| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 01/04/2007 | US20070004321 Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces |
| 01/04/2007 | US20070004210 Polishing composition and polishing method |
| 01/04/2007 | US20070000874 Method and apparatus for polishing a substrate |
| 01/04/2007 | US20070000872 Method for chemically mechanically polishing organic film, method of manufacturing semiconductor device, and program therefor |
| 01/04/2007 | DE10234956B4 Verfahren zum Steuern des chemisch mechanischen Polierens von gestapelten Schichten mit einer Oberflächentopologie A method for controlling the chemical mechanical polishing of stacked layers with a surface topology |
| 01/03/2007 | EP1739729A1 Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor wafer |
| 01/03/2007 | EP1738871A1 Polishing apparatus |
| 01/03/2007 | EP1568074A4 Carrier head for chemical mechanical polishing apparatus |
| 01/03/2007 | CN1890055A Chemical mechanical polishing method for reducing slurry reflux |
| 01/03/2007 | CN1890054A Even nucleation between silicon and oxide surfaces for thin silicon nitride film growth |
| 01/02/2007 | US7156975 Polishing method and electropolishing apparatus |
| 01/02/2007 | US7156946 Wafer carrier pivot mechanism |
| 01/02/2007 | US7156933 Configuration and method for mounting a backing film to a polish head |
| 01/02/2007 | US7156888 Cerium-based abrasive material and method for preparation thereof |
| 01/02/2007 | US7156727 Web-format polishing pads and methods for manufacturing and using web-format polishing pads in mechanical and chemical-mechanical planarization of microelectronic substrates |
| 01/02/2007 | US7156726 Polishing apparatus and method for forming an integrated circuit |
| 01/02/2007 | US7156725 Substrate polishing machine |
| 01/02/2007 | US7156721 Polishing pad with flow modifying groove network |
| 01/02/2007 | US7156720 Substrate holding apparatus |
| 01/02/2007 | US7156719 Polishing apparatus |
| 01/02/2007 | US7156717 situ finishing aid control |
| 12/28/2006 | US20060292967 Polishing apparatus |
| 12/28/2006 | US20060289826 Hazardous substance decomposer and process for producing the same |
| 12/27/2006 | EP1736574A1 Nitride crystal, epilayer-containing nitride crystal substrate, semiconductor device and method of manufacturing the same |
| 12/27/2006 | CN1292464C Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles |
| 12/27/2006 | CN1292460C Slurry for CMP, polishing method and method of manufacturing semiconductor device |
| 12/27/2006 | CN1292033C Methanol-containing silica-based CMP compositions |
| 12/26/2006 | US7153777 Methods and apparatuses for electrochemical-mechanical polishing |
| 12/26/2006 | US7153767 Chemical mechanical polishing stopper film, process for producing the same, and method of chemical mechanical polishing |
| 12/26/2006 | US7153410 Alternating current, direct current power sources; switches |
| 12/26/2006 | US7153335 Tunable composition and method for chemical-mechanical planarization with aspartic acid/tolyltriazole |
| 12/26/2006 | US7153197 Method for achieving uniform CU CMP polishing |
| 12/26/2006 | US7153196 Method of polishing using a polishing agent |
| 12/21/2006 | US20060286904 Polishing System With In-Line and In-Situ Metrology |
| 12/21/2006 | US20060286350 Chemical mechanical polishing pad having secondary polishing medium capacity control grooves |
| 12/21/2006 | US20060283840 second slurry comprising a resin particle having a primary particle diameter ranging from 0.05 to 5 mu m, and a surfactant having a hydrophilic moiety to greatly minimize the number of defects that may be caused due to the residue of resist |
| 12/21/2006 | US20060283839 Polishing equipment having a longer operating time length |
| 12/21/2006 | US20060283092 Abrasive compounds for semiconductor planarization |
| 12/20/2006 | EP1732732A1 Methods and apparatuses for electrochemical-mechanical polishing |
| 12/20/2006 | CN1883044A Semiconductor surface protecting sheet and method |
| 12/20/2006 | CN1883033A Protecting thin semiconductor wafers during back-grinding in high-volume production |
| 12/20/2006 | CN1881540A A silica and a silica-based slurry |
| 12/20/2006 | CN1881539A Aqueous dispersoid for chemical machinery grinding and grinding method and concocting reagent kit |
| 12/20/2006 | CN1880020A Sandpaper for grinding supporting utensil membrane |
| 12/20/2006 | CN1291462C Slurry for chemical-mechanical polishing method and system and its use |
| 12/20/2006 | CN1291459C Chemical mechanical polishing method and related washing/flushing method |
| 12/20/2006 | CN1290961C Aqueous dispersion body for chemically mechanical polishing and semiconductor device production method |
| 12/20/2006 | CN1290667C Grinding method for shaping bended surface of workpiece |
| 12/19/2006 | US7151056 Method and apparatus for forming a planarizing pad having a film and texture elements for planarization of microelectronic substrates |
| 12/19/2006 | US7150674 Both-side grinding method and both-side grinding machine for thin disc work |
| 12/19/2006 | US7150673 Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus |
