| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 06/07/2007 | US20070128851 Fabrication of semiconductor interconnect structures |
| 06/06/2007 | EP1560890B1 Cmp method utilizing amphiphilic non-ionic surfactants |
| 06/06/2007 | EP1197293B1 Polishing device and method |
| 06/06/2007 | CN2908035Y Multi-station semi-automatic inner pore digital controlled grinding device |
| 06/06/2007 | CN1974636A Chemical mechanical polishing method and pulp, and method of manufacturing semiconductor device |
| 06/06/2007 | CN1974129A Polishing method |
| 06/06/2007 | CN1974124A Voltage mode current control method and system |
| 06/06/2007 | CN1320610C CMP polishing pad including solid catalyst |
| 06/06/2007 | CN1320078C Polishing composition |
| 06/05/2007 | US7226864 Method for producing a silicon wafer |
| 06/05/2007 | US7226547 Electroluminescent phosphor powders, methods for making phosphor powders and devices incorporating same |
| 06/05/2007 | US7226337 Platen and head rotation rates for monitoring chemical mechanical polishing |
| 06/05/2007 | US7226336 Method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips |
| 05/31/2007 | WO2007061064A1 Polishing pad for device wafer |
| 05/31/2007 | WO2007060869A1 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method |
| 05/31/2007 | WO2007060859A1 Polishing fluid for polishing aluminum films and method for polishing aluminum films with the same |
| 05/31/2007 | WO2007060673A2 Incorporation of particulate additives into metal working surfaces |
| 05/31/2007 | WO2007042681A3 Abrasive aqueous suspension based on cerium and silica dioxide particles for polishing surfaces of materials |
| 05/31/2007 | WO2006127780A3 Cmp retaining ring |
| 05/31/2007 | WO2006108191A8 Seventy five millimeter silicon carbide wafer with low warp, bow, and ttv |
| 05/31/2007 | US20070123153 Texturing slurry and texturing method by using same |
| 05/31/2007 | US20070123152 Incorporation of particulate additives into metal working surfaces |
| 05/31/2007 | US20070123151 Apparatus for optical inspection of wafers during polishing |
| 05/31/2007 | US20070123150 Method of evaluating the quality of a lapping plate |
| 05/31/2007 | US20070123149 Apparatus for evaluating the quality of a lapping plate |
| 05/31/2007 | US20070122921 Copper Wiring Module Control |
| 05/31/2007 | US20070122549 forming a solar cell conductive feature using monodisperse silver or silver alloy fine particles coated with a ceramic or metal; silver particles made in an aerosol stream and coated by vapor deposition |
| 05/31/2007 | US20070120436 Motor |
| 05/31/2007 | US20070120090 System for the Preferential Removal of Silicon Oxide |
| 05/31/2007 | US20070119817 Manufacturing method of silicon wafer |
| 05/31/2007 | DE112005001447T5 Doppelseitenpolierträger und Herstellungsverfahren desselben The same double-side polishing carriers and methods of manufacture |
| 05/31/2007 | CA2631125A1 Incorporation of particulate additives into metal working surfaces |
| 05/30/2007 | EP1708848A4 Chemical mechanical planarization process control utilizing in-situ conditioning process |
| 05/30/2007 | CN2905325Y Hydraulic station of steel ball grinder |
| 05/30/2007 | CN2905324Y Shuttle type towing polisher for circular hole inner wall polishing |
| 05/30/2007 | CN2905323Y Upper and lower disc of double-disc grinding machine and workpiece drive mechanism |
| 05/30/2007 | CN1972780A Polishing apparatus and polishing method |
| 05/30/2007 | CN1970232A Method of manufacturing chemical mechanical polishing pad |
| 05/30/2007 | CN1970229A Automatic regulation system for pressure and method |
| 05/30/2007 | CN1970228A Barrier diaphragm supporting disc |
| 05/30/2007 | CN1319132C Tantalum barrier removal solution |
| 05/30/2007 | CN1319130C Apparatus for handling semiconductor substrate, method for handling semiconductor substrate |
| 05/30/2007 | CN1318469C Method of fabricating polyurethane foam with micro pores and polishing pad therefrom |
| 05/29/2007 | US7224064 Semiconductor device having conductive interconnections and porous and nonporous insulating portions |
| 05/29/2007 | US7223690 Substrate processing method |
| 05/29/2007 | US7223158 Method for polishing a semiconductor wafer |
| 05/29/2007 | US7223154 Method for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates |
