tool for breaking in multiple pad conditioning disks used in a chemical mechanical polishing system |
| 12/22/2005 | US20050282475 Apparatus and method for breaking in multiple pad conditioning disks for use in a chemical mechanical polishing system |
| 12/22/2005 | US20050282473 Surface treatment method for vacuum member |
| 12/22/2005 | US20050282472 CMP apparatus and method for polishing multiple semiconductor wafers on a single polishing pad using multiple slurry delivery lines |
| 12/22/2005 | US20050282470 Continuous contour polishing of a multi-material surface |
| 12/22/2005 | US20050282390 Polishing composition for semiconductor wafers |
| 12/22/2005 | US20050282380 Method and apparatus for chemical mechanical polishing of semiconductor substrates |
| 12/22/2005 | US20050282322 Retaining ring with conductive portion |
| 12/22/2005 | US20050281983 Polishing pad having a pressure relief channel |
| 12/22/2005 | US20050279030 Chemical mechanical polishing (CMP); for use on nickel/phosphorus alloys; contains abrasive particles, oxidant, oxidant modifier, and accelerants to sequester removed materials containing phosphonate and ammonium or amine groups |
| 12/22/2005 | DE19742665B4 Verfahren zum Schleifen mittels anhaftender Schleifmittel A method of grinding with abrasive adhesive |
| 12/22/2005 | DE10361767B4 Verfahren und Vorrichtung zur mechanischen Bearbeitung von parallelen Stirnflächen an kleinteiligen Werkstücken Method and apparatus for mechanical processing of parallel faces of small-scale workpieces |
| 12/22/2005 | DE10108358B4 Halbleiterscheiben-Poliervorrichtung A wafer polishing apparatus |
| 12/22/2005 | DE10106678B4 Waferpoliervorrichtung Wafer polishing apparatus |
| 12/21/2005 | EP1607179A1 Apparatus and method for removing a CMP polishing pad from a platen |
| 12/21/2005 | EP1399294B1 End point detection system for chemical mechanical polishing applications |
| 12/21/2005 | CN2747017Y On-line abrading machine for plastic calending roll |
| 12/21/2005 | CN1711153A Glass substrate for information recording medium and making method thereof |
| 12/20/2005 | US6976910 Polishing pad |
| 12/20/2005 | US6976908 Polishing head and polishing apparatus |
| 12/20/2005 | US6976906 Apparatus for reducing compressed dry air usage during chemical mechanical planarization |
| 12/20/2005 | US6976905 Method for polishing a memory or rigid disk with a phosphate ion-containing polishing system |
| 12/20/2005 | US6976904 Chemical mechanical polishing slurry |
| 12/20/2005 | US6976902 Chemical mechanical polishing apparatus |
| 12/20/2005 | US6976901 In situ feature height measurement |
| 12/15/2005 | WO2005118223A1 Polishing pad with oscillating path groove network |
| 12/15/2005 | US20050277376 Single component pad backer for polishing head of an orbital chemical mechanical polishing machine and method therefor |
| 12/15/2005 | US20050277375 Retaining ring assembly for use in chemical mechanical polishing |
| 12/15/2005 | US20050277372 Zone polishing using variable slurry solid content |
| 12/15/2005 | US20050277371 Transparent microporous materials for CMP |
| 12/15/2005 | US20050277368 Apparatus and method for removing a cmp polishing pad from a platen |
| 12/15/2005 | US20050277365 Real time polishing process monitoring |
| 12/15/2005 | US20050276979 CVD diamond-coated composite substrate containing a carbide-forming material and ceramic phases and method for making same |
| 12/15/2005 | US20050276967 Surface textured microporous polishing pads |
| 12/15/2005 | US20050275135 formed by annealing, quenching; chemical mechanical polishing |
| 12/15/2005 | US20050274627 Electrochemical-mechanical polishing system |
| 12/15/2005 | US20050274626 Polishing pad and polishing method |
| 12/14/2005 | CN1708565A Composition for polishing metal, polishing method for metal layer, and production method for wafer |
| 12/14/2005 | CN1708458A Cerium oxide particles and process for the production thereof |
| 12/14/2005 | CN1708378A Polishing apparatus |
| 12/14/2005 | CN1708377A Transparent microporous materials for CMP |
| 12/14/2005 | CN1706594A Grinding pad and its making process |
| 12/13/2005 | US6975107 Eddy current sensing of metal removal for chemical mechanical polishing |
| 12/13/2005 | US6974777 CMP compositions for low-k dielectric materials |
| 12/13/2005 | US6974525 Method and apparatus for electrochemical planarization of a workpiece |
| 12/13/2005 | US6974372 Polishing pad having grooves configured to promote mixing wakes during polishing |
| 12/13/2005 | US6974371 Two part retaining ring |