| 12/14/2006 | WO2006133249A2 Integrated chemical mechanical polishing composition and process for single platen processing |
| 12/14/2006 | WO2006132725A1 Conditioning element for electrochemical mechanical processing |
| 12/14/2006 | WO2006132055A1 Semiconductor abrasive |
| 12/14/2006 | WO2006081286A3 Multi-layer polishing pad for low-pressure polishing |
| 12/14/2006 | WO2006080796A8 Cerium oxide abrasive and slurry containing the same |
| 12/14/2006 | US20060281395 Retaining ring with flange for chemical mechanical polishing |
| 12/14/2006 | US20060280930 Polishing pad and method of producing the same |
| 12/14/2006 | US20060280929 Polishing pad and method of producing the same |
| 12/14/2006 | DE10208166B4 Verfahren zur Herstellung von Metallleitungen mit verbesserter Gleichförmigkeit auf einem Substrat A process for the production of metal pipes with improved uniformity on a substrate |
| 12/13/2006 | EP1549464B1 Retaining ring for holding semiconductor wafers in a chemical-mechanical polishing device |
| 12/13/2006 | CN1290162C Polishing compound and method for polishing substrate |
| 12/13/2006 | CN1289627C Silica and silica-based slurry |
| 12/13/2006 | CN1289626C Cerium-based polish and cerium-based polish slurry |
| 12/13/2006 | CN1289620C Paste used for polishing copper base metal |
| 12/13/2006 | CN1289619C Silica-based slurry |
| 12/13/2006 | CN1289263C Fixed abrasive article for use in modifying semiconductor wafer and apparatus and modification method |
| 12/12/2006 | US7148189 Halides and salts on silica, alumina, titania and polishing films for integrated circuits |
| 12/12/2006 | US7147544 Glass-ceramics |
| 12/12/2006 | US7147543 Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces |
| 12/12/2006 | US7147541 Thickness control method and double side polisher |
| 12/07/2006 | WO2004053942A3 Measuring alignment between a wafer chuck and polishing/plating receptacle |
| 12/07/2006 | US20060276115 Apparatus and method for conditioning polishing surface, and polishing apparatus and method of operation |
| 12/07/2006 | US20060276113 Polishing cloth, polishing apparatus and method of manufacturing semiconductor devices |
| 12/07/2006 | US20060275939 Composition and method for temporarily fixing solids |
| 12/07/2006 | US20060274326 Method and apparatus for measuring a polishing condition |
| 12/07/2006 | DE102005034119B3 Semiconductor wafer processing e.g. lapping, method for assembly of electronic components, involves processing wafer until it is thinner than rotor plate and thicker than layer, with which recess of plate is lined for wafer protection |
| 12/07/2006 | DE102005026547A1 Vorrichtung zum Drahttrennläppen Apparatus for Drahttrennläppen |
| 12/07/2006 | DE102005026546A1 Wire separation lapping method involves detecting operating parameters of feed rate, pendulum angle, wire tension and deflection angle and regulating one parameter during separation process, such that contact length of wire is kept constant |
| 12/06/2006 | CN1874874A Pad assembly for electrochemical mechanical processing |
| 12/06/2006 | CN1873925A Chemical machanical grinding method, and equipment for preventing rudimental grinding pulp |
| 12/06/2006 | CN1288722C Chemical and mechanical polishing size and chemical and mechanical polishing method using said size |
| 12/05/2006 | US7144848 Cleaning compositions containing hydroxylamine derivatives and processes using same for residue removal |
| 12/05/2006 | US7144815 Chemical mechanical polishing slurry |
| 12/05/2006 | US7144814 Abrasive composition for the integrated circuits electronics industry |
| 12/05/2006 | US7144518 Providing magnetic heads which include CoFe elements; providing a slurry including Al2O3 and H2O2; adjusting the concentration of H2O2 in slurry to within a range of 6 12% by volume; polishing CoFe elements using slurry; and balancing mechanical polishing action |
| 12/05/2006 | US7144304 Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface |
| 12/05/2006 | US7144301 Method and system for planarizing integrated circuit material |
| 12/05/2006 | US7144298 Method for manufacturing semiconductor device and apparatus for manufacturing thereof |
| 11/30/2006 | WO2006127780A2 Cmp retaining ring |
| 11/30/2006 | WO2006127054A1 Smart conditioner rinse station |
| 11/30/2006 | WO2006126432A1 Polishing composition for silicon wafer |
| 11/30/2006 | WO2006126420A1 Method for detecting polishing end in cmp polishing device, cmp polishing device, and semiconductor device manufacturing method |
| 11/30/2006 | US20060270328 Method of producing polishing cloth |
| 11/30/2006 | US20060270325 Polishing pad and chemical mechanical polishing apparatus using the same |
| 11/30/2006 | US20060270323 Polishing apparatus |
| 11/30/2006 | US20060270237 Apparatus and method for pre-conditioning CMP polishing pad |
| 11/29/2006 | EP1726402A1 Wafer polishing apparatus and method for polishing wafers |
| 11/29/2006 | EP1372907B1 Apparatus and methods for aligning a surface of an active retainer ring with a wafer surface during chemical-mechanical polishing |
| 11/29/2006 | CN2841246Y 研磨垫 Polishing pad |