Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
03/2007
03/08/2007US20070051355 Brazed diamond tools and methods for making the same
03/08/2007US20070051354 Brazed diamond tools and methods for making the same
03/08/2007DE102006033919A1 Polierzusammensetzung und Polierverfahren Polishing composition and polishing method
03/07/2007EP1760127A2 Polishing method
03/07/2007EP1759811A1 Method of adhering polishing pads and jig for adhering the same
03/07/2007EP1759810A1 Wafer polishing method and polished wafer
03/07/2007EP1758962A1 Polishing method for glass substrate, and glass substrate
03/07/2007EP1758711A1 Polishing apparatus and polishing method
03/07/2007EP1365888B1 Projected gimbal point drive
03/07/2007EP1360033B1 Abrasive article suitable for modifying a semiconductor wafer
03/07/2007CN1926666A Polishing pad and method of manufacturing semiconductor device
03/07/2007CN1923943A Polishing composition
03/07/2007CN1923935A 抛光组合物及抛光方法 Polishing composition and polishing method
03/07/2007CN1303655C Polishing method for base copper-layer
03/06/2007US7186654 Chemical mechanical polishing slurry and method of manufacturing semiconductor device by using the same
03/06/2007US7186651 Chemical mechanical polishing method and apparatus
03/06/2007US7186629 Protecting thin semiconductor wafers during back-grinding in high-volume production
03/06/2007US7186448 comprises liquid crystal compounds for fixing a pad for chemical mechanical polishing of semiconductor wafers
03/06/2007US7186322 Methods of producing and polishing semiconductor device and polishing apparatus
03/06/2007US7186168 Chemical mechanical polishing apparatus and methods for chemical mechanical polishing
03/06/2007US7186166 Fiber embedded polishing pad
03/06/2007US7186164 Processing pad assembly with zone control
03/05/2007WO2007049566A1 Adhesive composition and adhesive film
03/01/2007WO2007025226A1 Polishing pad and method for manufacturing polishing pads
03/01/2007WO2007024807A2 Apparatus and methods for spectrum based monitoring of chemical mechanical polishing
03/01/2007WO2007024464A1 Surface textured microporous polishing pads
03/01/2007US20070050077 Chemical Mechanical Polishing Method and Apparatus
03/01/2007US20070049180 Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion, chemical mechanical polishing process, and process for producing semiconductor devices
03/01/2007US20070049169 Nonwoven polishing pads for chemical mechanical polishing
03/01/2007US20070049168 Polishing pad, pad dressing evaluation method, and polishing apparatus
03/01/2007US20070049166 Polishing method and polishing apparatus
03/01/2007US20070045232 Wafer polishing method and polished wafer
03/01/2007US20070044913 Grooved Retaining Ring
02/2007
02/28/2007EP1758154A1 Silicon wafer manufacturing method and silicon wafer
02/28/2007EP1757665A1 Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion for a chemical mechanical polishing process, and process for producing semiconductor devices
02/28/2007EP1757406A1 Abrasive cloth and method for preparing nano-fiber structure
02/28/2007EP1756244A1 Cerium oxide abrasive and slurry containing the same
02/28/2007EP1755826A2 Polishing pad
02/28/2007CN1919955A Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion, chemical mechanical polishing process, and process for producing semiconductor devices
02/28/2007CN1302515C Semiconductor manufacturing apparatus having a built-in inspection apparatus and a device manufacturing method using said manufacturing apparatus
02/27/2007US7183213 Chemical mechanical polishing pad and chemical mechanical polishing method
02/27/2007US7183212 Polishing method, metallization fabrication method, method for manufacturing semiconductor device and semiconductor device
02/27/2007US7183211 Process for chemical mechanical polishing of semiconductor substrate and aqueous dispersion for chemical mechanical polishing
02/27/2007US7182882 Method of improving chemical mechanical polish endpoint signals by use of chemical additives
02/27/2007US7182680 Apparatus for conditioning processing pads
02/27/2007US7182670 CMP pad having a streamlined windowpane
02/27/2007US7182669 Methods and systems for planarizing workpieces, e.g., microelectronic workpieces
02/27/2007US7182668 Methods for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates
02/22/2007WO2007021414A1 Chemically modified polishing pad for chemical mechanical polishing
02/22/2007WO2007020939A1 Polishing slurry
02/22/2007WO2007020859A1 Substrate polishing apparatus and substrate polishing method
