Patents
Sitemap › B24 - Grinding; Polishing › B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents › B24B 37 - Lapping machines or devices; Accessories
Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
11/2005
11/03/2005US20050245177 Wafer holding plate for wafer grinding apparatus and method for manufacturing the same
11/03/2005US20050245174 Method of processing a substrate
11/03/2005US20050245171 Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method for semiconductor wafers
11/03/2005US20050245170 Polishing system with in-line and in-situ metrology
11/03/2005US20050245169 Method of polishing semiconductor wafer
11/03/2005US20050242063 Method and device for the chemical mechanical polishing of workpieces
11/03/2005DE10354263B4 Verfahren zum Polieren einer Vielzahl von Halbleiterscheiben A method of polishing a plurality of semiconductor wafers
11/03/2005DE102005012607A1 Polierzusammensetzung und Polierverfahren Polishing composition and polishing method
11/03/2005DE102004017452A1 Laminar and abrasive machining device for e.g. crystalline silicon wafer, has supporting device with surface bearing and bearing supports supporting rear side of work disk which is pressed against carrier`s front with work piece
11/03/2005CA2564138A1 Abrasive cloth and method for producing nanofiber structure
11/02/2005EP1591253A2 Micromachining methods and systems
11/02/2005EP1591201A1 Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method for semiconductor wafers
11/02/2005EP1590128A1 Modeling an abrasive process to achieve controlled material removal
11/02/2005EP1590127A1 Pad constructions for chemical mechanical planarization applications
11/02/2005CN2737501Y Polising product for processing base material
11/02/2005CN1689758A Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method for semiconductor wafers
11/02/2005CN1689757A Small-sized precise hand operated grinding and polishing apparatus
11/02/2005CN1225724C Film magnetic-head material processing equipment and method
11/01/2005US6960521 Method and apparatus for polishing metal and dielectric substrates
11/01/2005US6960120 CMP pad with composite transparent window
11/01/2005US6960118 Surface roughening treatment method of object being treated, and apparatus therefor
11/01/2005US6960115 Multiprobe detection system for chemical-mechanical planarization tool
11/01/2005US6960114 Pad conditioner of CMP equipment
10/2005
10/27/2005WO2005101474A1 Metal polishing liquid and polishing method using it
10/27/2005WO2005101379A1 Method of texture processing on glass substrate for magnetic hard disk and slurry therefor
10/27/2005WO2005100976A2 System and method for the identification of chemical mechanical planarization defects
10/27/2005WO2005100497A1 Cmp porous pad with component-filled pores
10/27/2005WO2005099963A1 Low surface energy cmp pad
10/27/2005WO2005099962A1 Polishing pad comprising hydrophobic region and endpoint detection port
10/27/2005US20050239380 Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method
10/27/2005US20050239372 Substrate polishing apparatus
10/27/2005US20050239371 Pressure control system and polishing apparatus
10/27/2005US20050239222 Run-to-run control of backside pressure for CMP radial uniformity optimization based on center-to-edge model
10/27/2005US20050238927 Glass substrate for perpendicular magnetic recording disk and method of producing same
10/27/2005US20050236601 Barrier polishing solution
10/27/2005US20050236368 Method for manufacturing semiconductor device
10/27/2005US20050236358 Micromachining methods and systems
10/26/2005EP1588803A1 Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method
10/26/2005EP1588802A1 A polishing pad resistant to delamination
10/26/2005EP1587649A1 Method and device for the high-precision machining of the surface of an object, especially for polishing and lapping semiconductor substrates
10/26/2005EP1242557B1 Method of polishing or planarizing a substrate
10/26/2005EP1031166B1 Method and apparatus for chemical mechanical polishing
10/26/2005CN2736107Y Cylindrical super fine grinding machine
10/26/2005CN1688665A Apparatus and method for replacing a media content item
10/26/2005CN1688411A Methods and apparatus for electromechanically and/or electrochemically removing conductive material from a microelectronic substrate
10/26/2005CN1225019C Semiconductor device manufacture method preventing dishing and erosion during chemical mechanical polishing
