Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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03/21/2006 | US7014545 Vibration damping in a chemical mechanical polishing system |
03/21/2006 | US7014541 Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece |
03/21/2006 | US7014538 Article for polishing semiconductor substrates |
03/21/2006 | US7014536 Wafer polishing method |
03/21/2006 | US7014535 Carrier head having low-friction coating and planarizing machine using same |
03/21/2006 | US7014534 Method for manufacturing substrate |
03/21/2006 | US7014531 Method and apparatus for inline measurement of material removal during a polishing or grinding process |
03/21/2006 | US7014530 Slider fabrication system for sliders with integrated electrical lapping guides |
03/16/2006 | WO2005072332A3 Chemical mechanical planarization process control utilizing in-situ conditioning process |
03/16/2006 | US20060057942 Polishing apparatus, polishing head and polishing method |
03/16/2006 | US20060057940 Polishing apparatus and method for producing semiconductors using the apparatus |
03/16/2006 | DE102005023469A1 Polierkissen, das Nuten aufweist, die konfiguriert sind, um Mischwirbel während eines Polierens zu fördern A polishing pad, comprising grooves that are configured to encourage mixing vortex during polishing |
03/15/2006 | EP1633528A2 Substrate polishing apparatus |
03/15/2006 | EP1633526A2 Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces |
03/15/2006 | EP1322940A4 In-situ method and apparatus for end point detection in chemical mechanical polishing |
03/15/2006 | CN1748293A Substrate holding apparatus and polishing apparatus |
03/15/2006 | CN1748292A Slurry composition for chemical mechanical polishing, method for planarization of surface of semiconductor element using the same, and method for controlling selection ratio of slurry composition |
03/15/2006 | CN1746255A Polishing compound and method for polishing substrate |
03/15/2006 | CN1746254A Polishing composition and polishing method using the same |
03/15/2006 | CN1746253A Polishing composition and polishing method using the same |
03/15/2006 | CN1745970A Parallel planar grinder |
03/15/2006 | CN1245742C Grinding pad collation device |
03/15/2006 | CN1245471C Cerium oxide abrasive and method of polishing substrates |
03/15/2006 | CN1245466C Polishing composition and its polishing method |
03/14/2006 | US7011574 Polyelectrolyte dispensing polishing pad |
03/14/2006 | US7011569 Method and apparatus for polishing workpiece |
03/14/2006 | US7011566 Methods and systems for conditioning planarizing pads used in planarizing substrates |
03/14/2006 | US7011565 Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
03/14/2006 | US7010939 Glass substrate for data recording medium and manufacturing method thereof |
03/09/2006 | WO2006026343A1 Polishing pad and methods of improving pad removal rates and planarization |
03/09/2006 | WO2006026315A1 A stacked polyuretahane polishing pad |
03/09/2006 | WO2006025614A1 Mixed rare earth oxide, mixed rare earth fluoride, cerium-based abrasive using the materials and production processes thereof |
03/09/2006 | WO2006025545A1 Magnetic disk substrate and production method of magnetic disk |
03/09/2006 | WO2006025539A1 Polishing slurry, production method of glass substrate for information recording medium and production method of information recording medium |
03/09/2006 | US20060052040 Method for manufacturing microporous CMP materials having controlled pore size |
03/09/2006 | US20060052037 Vacuum suction holding apparatus and holding method, polishing apparatus using this holding apparatus, and device manufacturing method using this polishing apparatus |
03/09/2006 | US20060049143 Polishing composition and polishing method using the same |
03/09/2006 | US20060049142 Apparatus and method for polishing semiconductor wafer |
03/09/2006 | US20060048697 Monitoring and control of a fabrication process |
03/09/2006 | US20060048455 Polishing composition and polishing method using the same |
03/09/2006 | DE10308064B4 Poliermittelzuführung bei CMP-Prozessen Slurry supplying in CMP processes |
03/08/2006 | EP1632993A1 Production method for semiconductor wafer |
03/08/2006 | CN2763968Y Chemical-mechanical abrading device |
03/08/2006 | CN1745460A CMP polishing compound and polishing method |
03/08/2006 | CN1744969A Modeling an abrasive process to achieve controlled material removal |
03/08/2006 | CN1744968A Cmp pad with composite transparent window |
03/08/2006 | CN1744285A 制造系统 Manufacturing System |
03/07/2006 | US7008875 Methods and apparatus for polishing control |
03/07/2006 | US7008554 Barrier to prevent copper diffusion; polishing using reducing agent |