02/22/2007WO2007001700A3 Polishing pad comprising magnetically sensitive particles and method for the use thereof
02/22/2007US20070042693 Polishing pad and method of manufacture
02/22/2007US20070042682 Transparent polishing pad
02/21/2007EP1754571A1 Retaining ring in a carrier head for a chemical mechanical polishing system
02/21/2007EP1281199B1 Metal chemical mechanical polishing process for minimizing dishing during semiconductor wafer fabrication
02/21/2007CN1915598A Polishing pad and method of manufacture
02/21/2007CN1915596A 透明抛光垫 Transparent polishing pad
02/21/2007CN1301184C Optical grinding machine and method for processing sapphire crystal substrate for semiconductor use
02/20/2007US7180591 Semiconductor processors, sensors, semiconductor processing systems, semiconductor workpiece processing methods, and turbidity monitoring methods
02/15/2007WO2007018391A1 Chemical mechanical polishing apparatus
02/15/2007WO2007018117A1 Electron beam assisted eem method
02/15/2007US20070037491 Chemically modified chemical mechanical polishing pad, process of making a modified chemical mechanical polishing pad and method of chemical mechanical polishing
02/15/2007US20070037486 Polishing pad, method of manufacturing the polishing pad, and chemical mechanical polishing apparatus comprising the polishing pad
02/15/2007US20070034506 Pad assembly for electrochemical mechanical processing
02/15/2007US20070034335 Retainer ring of chemical mechanical polishing device
02/14/2007EP1752521A1 Aqueous dispersion medium for abrasive particles
02/14/2007EP1751243A1 Cmp porous pad with component-filled pores
02/14/2007EP1458520B1 Methods for planarization of group viii metal-containing surfaces using a fixed abrasive article
02/14/2007CN2868552Y Retainer ring fixed by magnetic mode
02/14/2007CN2868551Y High-precision lapping machine lowr mould plate shift-out mechanism
02/14/2007CN1914712A Temperature controlled hot edge ring assembly for reducing plasma reactor etch rate drift
02/14/2007CN1914711A Polishing apparatus and substrate processing apparatus
02/14/2007CN1914241A 聚氨酯抛光垫 Polyurethane polishing pad
02/14/2007CN1914004A Multi-step pad conditioning system and method for chemical planarization
02/14/2007CN1300828C Chemical mechanical polishing method for semiconductor substrate and water-dispersion solution for chemical mechanical polishing
02/14/2007CN1300769C Multi-chambered, compliant apparatus for restraining workpiece and applying variable pressure thereto during lapping to improve flatness characteristics of workpiece
02/14/2007CN1300277C Abrasive material
02/14/2007CN1300276C Cerium based abrasive material, method of quality examination therefor and method for production thereof
02/14/2007CN1299878C Apparatus for preparing grinding liquid
02/13/2007US7177019 Apparatus for imaging metrology
02/13/2007US7176145 Manufacturing method of semiconductor device
02/13/2007US7175915 Method of producing polyurethane pads produced therewith
02/13/2007US7175515 Static pad conditioner
02/13/2007US7175510 Method and apparatus for conditioning a polishing pad
02/13/2007US7175508 Polishing apparatus, method of manufacturing semiconductor device using the same, and semiconductor device manufactured by this method
02/13/2007US7175505 Method for adjusting substrate processing times in a substrate polishing system
02/13/2007US7175504 Vacuum suction holding apparatus and holding method, polishing apparatus using this holding apparatus, and device manufacturing method using this polishing apparatus
02/13/2007US7175503 Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device
02/08/2007WO2007016498A2 Nonwoven polishing pads for chemical mechanical polishing
02/08/2007WO2007015911A1 Self-contained conditioning abrasive article
02/08/2007WO2007015909A1 Abrasive agglomerate polishing method
02/08/2007WO2007015163A1 Precision machining apparatus and precision machining method
02/08/2007WO2007014732A2 Method and device for subsequently treating glass panes
02/08/2007US20070032182 Polishing pad and method of fabricating semiconductor substrate using the pad
02/08/2007US20070032175 Polishing cloth, polishing cloth processing method, and substrate manufacturing method using same
02/08/2007US20070032174 Polishing apparatus
02/08/2007US20070032171 Methods and systems for conditioning planarizing pads used in planarizing susbstrates
02/08/2007US20070032170 Polishing pad with built-in optical sensor
02/08/2007US20070029285 Polishing method
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