10/26/2005CN1225010C Working shape prediction method, working system and method of manufacturing semiconductor device
10/26/2005CN1224501C Integrated grinding pad and its mfg. method
10/26/2005CN1224499C Polishing pad, method of mfg. polishing pad, and cushion layer polishing pad
10/26/2005CA2503918A1 Micromachining methods and systems
10/25/2005USRE38854 Apparatus for and method for polishing workpiece
10/25/2005US6958005 Polishing pad conditioning system
10/25/2005US6958002 Polishing pad with flow modifying groove network
10/25/2005US6958001 Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces
10/25/2005US6957998 Polishing apparatus
10/25/2005US6957997 Method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner
10/25/2005US6957511 Single-step electromechanical mechanical polishing on Ni-P plated discs
10/25/2005CA2163671C Magnetorheological polishing devices and methods
10/20/2005WO2005097408A1 Mounting for retaining semiconductor wafers in a chemomechanical polishing device
10/20/2005WO2005096700A2 Polishing pad and method of making same
10/20/2005US20050233679 Methods for making wafers with low-defect surfaces, wafers obtained thereby and electronic components made from the wafers
10/20/2005US20050230354 Method and composition of post-CMP wetting of thin films
10/20/2005US20050229369 Systems including differential pressure application apparatus
10/19/2005EP1299210B1 Polishing pad grooving method and apparatus
10/19/2005EP1284842B1 Polishing pads for chemical mechanical planarization
10/19/2005CN1685482A 抛光方法 Polishing method
10/19/2005CN1684800A Polishing apparatus, polishing head, and polishing method
10/19/2005CN1684799A Polishing pad for planarization
10/19/2005CN1684798A Polishing pad with window for planarization
10/19/2005CN1684234A Method for the production of wafers with defective-poor surfaces, the use such wafers and therewith obtained electronic units
10/19/2005CN1684233A Polishing pad resistant to delamination
10/19/2005CN1683112A Polishing apparatus
10/19/2005CN1224082C Polishing element, CMP polishing device and production method for semiconductor device
10/18/2005US6955987 Comparison of chemical-mechanical polishing processes
10/18/2005US6955764 Method and apparatus for preparing slurry for CMP apparatus
10/18/2005US6955589 Delivery system for magnetorheological fluid
10/18/2005US6955588 Method of and platen for controlling removal rate characteristics in chemical mechanical planarization
10/18/2005US6955587 Grooved polishing pad and method
10/13/2005WO2005095059A1 Undulated pad conditioner and method of using same
10/13/2005WO2005095055A1 Insulated pad conditioner and method of using same
10/13/2005WO2005095053A1 Linearly advancing polishing method and apparatus
10/13/2005WO2005042810A3 Membrane -mediated electropolishing
10/13/2005US20050227596 Polishing apparatus
10/13/2005US20050227595 CMP apparatus and load cup mechanism
10/13/2005US20050227587 In-line wafer surface mapping
10/13/2005US20050227489 Polishing pad and method of manufacturing semiconductor devices
10/13/2005US20050227088 Method of producing polyuretane pads and similar articles and the article produced thereby
10/13/2005US20050226746 Dispensing apparatus for a fluid
10/13/2005US20050225001 Foamed polishing sheet
10/13/2005US20050223805 System and Method for the Identification of Chemical Mechanical Planarization Defects
10/13/2005DE19728428B4 Halbleiterwafer-Poliermaschine Semiconductor wafer polishing machine
10/13/2005DE102005006614A1 Zusammensetzungen und Verfahren für das chemisch-mechanische Polieren von Siliciumdioxid und Siliciumnitrid Compositions and methods for chemical mechanical polishing of silicon dioxide and silicon nitride
10/12/2005EP1584365A1 Transmitter for wireless control
10/12/2005EP1583639A1 Method of using a soft subpad for chemical mechanical polishing
10/12/2005EP1485439A4 Improved chemical-mechanical polishing slurry for polishing of copper or silver films
10/12/2005EP1478494B1 Method and system for controlling the chemical mechanical polishing of substrates by calculating an overpolishing time and/or a polishing time of a final polishing step
10/12/2005EP1268133B1 Polishing head for wafer, and method for polishing
10/12/2005CN2733586Y Automatic control device for grinding slurry arm
10/12/2005CN1681622A Polishing pad for endpoint detection and related methods
10/12/2005CN1681100A Bubble detection between polishing pad and polishing disk
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