Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
03/2006
03/21/2006US7014545 Vibration damping in a chemical mechanical polishing system
03/21/2006US7014541 Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
03/21/2006US7014538 Article for polishing semiconductor substrates
03/21/2006US7014536 Wafer polishing method
03/21/2006US7014535 Carrier head having low-friction coating and planarizing machine using same
03/21/2006US7014534 Method for manufacturing substrate
03/21/2006US7014531 Method and apparatus for inline measurement of material removal during a polishing or grinding process
03/21/2006US7014530 Slider fabrication system for sliders with integrated electrical lapping guides
03/16/2006WO2005072332A3 Chemical mechanical planarization process control utilizing in-situ conditioning process
03/16/2006US20060057942 Polishing apparatus, polishing head and polishing method
03/16/2006US20060057940 Polishing apparatus and method for producing semiconductors using the apparatus
03/16/2006DE102005023469A1 Polierkissen, das Nuten aufweist, die konfiguriert sind, um Mischwirbel während eines Polierens zu fördern A polishing pad, comprising grooves that are configured to encourage mixing vortex during polishing
03/15/2006EP1633528A2 Substrate polishing apparatus
03/15/2006EP1633526A2 Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces
03/15/2006EP1322940A4 In-situ method and apparatus for end point detection in chemical mechanical polishing
03/15/2006CN1748293A Substrate holding apparatus and polishing apparatus
03/15/2006CN1748292A Slurry composition for chemical mechanical polishing, method for planarization of surface of semiconductor element using the same, and method for controlling selection ratio of slurry composition
03/15/2006CN1746255A Polishing compound and method for polishing substrate
03/15/2006CN1746254A Polishing composition and polishing method using the same
03/15/2006CN1746253A Polishing composition and polishing method using the same
03/15/2006CN1745970A Parallel planar grinder
03/15/2006CN1245742C Grinding pad collation device
03/15/2006CN1245471C Cerium oxide abrasive and method of polishing substrates
03/15/2006CN1245466C Polishing composition and its polishing method
03/14/2006US7011574 Polyelectrolyte dispensing polishing pad
03/14/2006US7011569 Method and apparatus for polishing workpiece
03/14/2006US7011566 Methods and systems for conditioning planarizing pads used in planarizing substrates
03/14/2006US7011565 Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
03/14/2006US7010939 Glass substrate for data recording medium and manufacturing method thereof
03/09/2006WO2006026343A1 Polishing pad and methods of improving pad removal rates and planarization
03/09/2006WO2006026315A1 A stacked polyuretahane polishing pad
03/09/2006WO2006025614A1 Mixed rare earth oxide, mixed rare earth fluoride, cerium-based abrasive using the materials and production processes thereof
03/09/2006WO2006025545A1 Magnetic disk substrate and production method of magnetic disk
03/09/2006WO2006025539A1 Polishing slurry, production method of glass substrate for information recording medium and production method of information recording medium
03/09/2006US20060052040 Method for manufacturing microporous CMP materials having controlled pore size
03/09/2006US20060052037 Vacuum suction holding apparatus and holding method, polishing apparatus using this holding apparatus, and device manufacturing method using this polishing apparatus
03/09/2006US20060049143 Polishing composition and polishing method using the same
03/09/2006US20060049142 Apparatus and method for polishing semiconductor wafer
03/09/2006US20060048697 Monitoring and control of a fabrication process
03/09/2006US20060048455 Polishing composition and polishing method using the same
03/09/2006DE10308064B4 Poliermittelzuführung bei CMP-Prozessen Slurry supplying in CMP processes
03/08/2006EP1632993A1 Production method for semiconductor wafer
03/08/2006CN2763968Y Chemical-mechanical abrading device
03/08/2006CN1745460A CMP polishing compound and polishing method
03/08/2006CN1744969A Modeling an abrasive process to achieve controlled material removal
03/08/2006CN1744968A Cmp pad with composite transparent window
03/08/2006CN1744285A 制造系统 Manufacturing System
03/07/2006US7008875 Methods and apparatus for polishing control
03/07/2006US7008554 Barrier to prevent copper diffusion; polishing using reducing agent
