| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 08/08/2006 | US7086929 Endpoint detection with multiple light beams |
| 08/08/2006 | US7086132 Method for assembling a polishing head and apparatus for detecting air leakage in the polishing head while assembling the same |
| 08/03/2006 | WO2006081589A2 Tungsten electroprocessing |
| 08/03/2006 | WO2006081477A1 Chemical-mechanical planarization tool force calibration method and system |
| 08/03/2006 | WO2006081286A2 Multi-layer polishing pad for low-pressure polishing |
| 08/03/2006 | WO2006081285A2 Electroprocessing profile control |
| 08/03/2006 | WO2006080796A1 Cerium oxide abrasive and slurry containing the same |
| 08/03/2006 | WO2006054732A3 Polishing apparatus and polishing method |
| 08/03/2006 | WO2006041889A3 Conductive pad design modification for better wafer-pad contact |
| 08/03/2006 | WO2006034808A3 Method and device for predicting surface abrasion |
| 08/03/2006 | US20060172671 Conductive polishing article for electrochemical mechanical polishing |
| 08/03/2006 | US20060172666 Method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips |
| 08/03/2006 | US20060172665 Polishing tool and polishing apparatus |
| 08/03/2006 | US20060172664 Methods for reducing delamination during chemical mechanical polishing |
| 08/03/2006 | US20060172663 Surface polishing method and apparatus thereof |
| 08/03/2006 | US20060169591 Method of making printed wiring board and method of forming plating film |
| 08/02/2006 | EP1685281A2 Membrane -mediated electropolishing |
| 08/02/2006 | CN2801394Y 抛光垫 Polishing pad |
| 08/02/2006 | CN1813340A Polishing apparatus and polishing method |
| 08/02/2006 | CN1810911A Cerium family raw grinding material, preparing process thereof, cerium family grinding material, and preparing process thereof |
| 08/01/2006 | US7084059 CMP system for metal deposition |
| 08/01/2006 | US7083747 Ultrasonic aerosol generators; transducers; fluid flow; supplying carrier gas; pyrolysis |
| 08/01/2006 | US7083700 Methods and apparatuses for planarizing microelectronic substrate assemblies |
| 08/01/2006 | US7083507 Substrate holding apparatus |
| 08/01/2006 | US7083506 Polishing apparatus |
| 08/01/2006 | US7083502 Method for simultaneous two-disk texturing |
| 08/01/2006 | US7083501 Methods and apparatus for the chemical mechanical planarization of electronic devices |
| 08/01/2006 | US7083497 Polishing pad with built-in optical sensor |
| 08/01/2006 | US7083495 Advanced process control approach for Cu interconnect wiring sheet resistance control |
| 07/27/2006 | WO2006078074A2 Polishing composition and polishing method |
| 07/27/2006 | WO2006077994A1 Substrate polishing method and apparatus |
| 07/27/2006 | WO2006077730A1 Cmp polishing method, cmp polishing apparatus, and process for producing semiconductor device |
| 07/27/2006 | WO2006076857A1 Cmp polishing system and abrasive solution |
| 07/27/2006 | US20060166611 Back pressure control system for CMP and wafer polishing |
| 07/27/2006 | US20060166606 Polishing state monitoring apparatus and polishing apparatus and method |
| 07/27/2006 | US20060166503 Polishing apparatus and polishing method |
| 07/27/2006 | US20060166500 Electroprocessing profile control |
| 07/27/2006 | US20060166487 Method and apparatus for chemical mechanical polishing of semiconductor substrates |
| 07/27/2006 | US20060163074 Biasing via electrodes; electro-chemical mechanical polishing; for semiconductor wafers/integrated circuits |
| 07/27/2006 | US20060162260 Cerium oxide abrasive and slurry containing the same |
| 07/27/2006 | DE102006000766A1 CMP Kissen, das eine radial abwechselnde Rillensegmentkonfiguration aufweist CMP pad having a radially alternating grooves segment configuration |
| 07/26/2006 | EP1683195A1 Semiconductor surface protecting sheet and method |
| 07/26/2006 | EP1534795B1 Method for chemical mechanical polishing (cmp) of low-k dielectric materials |
| 07/26/2006 | CN2799174Y Vertical steel ball finishing machine |
| 07/26/2006 | CN1809445A Polishing pad for electrochemical-mechanical polishing |
| 07/26/2006 | CN1809444A 基片抛光设备和基片抛光方法 A substrate polishing apparatus and a substrate polishing method |
| 07/26/2006 | CN1266243C Abrasive composition and abrasive process using such compositions. |
| 07/25/2006 | US7082345 Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities |
| 07/25/2006 | US7081045 Apparatus for polishing a semiconductor wafer |
| 07/25/2006 | US7081044 Polishing apparatus and polishing pad |
