Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
05/2007
05/03/2007WO2007050313A1 Cmp of copper/ruthenium substrates
05/03/2007US20070099552 Conductive pad with ion exchange membrane for electrochemical mechanical polishing
05/03/2007US20070099426 Polishing method, polishing apparatus, and electrolytic polishing apparatus
05/03/2007US20070096315 Ball contact cover for copper loss reduction and spike reduction
05/03/2007US20070094936 Abrasive slurry having high dispersion stability and manufacturing method for a substrate
05/02/2007EP1778439A2 Methods for producing in-situ grooves in chemical mechanical planarization (cmp) pads, and novel cmp pad designs
05/02/2007CN2894939Y Drive separating device of upper-lower grinding disk for two-side lapping machine
05/02/2007CN2894938Y Pneumatic device for two-side lapping machine
05/02/2007CN2894937Y Electric device for two-side lapping machine
05/02/2007CN2894935Y Steel wire arrangemetn for hard material slicing machine
05/02/2007CN2894934Y Roller structure for hard material slicing machine
05/02/2007CN2894933Y Sand-preventing device of roller rotation shaft bearing for hard material slicing machine
05/02/2007CN1957253A Method for evaluating quality of abrasive particles, method for polishing glass and abrasive composition for polishing glass
05/02/2007CN1956819A Polishing pad with oscillating path groove network
05/02/2007CN1954967A Lapping pad and its manufacturing method
05/02/2007CN1314096C CMP process involving frequency analysis-based monitoring
05/02/2007CN1313216C Modular controlled platen preparation system and method
05/01/2007US7211460 Methods for exposing device features on a semiconductor device
05/01/2007US7211122 Polishing composition and rinse composition
05/01/2007US7211121 Polishing composition
05/01/2007US7210989 Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces
05/01/2007US7210982 Method and apparatus for polishing a substrate
04/2007
04/26/2007WO2007046420A1 Cerium oxide slurry, cerium oxide polishing liquid, and method for polishing substrate by using those
04/26/2007US20070093186 Substrate delivery mechanism
04/26/2007US20070093064 Polishing method of Cu film and method for manufacturing semiconductor device
04/25/2007EP1777736A1 Electrolytic processing device and substrate processing apparatus
04/25/2007EP1776300A2 Non-contact support platforms for distance adjustment
04/25/2007EP1483182A4 Reinforced chemical mechanical planarization belt
04/25/2007CN1953842A Composition for polishing
04/25/2007CN1951634A Method of adhering polishing pads and jig for adhering the same
04/25/2007CN1312742C Polishing disk, polishing machine and method for manufacturing semiconductor
04/25/2007CN1312740C Grinding work holding disk, work grinding device and grinding method
04/25/2007CN1312739C Chemical mechanical polishing pad with micro-holes
04/24/2007US7208111 Method of producing inlaid polishing pad
04/24/2007US7207878 Conductive polishing article for electrochemical mechanical polishing
04/24/2007US7207870 Seal assembly manufacturing methods and seal assemblies manufactured thereby
04/24/2007US7207862 Polishing apparatus and method for detecting foreign matter on polishing surface
04/19/2007WO2007043614A1 Cerium polishing material
04/19/2007WO2007043517A1 Polishing solution for cmp and method of polishing
04/19/2007WO2007043263A1 Truing member for abrasive pad and truing method of abrasive pad
04/19/2007WO2007042681A2 Abrasive aqueous suspension based on cerium and silica dioxide particles for polishing surfaces of materials
04/19/2007US20070087671 Method of adhering polishing pads and jig for adhering the same
04/19/2007US20070087666 Grinding jig set and grinding method
04/19/2007US20070087663 Polishing apparatus
04/19/2007US20070087662 Friction sensor for polishing system
04/19/2007US20070087570 Planarization of a heteroepitaxial layer
04/19/2007US20070087177 Stacked pad and method of use
04/19/2007US20070084131 Abrasive Articles and Methods for the Manufacture and Use of Same
04/19/2007DE112005000723T5 Polierkissen und Verfahren zur Herstellung desselben Polishing pad and method for manufacturing the same
04/18/2007EP1775068A1 Method of adhering polishing pads and jig for adhering the same
04/18/2007EP1773541A1 Real time polishing process monitoring
04/18/2007EP1226220B1 Polishing system and method of its use
04/18/2007CN2889612Y Dynamically synchronous abrading machine
04/18/2007CN1950930A Polishing pad and method for manufacture of semiconductor device using the same
