| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 04/04/2007 | CN1941310A Method of fabricating self-aligned contact pad using chemical mechanical polishing process |
| 04/04/2007 | CN1939995A Aqueous polishing liquid and chemical mechanical polishing method |
| 04/04/2007 | CN1939992A Polishing slurry, method of treating surface of gaxin1-xasyp1-y crystal and gaxin1-xasyp1-y crystal substrate |
| 04/04/2007 | CN1939991A Polishing composition and polishing method |
| 04/04/2007 | CN1939663A Polishing method, polishing composition and polishing composition kit |
| 04/04/2007 | CN1309026C Method of machining semiconductor wafer-use polishing pad and semiconductor wafer-use polishing pad |
| 04/03/2007 | USRE39547 Method and apparatus for endpointing mechanical and chemical-mechanical polishing of substrates |
| 04/03/2007 | US7198729 Slurry capable of reducing scratches on a region to be polished during Chemical Mechanical Polishing |
| 04/03/2007 | US7198552 Polishing apparatus |
| 04/03/2007 | US7198551 Substrate polishing apparatus |
| 04/03/2007 | US7198549 Continuous contour polishing of a multi-material surface |
| 04/03/2007 | US7198546 Method to monitor pad wear in CMP processing |
| 04/03/2007 | US7198544 Polishing pad with window |
| 04/03/2007 | US7198542 Method and system for controlling the chemical mechanical polishing by using a seismic signal of a seismic sensor |
| 03/29/2007 | WO2007034980A1 Polymer material, foam obtained from same, and polishing pad using those |
| 03/29/2007 | WO2007034646A1 Dresser for polishing cloth |
| 03/29/2007 | US20070072519 Viscoelastic polisher and polishing method using the same |
| 03/29/2007 | US20070072427 Method for fabricating semiconductor device and polishing method |
| 03/29/2007 | US20070072407 Method of fabricating self-aligned contact pad using chemical mechanical polishing process |
| 03/29/2007 | US20070069176 Aqueous polishing liquid and chemical mechanical polishing method |
| 03/29/2007 | US20070068086 Organic sulfonic acid, aromatic heterocyclic ring compound such as 1,2,3,4-tetrazole, and an oxidizing agent; chemical mechanical polishing; excellent in assuring polishing speed ratio between metal wiring made of copper and barrier metal as a film for copper diffusion prevention; dishing suppression |
| 03/29/2007 | DE102005016411B4 Vorrichtung zur hochgenauen Oberflächenbearbeitung eines Werkstückes The high-precision surface machining of a workpiece |
| 03/28/2007 | EP1767602A2 Metal-polishing liquid and chemical-mechanical polishing method |
| 03/28/2007 | EP1765553A1 Abrasive material having an antiloading coating |
| 03/28/2007 | CN2882902Y Two-way driving gear realized by two acting cylinders through closed abrasive materials |
| 03/28/2007 | CN1938122A Vacuum chuck and suction board |
| 03/28/2007 | CN1935927A Cerium oxide abrasive and method of polishing substrates |
| 03/28/2007 | CN1935461A Water-based polishing pads having improved adhesion properties and methods of manufacture |
| 03/28/2007 | CN1307279C Method for manufacturing substrate |
| 03/28/2007 | CN1307275C Tungsten polishing solution |
| 03/27/2007 | US7196011 Apparatus and method for treating substrates |
| 03/27/2007 | US7196010 Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the same |
| 03/27/2007 | US7196009 Lapping carrier, apparatus for lapping a wafer and method of fabricating a lapping carrier |
| 03/27/2007 | US7195546 Polishing apparatus and method of polishing work piece |
| 03/27/2007 | US7195544 CMP porous pad with component-filled pores |
| 03/27/2007 | US7195540 Method and system for endpoint detection |
| 03/27/2007 | US7195539 Polishing pad with recessed window |
| 03/27/2007 | US7195537 Systems and methods for detecting device-under-test dependency |
| 03/27/2007 | US7195536 Integrated endpoint detection system with optical and eddy current monitoring |
| 03/22/2007 | WO2007032519A1 Polishing method and polishing apparatus, and program for controlling polishing apparatus |
| 03/22/2007 | WO2007032517A1 Polishing platen and polishing apparatus |
| 03/22/2007 | US20070066201 Conductive polishing article for electrochemical mechanical polishing |
| 03/22/2007 | US20070066200 Perforation and grooving for polishing articles |
| 03/22/2007 | US20070066196 Method of forming a stacked polishing pad using laser ablation |
| 03/22/2007 | US20070066195 Water-based polishing pads having improved adhesion properties and methods of manufacture |
| 03/22/2007 | US20070066189 Off-line tool for breaking in multiple pad conditioning disks used in a chemical mechanical polishing system |
| 03/22/2007 | US20070066066 Polishing method for glass substrate, and glass substrate |
| 03/22/2007 | US20070066065 Metal-polishing liquid and chemical-mechanical polishing method |
| 03/22/2007 | US20070063453 Vacuum chuck and suction board |
| 03/22/2007 | DE102006042674A1 Polishing pad for chemical mechanical planarization of substrates such as semiconductor wafer, comprises polymeric matrix dispersed with microspheres and formed from water-based polymer or its blends, applied on substrate |
| 03/21/2007 | EP1764189A1 Method of manufacturing chemical mechanical polishing pad |