| 07/25/2006 | US7081038 Polishing method and apparatus |
| 07/25/2006 | US7081037 Pad conditioner setup |
| 07/20/2006 | WO2006076449A1 Abrasive composition |
| 07/20/2006 | WO2006076060A1 A thermoplastic chemical mechanical polishing pad and method of manufacture |
| 07/20/2006 | WO2006075527A1 METHOD FOR ABRASING GaN SUBSTRATE |
| 07/20/2006 | WO2006075305A1 Data carrier with limited accessibility |
| 07/20/2006 | WO2006039436A3 Pad design for electrochemical mechanical polishing |
| 07/20/2006 | WO2005067663A3 Devices and methods for optical endpoint detection during semiconductor wafer polishing |
| 07/20/2006 | US20060160475 Chemical mechanical polishing compositions for metal and associated materials and method of using same |
| 07/20/2006 | US20060160470 Methods and apparatuses for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates |
| 07/20/2006 | DE10296621B4 Polierkissen und System Polishing pad and system |
| 07/20/2006 | CA2594786A1 Abrasive composition |
| 07/19/2006 | EP1680271A2 Working surface and system for production thereof |
| 07/19/2006 | EP1181134B1 Method for cleaning a chemical mechanical polishing pad |
| 07/19/2006 | CN2796944Y Polishing parts used for electrochemical machinery polishing |
| 07/19/2006 | CN1805826A Multi-layer polishing pad material for cmp |
| 07/19/2006 | CN1805825A Data processing for monitoring chemical mechanical polishing |
| 07/19/2006 | CN1805824A Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces |
| 07/19/2006 | CN1805823A Polishing machines including under-pads and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces |
| 07/19/2006 | CN1803964A Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using same |
| 07/19/2006 | CN1803400A Magnetic fluid grinding device for ceramic ball surface grinding |
| 07/19/2006 | CN1803399A Surface polishing method and apparatus thereof |
| 07/19/2006 | CN1803398A Cmp pad having a radially alternating groove segment configuration |
| 07/19/2006 | CN1265439C Semicondoctor wafer with improved partial planeness and making method thereof |
| 07/18/2006 | US7078894 Polishing device using eddy current sensor |
| 07/18/2006 | US7078343 Method of manufacturing compound semiconductor wafer |
| 07/18/2006 | US7077882 Gold powders, methods for producing powders and devices fabricated from same |
| 07/18/2006 | US7077880 Mixture containing stabilizer, catalyst, oxidizer; immobilization |
| 07/18/2006 | US7077879 Slurry confining properties; water insoluble matrix of a crosslinked polymer with water soluble particles with waterproof exterior shells |
| 07/18/2006 | US7077733 Subpad support with a releasable subpad securing element and polishing apparatus including the subpad support |
| 07/18/2006 | US7077727 Process for chemical-mechanical polishing of metal substrates |
| 07/18/2006 | US7077726 Semiconductor wafer with improved local flatness, and method for its production |
| 07/18/2006 | US7077721 Pad assembly for electrochemical mechanical processing |
| 07/13/2006 | WO2006073156A1 Polishing slurry |
| 07/13/2006 | WO2006072456A1 Measurement of the thickness of a workpiece with ultrasound or megasound |
| 07/13/2006 | WO2006072452A1 Device ahd method for polishing wafers with abrasive bound in a foamed plastic |
| 07/13/2006 | US20060154570 Monitoring a metal layer during chemical mechanical polishing |
| 07/13/2006 | US20060154569 Platen assembly utilizing magnetic slip ring |
| 07/13/2006 | US20060154568 Multilayer polishing pad and method of making |
| 07/13/2006 | US20060151336 Pad for electrochemical processing |
| 07/13/2006 | US20060151110 Method and apparatus for controlled slurry distribution |
| 07/13/2006 | US20060150860 Alkali-resistant cocoon-shaped colloidal silica particle and process for producing the same |
| 07/13/2006 | DE102004063870A1 Werkstückdickenmessung mit Ultra- oder Megaschall Workpiece thickness measurement with ultrasonic or megasonic |
| 07/13/2006 | DE102004063858A1 Polieren von Wafer mit in schaumplastomergebundenem Korn Polishing of wafers in schaumplastomergebundenem grain |
| 07/12/2006 | EP1678745A2 Improved retaining ring for wafer carriers |
| 07/12/2006 | EP1536920B1 Polishing pad |
| 07/12/2006 | CN1802237A Polishing pad having edge surface treatment |
| 07/12/2006 | CN1799957A Method and apparatus for conveying workpieces, and working machine |
| 07/12/2006 | CN1264201C Polishing method and method for producing semiconductor apparatus |
| 07/11/2006 | US7074115 Polishing pad |