Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
09/2006
09/28/2006US20060217039 Polishing apparatus and method of polishing work piece
09/28/2006US20060216939 Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same
09/28/2006US20060216936 Chemical and mechanical polishing method and polishing liquid using therefor
09/28/2006US20060216551 Perpendicular magnetic recording disk and method of producing same
09/28/2006US20060214657 Polishing device using eddy current sensor
09/28/2006US20060213869 Method for controlling a CMP process and polishing cloth
09/28/2006US20060213126 Method for preparing a polishing slurry having high dispersion stability
09/27/2006EP1705701A2 Chemical and mechanical polishing method and polishing liquid used therefor
09/27/2006EP1704962A2 Polishing apparatus having interlock function
09/27/2006CN1839015A Apparatus and method for controlling film thickness and fluid material composition on a polishing pad
09/27/2006CN1837322A Compositions and methods for chemical mechanical polishing thin films and dielectric materials
09/27/2006CN1837321A Compositions and methods for chemical mechanical polishing interlevel dielectric layers
09/27/2006CN1837320A Polishing composition and polishing method
09/27/2006CN1837319A Polishing composition and polishing method
09/27/2006CN1276959C Slurry for CMP, polishing method and method of manufacturing semiconductor device
09/26/2006US7112960 Eddy current system for in-situ profile measurement
09/26/2006US7112270 Algorithm for real-time process control of electro-polishing
09/26/2006US7112245 Apparatuses for forming a planarizing pad for planarization of microlectronic substrates
09/26/2006US7112125 Polishing cloth, polishing apparatus and method of manufacturing semiconductor devices
09/26/2006US7112122 Methods and apparatus for removing conductive material from a microelectronic substrate
09/21/2006WO2006098150A1 Polishing head for semiconductor wafer, polishing apparatus and polishing method
09/21/2006WO2006098141A1 Abrasive for semiconductor integrated circuit device, method for polishing semiconductor integrated circuit device and semiconductor integrated circuit device manufacturing method
09/21/2006US20060209308 Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus
09/21/2006US20060207635 Barrier polishing fluid
09/21/2006DE102006010503A1 Polierkissen auf Wasserbasis und Herstellungsverfahren Water-based polishing pad and manufacturing method
09/21/2006DE102005012684A1 Verfahren zum Steuern eines CMP-Prozesses und Poliertuch A method for controlling a CMP process and the polishing cloth
09/20/2006EP0975731B1 Ethylenediaminetetraacetic acid or its ammonium salt semiconductor process residue removal composition and process
09/20/2006CN1836315A Abrasive compound for semiconductor planarization
09/20/2006CN1835824A Cell, system and article for electrochemical mechanical processing
09/20/2006CN1833816A Nano-glass supersmooth processing technique of sapphire crystal sheet
09/20/2006CN1276483C Planarization of substrates using electrochemical mechanical polishing
09/20/2006CN1276475C Method for producing semiconductor device and used slurry
09/20/2006CN1276051C Aqueous dispersion for chemical/mechanical polishing
09/19/2006US7108597 Polishing pad having grooves configured to promote mixing wakes during polishing
09/19/2006US7108592 Substrate holding apparatus and polishing apparatus
09/19/2006US7108589 Polishing apparatus and method
09/19/2006US7108586 Method of chemical mechanical polishing using abrasive particles of alkaline earth metal salts
09/19/2006US7108581 Polishing apparatus
09/19/2006US7108580 Method and device for simulation, method and device for polishing, method and device for preparing control parameters or control program, polishing system, recording medium, and method of manufacturing semiconductor device
09/19/2006US7108579 Method and device for polishing
09/14/2006WO2006095894A1 Lubricant composition for bonded-abrasive polishing of magnetic head
09/14/2006WO2006095643A1 Polishing pad
09/14/2006WO2006095591A1 Polishing pad and process for producing the same
09/14/2006WO2006081285A3 Electroprocessing profile control
09/14/2006WO2005100976A3 System and method for the identification of chemical mechanical planarization defects
09/14/2006US20060205325 Material for purification of semiconductor polishing slurry, module for purification of semiconductor polishing slurry and process for producing semiconductor polishing slurry