| 12/13/2005 | US6974368 where fine texturing marks are precisely formed in the radial direction and there are no abnormal protrusions; adding a polishing slurry to the substrate, pressing a polishing tape on the surface and running it in a direction opposite the rotation |
| 12/13/2005 | US6974364 Methods and apparatuses for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates |
| 12/08/2005 | US20050272355 Carrier head for chemical mechanical polishing apparatus |
| 12/08/2005 | US20050272352 Slurry delivery arm |
| 12/08/2005 | US20050272348 Polishing pad assembly, apparatus for polishing a wafer including the polishing pad assembly and method for polishing a wafer using the polishing pad assembly |
| 12/08/2005 | US20050272346 Carrier head of chemical mechanical polishing apparatus having barriers dividing pressure chamber into a plurality of pressure zones |
| 12/08/2005 | US20050269295 CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate |
| 12/08/2005 | DE10009656B4 Verfahren zur Herstellung einer Halbleiterscheibe A process for producing a semiconductor wafer |
| 12/07/2005 | EP1602444A2 Polishing method |
| 12/07/2005 | EP1601497A1 Cmp pad with composite transparent window |
| 12/07/2005 | EP1360034B1 Fixed abrasive article for use in modifying a semiconductor wafer |
| 12/07/2005 | EP1315845B1 Method for producing a coating of fluorescent material |
| 12/07/2005 | EP1156903B1 Apparatus for performing chemical-mechanical planarization |
| 12/07/2005 | CN2744464Y Small-sized electric valve grinding machine |
| 12/07/2005 | CN1706035A Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate |
| 12/07/2005 | CN1705733A Slurry for chemical-mechanical polishing copper damascene structures |
| 12/07/2005 | CN1705725A Corrosion retarding polishing slurry for the chemical mechanical polishing of copper surfaces |
| 12/07/2005 | CN1230486C Cerium oxide slurry, and method of mfg. substrate |
| 12/07/2005 | CN1230481C Polishing composition of magnetic disk substrate and polishing method using said composition |
| 12/07/2005 | CN1230480C Polishing composition and polishing method of substrate for memory and hard disk |
| 12/07/2005 | CN1230279C Integrated endpoint detection system with optical and eddy current monitoring |
| 12/07/2005 | CN1230278C Device for controlling homogeneity of edge polishing |
| 12/06/2005 | US6972096 Chemical-mechanical polishing process |
| 12/06/2005 | US6971950 Polishing silicon wafers |
| 12/06/2005 | US6971945 Multi-step polishing solution for chemical mechanical planarization |
| 12/06/2005 | US6971944 Method and control system for improving CMP process by detecting and reacting to harmonic oscillation |
| 12/01/2005 | WO2005114177A1 Method for evaluating quality of abrasive particles, method for polishing glass and abrasive composition for polishing glass |
| 12/01/2005 | WO2005113194A1 Method and apparatus for measuring and controlling solids composition of a magnetorheological fluid |
| 12/01/2005 | WO2005113193A1 Retaining ring with conductive portion |
| 12/01/2005 | US20050266783 Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces |
| 12/01/2005 | US20050266778 Carrier heads, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 12/01/2005 | US20050266776 Polishing pad with oscillating path groove network |
| 12/01/2005 | US20050266773 Apparatuses and methods for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 12/01/2005 | US20050266771 Polishing pad with window |
| 12/01/2005 | US20050266688 Semiconductor device fabrication method |
| 12/01/2005 | US20050266226 Chemical mechanical polishing pad and method for selective metal and barrier polishing |
| 12/01/2005 | US20050263406 Polishing pad for electrochemical mechanical polishing |
| 12/01/2005 | US20050262966 Generating an aerosol including a liquid comprising a nickel precursor and moving the droplets through a heating zone by means of a carrier gas to form nickel particles having small particle size, narrow size distribution, spherical morphology and high crystallinity; pyrometallurgy |
| 12/01/2005 | DE102005007356A1 Entfernen von eingebetteten Partikeln während eines chemisch-mechanischen Polierens Removal of embedded particles during a chemical-mechanical polishing |
| 12/01/2005 | DE102005001259A1 Polierverfahren für ein Halbleitersubstrat sowie dabei verwendete Polier-Spanneinrichtung A polishing method for a semiconductor substrate, and used therein polishing jig |
| 12/01/2005 | DE102004054567A1 Process for simultaneous two sided removal of material from semiconductor wafers has wafer between rotary working discs and direction reversal at reduced force |