| 03/21/2007 | CN1934208A Cmp porous pad with component-filled pores |
| 03/21/2007 | CN1933939A Polishing pad comprising hydrophobic region and endpoint detection port |
| 03/21/2007 | CN1933938A Low surface energy cmp pad |
| 03/21/2007 | CN1931523A Chemomechanical grinder and its grinding pad regulating method |
| 03/21/2007 | CN1931522A Trimmer for trimming wafer grinding pan and its making process |
| 03/21/2007 | CN1306569C Method for uniform polish microelectronic device |
| 03/21/2007 | CN1306562C Polishing compound, method for production thereof, and polishing method |
| 03/21/2007 | CN1305985C Slurry for CMP, and method of manufacturing semiconductor device |
| 03/21/2007 | CN1305984C Method for chemical mechanical polishing (cmp) of low-k dielectric materials |
| 03/21/2007 | CN1305547C Filter and using method thereof |
| 03/20/2007 | US7193724 Method for measuring thickness of thin film-like material during surface polishing, and surface polishing method and surface polishing apparatus |
| 03/20/2007 | US7192340 Polishing pad, method of producing the same, and cushion layer for polishing pad |
| 03/20/2007 | US7192336 Method and apparatus for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates |
| 03/20/2007 | US7192335 Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates |
| 03/15/2007 | WO2007030779A2 Apparatus and method for polishing objects using object cleaners |
| 03/15/2007 | WO2007029465A1 Polishing agent, method for polishing surface to be polished, and method for manufacturing semiconductor integrated circuit device |
| 03/15/2007 | WO2006108191A3 Seventy five millimeter silicon carbide wafer with low warp, bow, and ttv |
| 03/15/2007 | US20070061088 System and Method for the Identification of Chemical Mechanical Planarization Defects |
| 03/15/2007 | US20070061036 Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus |
| 03/15/2007 | US20070060027 Equipment and method for polishing both sides of a rectangular substrate |
| 03/15/2007 | US20070060023 Apparatus and method for polishing objects using object cleaners |
| 03/15/2007 | DE19839086B4 Rückhaltering für eine chemisch-mechanische Poliervorrichtung und chemisch-mechanische Poliervorrichtung damit Retaining ring for a chemical mechanical polishing apparatus, and chemical-mechanical polishing apparatus so that |
| 03/14/2007 | EP1307320B1 Apparatus and method for chemical mechanical polishing of substrates |
| 03/14/2007 | CN1930664A Polishing agent and polishing method |
| 03/14/2007 | CN1929956A Undulated pad conditioner and method of using same |
| 03/14/2007 | CN1929955A Insulated pad conditioner and method of using same |
| 03/14/2007 | CN1929954A Linearly advancing polishing method and apparatus |
| 03/14/2007 | CN1929952A Devices and methods for optical endpoint detection during semiconductor wafer polishing |
| 03/13/2007 | US7190099 Motor |
| 03/13/2007 | US7189333 End effectors and methods for manufacturing end effectors with contact elements to condition polishing pads used in polishing micro-device workpieces |
| 03/13/2007 | US7189155 Polishing body, polishing apparatus, semiconductor device, and semiconductor device manufacturing method |
| 03/13/2007 | US7189153 Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces |
| 03/13/2007 | US7189151 Embedding tool designed to embed grains into faceplate for lapping apparatus |
| 03/13/2007 | US7189146 Method for reduction of defects in wet processed layers |
| 03/13/2007 | US7189141 Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus |
| 03/08/2007 | WO2007027944A1 Grooved retaining ring |
| 03/08/2007 | WO2007027068A1 Cerium oxide powder for one-component cmp slurry, preparation method thereof, one-component cmp slurry composition comprising the same, and method of shallow trench isolation using the slurry |
| 03/08/2007 | WO2007026863A1 Polishing method |
| 03/08/2007 | WO2007026862A1 Polishing composition |
| 03/08/2007 | WO2007026861A1 Polishing composition |
| 03/08/2007 | WO2007026610A1 Laminate polishing pad |
| 03/08/2007 | WO2007026569A1 Polishing pad |
| 03/08/2007 | WO2007026556A1 Method and system for mirror-polishing semiconductor wafer |
| 03/08/2007 | US20070054606 Method of adhering polishing pads and jig for adhering the same |
| 03/08/2007 | US20070054603 Wafer carrier with pressurized membrane and retaining ring actuator |
| 03/08/2007 | US20070054599 Apparatus and method of controlling the temperature of polishing pads used in planarizing micro-device workpieces |
| 03/08/2007 | US20070051918 aqueous acid suspension of individualized colloidal silica particles not linked to each other by siloxane bonds, and a surfactant; for mechanical chemical polishing |
| 03/08/2007 | US20070051639 Work piece wetted with a low-conductivity fluid is contacted with a first side of a charge-selective ion-conducting membrane,the second side of which contacts a conductive electrolyte solution in electrical contact with a cathode; can be used for both pure metals and alloys |
| 03/08/2007 | US20070051632 Polishing method, polishing apparatus, plating method, and plating apparatus |