09/14/2006US20060205323 Substrate holding mechanism, substrate polishing apparatus and substrate polishing method
09/14/2006US20060205322 Chemical-mechanical planarization tool force calibration method and system
09/14/2006US20060205219 Compositions and methods for chemical mechanical polishing interlevel dielectric layers
09/14/2006US20060205218 Compositions and methods for chemical mechanical polishing thin films and dielectric materials
09/14/2006US20060202384 Water-based polishing pads and methods of manufacture
09/13/2006EP1699596A1 Chemical mechanical polishing method for reducing slurry reflux
09/13/2006CN1832829A In situ activation of a three-dimensional fixed abrasive article
09/13/2006CN1830627A Water-based polishing pads and methods of manufacture
09/13/2006CN1830625A Displacement limiting frame device
09/13/2006CN1830624A Super-abrasive machining tool and method of use
09/12/2006US7105446 Apparatus for pre-conditioning CMP polishing pad
09/12/2006US7104875 Chemical mechanical polishing apparatus with rotating belt
09/12/2006US7104869 Barrier removal at low polish pressure
09/12/2006US7104868 Turning tool for grooving polishing pad, apparatus and method of producing polishing pad using the tool, and polishing pad produced by using the tool
09/08/2006WO2006093670A2 Polishing pad for use in polishing work pieces
09/08/2006WO2006093625A1 Conductive pad with high abrasion
09/07/2006US20060199480 Apparatus and method for feeding slurry
09/07/2006US20060199479 Substrate holding apparatus and polishing apparatus
09/07/2006US20060199478 Substrate delivery mechanism
09/07/2006US20060199474 Systems including differential pressure application apparatus
09/07/2006US20060199473 Polishing pad, process for producing the same and method of polishing therewith
09/07/2006US20060199472 Apparatus and method for conditioning a polishing pad used for mechanical and/or chemical-mechanical planarization
09/07/2006US20060197055 Slurry for CMP, polishing method and method of manufacturing semiconductor device
09/07/2006US20060197054 CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate
09/07/2006US20060196849 Composition and method for polishing a sapphire surface
09/07/2006US20060196778 Tungsten electroprocessing
09/06/2006EP1699075A1 Method for manufacturing single-side mirror surface wafer
09/06/2006EP1699074A1 Manufacturing method of silicon wafer
09/06/2006CN1829587A Conductive polishing article for electrochemical mechanical polishing
09/06/2006CN1828840A Multipurpose slurry delivery arm for chemical mechanical polishing
09/06/2006CN1273267C Catalytic reactive pad for metal CMP
09/05/2006USRE39262 Polishing apparatus including turntable with polishing surface of different heights
09/05/2006US7101819 Alumina-zirconia, and methods of making and using the same
09/05/2006US7101801 Method of manufacturing semiconductor device using chemical mechanical polishing
09/05/2006US7101800 Chemical-mechanical polishing slurry and method
09/05/2006US7101799 Feedforward and feedback control for conditioning of chemical mechanical polishing pad
09/05/2006US7101501 Single-layer polishing pad and method producing the same
09/05/2006US7101275 Resilient polishing pad for chemical mechanical polishing
09/05/2006US7101271 Polishing head and chemical mechanical polishing apparatus
09/05/2006US7101261 Fluid-pressure regulated wafer polishing head
09/05/2006US7101259 Polishing method and apparatus
09/05/2006US7101258 Double sided polishing machine
09/05/2006US7101257 Substrate polishing apparatus
09/05/2006US7101255 Polishing apparatus
09/05/2006US7101254 System and method for in-line metal profile measurement
09/05/2006US7101253 Load cup for chemical mechanical polishing
09/05/2006US7101252 Polishing method and apparatus
09/05/2006US7101251 Polishing system with in-line and in-situ metrology
08/2006
08/31/2006WO2006090741A1 Magnetic surface treatment method
08/31/2006WO2006090661A1 Carrier for double side polishing machine and double side polishing machine employing it, and double side polishing method
08/31/2006WO2006090497A1 Polishing apparatus and polishing method
08/31/2006US20060194525 Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
08/31/2006US20060194523 Method and apparatus for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates
08/31/2006US20060194522 Method and apparatus for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates
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