03/07/2006 | US7008309 Back pressure control system for CMP and wafer polishing |
03/07/2006 | US7008308 Wafer carrier |
03/07/2006 | US7008303 Web lift system for chemical mechanical planarization |
03/07/2006 | US7008302 Chemical mechanical polishing equipment and conditioning thereof |
03/07/2006 | US7008299 Apparatus and method for mechanical and/or chemical-mechanical planarization of micro-device workpieces |
03/07/2006 | US7008297 Combined eddy current sensing and optical monitoring for chemical mechanical polishing |
03/07/2006 | US7008296 Data processing for monitoring chemical mechanical polishing |
03/07/2006 | US7008295 Substrate monitoring during chemical mechanical polishing |
03/02/2006 | WO2006022452A2 Polishing apparatus and polishing method |
03/02/2006 | WO2006022446A1 Magnetic disk substrate and production method of magnetic disk |
03/02/2006 | WO2006022445A1 Magnetic disk substrate and production method of magnetic disk |
03/02/2006 | WO2006022443A1 Magnetic disk substrate and production method of magnetic disk |
03/02/2006 | WO2005123336A3 Electrochemical-mechanical polishing system |
03/02/2006 | US20060046491 CMP polishing method and method for manufacturing semiconductor device |
03/02/2006 | US20060043532 Protective structure of semiconductor wafer, method for protecting semiconductor wafer, multilayer protective sheet used therein, and method for processing semiconductor wafer |
03/01/2006 | CN1740106A Prepn of high precision superthin substrate |
03/01/2006 | CN1739916A Double-sided polishing apparatus |
02/28/2006 | US7005384 Chemical mechanical polishing method, and washing/rinsing method associated therewith |
02/28/2006 | US7005383 Apparatus and methods of chemical mechanical polishing |
02/28/2006 | US7005085 Composite oxide; fine particle size; generating aerosols, heating to remove liquid, coating surfaces |
02/28/2006 | US7004994 Method for making a film from silver-containing particles |
02/28/2006 | US7004823 Multi-zone grinding and/or polishing sheet |
02/28/2006 | US7004822 Chemical mechanical polishing and pad dressing method |
02/28/2006 | US7004819 CMP systems and methods utilizing amine-containing polymers |
02/28/2006 | US7004817 Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces |
02/28/2006 | US7004814 CMP process control method |
02/23/2006 | WO2006019839A1 A method and apparatus for conditioning a polishing pad |
02/23/2006 | WO2006019541A1 Polishing pad with flow modifying groove network |
02/23/2006 | US20060040595 Method and system for chemical mechanical polishing pad cleaning |
02/23/2006 | US20060040589 Double sided polishing machine |
02/23/2006 | US20060040588 Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same |
02/23/2006 | US20060037699 Polishing pad and method for manufacturing semiconductor device |
02/23/2006 | DE102004040429A1 Doppelseiten-Poliermaschine Double-side polishing machine |
02/22/2006 | EP1628298A1 Stamper substrate and process for producing the same |
02/22/2006 | EP1626840A2 Apparatus and method for polishing semiconductor wafers using one or more polishing surfaces |
02/22/2006 | EP1626839A1 A method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner |
02/22/2006 | EP1626838A1 Exposing substance, exposing method, and exposing device |
02/22/2006 | CN2760754Y Clamp ring with flange for chemical machinery polishing |
02/22/2006 | CN1739192A Methods for planarization of group VIII metal-containing surfaces using complexing agents |
02/22/2006 | CN1738928A Compositions for copper, tantalum and tantalum nitride chemical mechanical method complanation |
02/22/2006 | CN1738845A Method of fabricating polyurethane foam with micro pores and polishing pad therefrom |
02/22/2006 | CN1738698A Pad constructions for chemical mechanical planarization applications |
02/22/2006 | CN1737885A Slurry compositions, methods of preparing slurry compositions, and methods of polishing an object using slurry compositions |
02/22/2006 | CN1736663A Abrasive tool |
02/22/2006 | CN1243370C Slurry composition for use in chemical mechanical polishing of metal wiring |
02/22/2006 | CN1243071C Metal grinding liquid material, metal grinding liquid, its producing method and grinding method using it |
02/22/2006 | CN1243070C Abrasive composition for polishing magnetic recording disk matrix |
02/21/2006 | US7003148 Detection of an end point of polishing a substrate |
02/21/2006 | US7002689 Optically-based method and apparatus for detecting and characterizing surface pits in a metal film during chemical mechanical polish |
02/21/2006 | US7001845 Methods of treating surfaces of substrates |
02/21/2006 | US7001260 Carrier head with a compressible film |