| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 02/07/2007 | EP1646478B1 Method for epiready surface treatment on sic thin films |
| 02/07/2007 | CN2865999Y Magnetic lapping machine |
| 02/07/2007 | CN2865998Y Double-oscillating grinder |
| 02/07/2007 | CN1910012A Retaining ring with shaped surface |
| 02/07/2007 | CN1910011A Chemical mechanical planarization process control utilizing in-situ conditioning process |
| 02/07/2007 | CN1299335C Method and pad for polishing wafer |
| 02/07/2007 | CN1298509C Multi-position micro-hole machining method and apparatus |
| 02/07/2007 | CN1298508C Lapping method |
| 02/06/2007 | US7172963 Manufacturing method of semiconductor integrated circuit device that includes chemically and mechanically polishing two conductive layers using two polishing pads that have different properties |
| 02/06/2007 | US7172663 Applying paste to substrate including particles dispersed in carrier liquid; vapor deposition; oxidation resistance; vaporization of aerosol drops; electronics, capacitors; noncracking, quality |
| 02/06/2007 | US7172497 Fabrication of semiconductor interconnect structures |
| 02/06/2007 | US7172493 Fine force actuator assembly for chemical mechanical polishing apparatuses |
| 02/06/2007 | US7172492 Polishing method and polishing system |
| 02/06/2007 | US7172491 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization |
| 02/01/2007 | WO2006078074A3 Polishing composition and polishing method |
| 02/01/2007 | US20070026770 Abrasive agglomerate polishing method |
| 02/01/2007 | US20070023395 Production method for semiconductor wafer |
| 02/01/2007 | DE10143938B4 Polierkopf für einen Wafer und Polierverfahren unter Verwendung desselben The same polishing head for a wafer and polishing method using |
| 01/31/2007 | EP1747849A1 Composition for polishing |
| 01/31/2007 | EP1490897B1 Tantalum barrier removal solution |
| 01/31/2007 | CN1906739A Method for grinding GaN substrate |
| 01/31/2007 | CN1905991A Polishing pad |
| 01/31/2007 | CN1903968A Aqueous dispersion composition for abrasive particles |
| 01/30/2007 | US7169235 Cleaning method and polishing apparatus employing such cleaning method |
| 01/30/2007 | US7169020 Grinding jig set and grinding method |
| 01/30/2007 | US7169015 Apparatus for optical inspection of wafers during processing |
| 01/30/2007 | US7169014 Apparatuses for controlling the temperature of polishing pads used in planarizing micro-device workpieces |
| 01/30/2007 | US7168267 Forming abrasives comprising aluminum oxide by coalescing |
| 01/25/2007 | WO2007011158A1 Polishing pad containing interpenetrating liquified vinyl monomer network with polyurethane matrix therein |
| 01/25/2007 | WO2007010766A1 Layered sheets and processes for producing the same |
| 01/25/2007 | WO2007010717A1 Double side polishing method for wafer |
| 01/25/2007 | WO2006085614A3 Cushioning material for polishing pad |
| 01/25/2007 | US20070021043 Chemical mechanical polishing apparatus with rotating belt |
| 01/25/2007 | US20070021042 Method for machining a semiconductor wafer on both sides in a carrier, carrier, and a semiconductor wafer produced by the method |
| 01/25/2007 | US20070021038 Cmp apparatus and process sequence method |
| 01/25/2007 | US20070021037 Polishing Assembly With A Window |
| 01/24/2007 | EP1745888A1 Linearly advancing polishing method and apparatus |
| 01/24/2007 | CN2860737Y Magnetic fluid grinding device for grinding ceramic ball surface |
| 01/24/2007 | CN1901142A Method for machining a semiconductor wafer on both sides in a carrier, carrier, and a semiconductor wafer produced by the method |
| 01/24/2007 | CN1900192A Polishing composition and polishing method |
| 01/23/2007 | US7166019 Flexible membrane for a polishing head and chemical mechanical polishing (CMP) apparatus having the same |
| 01/23/2007 | US7166018 Apparatus and method for feeding slurry |
| 01/23/2007 | US7166017 Slurry for CMP, polishing method and method of manufacturing semiconductor device |
| 01/23/2007 | US7166015 Apparatus and method for controlling fluid material composition on a polishing pad |
| 01/23/2007 | US7166014 Chemical mechanical planarization process control utilizing in-situ conditioning process |
| 01/23/2007 | US7166013 Polishing apparatus and method for producing semiconductors using the apparatus |
| 01/23/2007 | US7165894 Polishing fixture |
| 01/23/2007 | US7165317 Electrode extension sheet for use in a lapping apparatus |
| 01/18/2007 | WO2007007683A1 Substrate, and method and device for polishing same |
| 01/18/2007 | WO2006093670A3 Polishing pad for use in polishing work pieces |
| 01/18/2007 | WO2006071651A3 Spectral imaging of substrates |