04/18/2007CN1947944A Technique for nanometer grade super smooth processing gallium phosphide wafer
04/18/2007CN1947943A Method and device for internally machining cylinder jacket
04/18/2007CN1311009C Additive composition, slurry composition including the same, and method of polishing an object using the slurry composition
04/17/2007US7205265 Cleaning compositions and methods of use thereof
04/17/2007US7204924 Method and apparatus to deposit layers with uniform properties
04/17/2007US7204917 Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same
04/17/2007US7204865 Polishing composition
04/17/2007US7204742 Polishing pad comprising hydrophobic region and endpoint detection port
04/17/2007US7204679 Flow control system
04/12/2007WO2007041020A1 Polishing apparatus and method with direct load platen background
04/12/2007WO2007040103A1 Abrasive cloth and process for production thereof
04/12/2007US20070082581 Systems and methods for detecting device-under-test dependency
04/12/2007US20070081931 abrasive material for polishing silicon oxide layer or silicon nitride layer on silicon substrate; forming a shallow trench isolation; chemical mechanical polishing; obtained via a low-temperature calcination, pulverization, and a high-temperature calcination; high pore fraction and low strength
04/12/2007US20070080142 Method and apparatus for forming a planarizing pad having a film and texture elements for planarization of microelectronic substrates
04/12/2007US20070079933 Method and apparatus for forming a planarizing pad having a film and texture elements for planarization of microelectronic substrates
04/12/2007DE10117612B4 Polieranlage Polishing System
04/11/2007EP1772503A2 Polishing slurry, method of treating surface of GaxIn1-xAsyP1-y crystal and GaxIn1-xAsyP1-y crystal substrate
04/11/2007EP1771279A1 Polishing apparatus and substrate processing method
04/11/2007EP1397828A4 Electrolytic processing device and substrate processing apparatus
04/11/2007CN1946516A Abrasive cloth and method for preparing nano-fiber structure
04/11/2007CN1943993A Polishing pad and polishing apparatus
04/10/2007US7203564 Treatment condition decision method, treatment condition decision system, treatment system, treatment condition decision calculator program, program recording medium, and semiconductor device manufacturing method
04/10/2007US7201829 Mask plate design
04/10/2007US7201647 Subpad having robust, sealed edges
04/10/2007US7201642 Process for producing improved membranes
04/10/2007US7201641 For the polishing of the surfaces of semiconductor wafers
04/10/2007US7201640 Method of sucking water and water sucking device
04/10/2007US7201639 Powder for disks
04/10/2007US7201637 Simultaneous planarization of pole piece and coil materials for write head applications
04/10/2007US7201636 Chemical mechanical polishing a substrate having a filler layer and a stop layer
04/10/2007US7201635 Methods and systems for conditioning planarizing pads used in planarizing substrates
04/10/2007US7201633 Systems and methods for wafer polishing
04/10/2007US7201632 In-situ chemical-mechanical planarization pad metrology using ultrasonic imaging
04/05/2007WO2007037319A1 Jig for polishing disc-like member, method for polishing rear surface of disc-like member and machine for polishing rear surface of disc-like member
04/05/2007US20070077868 Cerium-based abrasive, abrasive slurry, and production of cerium-based abrasive
04/05/2007US20070077867 Polishing pad and polishing apparatus
04/05/2007US20070077862 System for Endpoint Detection with Polishing Pad
04/05/2007US20070077764 Polishing method, polishing composition and polishing composition kit
04/05/2007US20070075041 Chemically mechanically polishing the surface gallium-indium-arsenide-phosphide crystal using polishing slurry containing abrasive grains formed of SiO2; crystal surface having a small surface roughness can be formed at a high polishing rate and effectively
04/05/2007US20070074457 Polishing composition and polishing method
04/04/2007EP1770768A2 Polishing method, polishing composition and polishing composition kit
04/04/2007EP1770136A2 Polishing composition and polishing method
04/04/2007EP1622743A4 Whole-substrate spectral imaging system for cmp
04/04/2007CN1943018A Polishing slurry
04/04/2007CN1943017A Metal polishing liquid and polishing method using it
04/04/2007CN1943016A Loading device for chemical mechanical polisher of semiconductor wafer
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