03/07/2006US7008309 Back pressure control system for CMP and wafer polishing
03/07/2006US7008308 Wafer carrier
03/07/2006US7008303 Web lift system for chemical mechanical planarization
03/07/2006US7008302 Chemical mechanical polishing equipment and conditioning thereof
03/07/2006US7008299 Apparatus and method for mechanical and/or chemical-mechanical planarization of micro-device workpieces
03/07/2006US7008297 Combined eddy current sensing and optical monitoring for chemical mechanical polishing
03/07/2006US7008296 Data processing for monitoring chemical mechanical polishing
03/07/2006US7008295 Substrate monitoring during chemical mechanical polishing
03/02/2006WO2006022452A2 Polishing apparatus and polishing method
03/02/2006WO2006022446A1 Magnetic disk substrate and production method of magnetic disk
03/02/2006WO2006022445A1 Magnetic disk substrate and production method of magnetic disk
03/02/2006WO2006022443A1 Magnetic disk substrate and production method of magnetic disk
03/02/2006WO2005123336A3 Electrochemical-mechanical polishing system
03/02/2006US20060046491 CMP polishing method and method for manufacturing semiconductor device
03/02/2006US20060043532 Protective structure of semiconductor wafer, method for protecting semiconductor wafer, multilayer protective sheet used therein, and method for processing semiconductor wafer
03/01/2006CN1740106A Prepn of high precision superthin substrate
03/01/2006CN1739916A Double-sided polishing apparatus
02/2006
02/28/2006US7005384 Chemical mechanical polishing method, and washing/rinsing method associated therewith
02/28/2006US7005383 Apparatus and methods of chemical mechanical polishing
02/28/2006US7005085 Composite oxide; fine particle size; generating aerosols, heating to remove liquid, coating surfaces
02/28/2006US7004994 Method for making a film from silver-containing particles
02/28/2006US7004823 Multi-zone grinding and/or polishing sheet
02/28/2006US7004822 Chemical mechanical polishing and pad dressing method
02/28/2006US7004819 CMP systems and methods utilizing amine-containing polymers
02/28/2006US7004817 Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces
02/28/2006US7004814 CMP process control method
02/23/2006WO2006019839A1 A method and apparatus for conditioning a polishing pad
02/23/2006WO2006019541A1 Polishing pad with flow modifying groove network
02/23/2006US20060040595 Method and system for chemical mechanical polishing pad cleaning
02/23/2006US20060040589 Double sided polishing machine
02/23/2006US20060040588 Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same
02/23/2006US20060037699 Polishing pad and method for manufacturing semiconductor device
02/23/2006DE102004040429A1 Doppelseiten-Poliermaschine Double-side polishing machine
02/22/2006EP1628298A1 Stamper substrate and process for producing the same
02/22/2006EP1626840A2 Apparatus and method for polishing semiconductor wafers using one or more polishing surfaces
02/22/2006EP1626839A1 A method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner
02/22/2006EP1626838A1 Exposing substance, exposing method, and exposing device
02/22/2006CN2760754Y Clamp ring with flange for chemical machinery polishing
02/22/2006CN1739192A Methods for planarization of group VIII metal-containing surfaces using complexing agents
02/22/2006CN1738928A Compositions for copper, tantalum and tantalum nitride chemical mechanical method complanation
02/22/2006CN1738845A Method of fabricating polyurethane foam with micro pores and polishing pad therefrom
02/22/2006CN1738698A Pad constructions for chemical mechanical planarization applications
02/22/2006CN1737885A Slurry compositions, methods of preparing slurry compositions, and methods of polishing an object using slurry compositions
02/22/2006CN1736663A Abrasive tool
02/22/2006CN1243370C Slurry composition for use in chemical mechanical polishing of metal wiring
02/22/2006CN1243071C Metal grinding liquid material, metal grinding liquid, its producing method and grinding method using it
02/22/2006CN1243070C Abrasive composition for polishing magnetic recording disk matrix
02/21/2006US7003148 Detection of an end point of polishing a substrate
02/21/2006US7002689 Optically-based method and apparatus for detecting and characterizing surface pits in a metal film during chemical mechanical polish
02/21/2006US7001845 Methods of treating surfaces of substrates
02/21/2006US7001260 Carrier head with a compressible film