| 01/18/2007 | US20070015448 Polishing pad having edge surface treatment |
| 01/18/2007 | US20070015443 Semiconductor processor systems, systems configured to provide a semiconductor workpiece process fluid, semiconductor workpiece processing methods, methods of preparing semiconductor workpiece process fluid, and methods of delivering semiconductor workpiece process fluid to a semiconductor processor |
| 01/18/2007 | US20070015442 Method and apparatus for measuring abrasion amount and pad friction force of polishing pad using thickness change of slurry film |
| 01/18/2007 | US20070015441 Apparatus and Method for In-Situ Endpoint Detection for Chemical Mechanical Polishing Operations |
| 01/18/2007 | DE10323743B4 Freilegemasse, Freilegeverfahren und Freilegevorrichtung Uncovering compound, uncovering process and uncovering apparatus |
| 01/17/2007 | EP1744348A2 A semiconductor manufacturing apparatus having a built-in inspection apparatus and method therefor |
| 01/17/2007 | EP1743362A1 Loading device for chemical mechanical polisher of semiconductor wafer |
| 01/17/2007 | CN1898791A Support system for semiconductor wafers and methods thereof |
| 01/17/2007 | CN1897227A Manufacture of semiconductor device with cmp |
| 01/17/2007 | CN1897226A Mechamical polisher |
| 01/17/2007 | CN1295758C CMP sizing material, polishing method and method for manufacturing semiconductor device |
| 01/17/2007 | CN1295292C Metal oxide powder for high precision polishing and method of preparation thereof |
| 01/17/2007 | CN1295291C Polishing slurry comprising silica-coated ceria |
| 01/16/2007 | USRE39471 Apparatus for and method for polishing workpiece |
| 01/16/2007 | US7163895 Polishing method |
| 01/16/2007 | US7163644 For planarizing the surface of a substrate, storage stability |
| 01/16/2007 | US7163450 Abrasive pad |
| 01/16/2007 | US7163448 Chemical/mechanical polishing method for STI |
| 01/16/2007 | US7163447 Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces |
| 01/16/2007 | US7163444 Pad constructions for chemical mechanical planarization applications |
| 01/16/2007 | US7163442 Method of making micro titer plates and micro titer plates made thereby |
| 01/16/2007 | US7163439 Methods and systems for conditioning planarizing pads used in planarizing substrates |
| 01/16/2007 | US7163438 Zone polishing using variable slurry solid content |
| 01/16/2007 | US7163053 Heat exchanger |
| 01/11/2007 | US20070010170 Methods and systems for conditioning planarizing pads used in planarizing substrates |
| 01/11/2007 | US20070007248 Compositions and methods for chemical mechanical polishing silica and silicon nitride |
| 01/11/2007 | US20070007012 Flow completion system |
| 01/10/2007 | EP1157409A4 Combination cmp-etch method for forming a thin planar layer over the surface of a device |
| 01/10/2007 | EP1128932A4 Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization |
| 01/10/2007 | CN2855641Y Structure for positioning chip protective ring |
| 01/10/2007 | CN1893021A Manufacturing method of semiconductor integrated circuit device |
| 01/10/2007 | CN1294629C Silicon semiconductor crystal wafers and manufacturing method for multiple semiconductor crystal wafers |
| 01/09/2007 | US7160739 Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles |
| 01/09/2007 | US7160493 Retaining ring for use on a carrier of a polishing apparatus |
| 01/09/2007 | US7160432 Method and composition for polishing a substrate |
| 01/09/2007 | US7160413 Layered support and method for laminating CMP pads |
| 01/09/2007 | US7160181 Polishing pad of CMP equipment for polishing a semiconductor wafer |
| 01/09/2007 | US7160180 Substrate delivery mechanism |
| 01/09/2007 | US7160179 Methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 01/09/2007 | US7160178 In situ activation of a three-dimensional fixed abrasive article |
| 01/09/2007 | US7160177 Method and device for the high-precision machining of the surface of an object, especially for polishing and lapping semiconductor substrates |
| 01/09/2007 | US7160173 Abrasive articles and methods for the manufacture and use of same |
| 01/04/2007 | WO2007001700A2 Polishing pad comprising magnetically sensitive particles and method for the use thereof |
| 01/04/2007 | WO2007001699A1 Tranparent microporous materials for cmp |
| 01/04/2007 | WO2007000852A1 Abrasive and process for producing semiconductor integrated-circuit unit |
| 01/04/2007 | WO2005105356A3 Electrochemical mechanical planarization process and apparatus |
| 01/04/2007 | US20070004324 Polishing apparatus |
| 01/04/2007 | US20070004323 Polishing composition and polishing method |
| 01/04/2007 | US20070004322 Polishing composition and polishing method |