| 05/29/2007 | US7223153 Apparatus and method for polishing semiconductor wafers using one or more polishing surfaces |
| 05/24/2007 | WO2000020167A3 Method and apparatus for automatically polishing magnetic disks and other substrates |
| 05/24/2007 | US20070117497 Friction reducing aid for CMP |
| 05/24/2007 | US20070117394 Polishing slurry for CMP and polishing method |
| 05/24/2007 | US20070113977 Revolution member supporting apparatus and semiconductor substrate processing apparatus |
| 05/23/2007 | EP1788620A1 Method for producing silicon wafer |
| 05/23/2007 | EP1347824B1 Process and apparatus for blending and distributing a slurry solution |
| 05/23/2007 | CN1968785A Real time polishing process monitoring |
| 05/23/2007 | CN1966594A Polishing composition for metal cmp |
| 05/23/2007 | CN1966210A Polishing apparatus and method of polishing work |
| 05/23/2007 | CN1317742C Chemical mechanical planarization compositions for reducing erosion in semiconductor wafers |
| 05/22/2007 | US7220475 Polishing sheet and polishing work method |
| 05/22/2007 | US7220166 Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate |
| 05/22/2007 | US7220163 Method and apparatus for measuring abrasion amount and pad friction force of polishing pad using thickness change of slurry film |
| 05/18/2007 | WO2007055901A1 Method for manufacturing microporous cmp materials having controlled pore size |
| 05/18/2007 | WO2007055678A2 Polishing pad with microporous regions |
| 05/18/2007 | WO2007055401A1 Method for depositing reflective multilayer film of reflective mask blank for euv lithography and method for producing reflective mask blank for euv lithography |
| 05/18/2007 | WO2007055278A1 Polishing agent for silicon oxide, liquid additive, and method of polishing |
| 05/18/2007 | WO2007055124A1 Method of polishing work and apparatus therefor |
| 05/17/2007 | US20070111641 Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate |
| 05/17/2007 | US20070111638 Pad assembly for electrochemical mechanical polishing |
| 05/17/2007 | US20070111637 Substrate holding apparatus and polishing apparatus |
| 05/17/2007 | US20070108067 Polishing apparatus and method of polishing work |
| 05/17/2007 | US20070108066 Voltage mode current control |
| 05/17/2007 | US20070107182 Orthopaedic component manufacturing method and equipment |
| 05/16/2007 | EP1785228A1 Apparatus and method for polishing work using electrolytic reduced water |
| 05/16/2007 | EP1784270A1 Working surface, and system and method for production thereof |
| 05/16/2007 | CN2900082Y Steel wire winding tube structure of hard material slicer |
| 05/16/2007 | CN2900081Y Roller shaft assembling structure of hard material slicer |
| 05/16/2007 | CN2900079Y Numerical control precision round bench grinder special for non-metal |
| 05/16/2007 | CN1316571C Chemically machinery milling technique and device |
| 05/16/2007 | CN1315615C Tool for applying resilient tape and related method |
| 05/15/2007 | US7217989 Composition for selectively polishing silicon nitride layer and polishing method employing it |
| 05/15/2007 | US7217662 Method of processing a substrate |
| 05/15/2007 | US7217305 Polishing body |
| 05/15/2007 | US7217179 Polishing pad |
| 05/15/2007 | US7217175 Polishing apparatus and polishing method |
| 05/10/2007 | WO2007052862A1 Chemical mechanical polishing slurry composition for polishing polycrystalline silicon film and method for preparing the same |
| 05/10/2007 | WO2007052623A1 Abrasive material and process for producing the same |
| 05/10/2007 | WO2007052555A1 Cerium polishing agent |
| 05/10/2007 | WO2006013996A8 Method of manufacturing polishing carrier and silicon substrate for magnetic recording medium, and silicon substrate for magnetic recording medium |
| 05/10/2007 | US20070105491 Wafer Carrier Pivot Mechanism |
| 05/10/2007 | US20070104605 Silver-containing particles, method and apparatus of manufacture, silver-containing devices made therefrom |
| 05/10/2007 | US20070102664 polish the polycrystalline silicon surface with a slurry comprising a non-ionic perfluoroalkyl sulfonyl surfactant; planarization of integrated circuit in semiconductor manufacturing processes; prevent the problem of dishing and improve the within-wafer-non-uniformity |
| 05/10/2007 | US20070102116 Feedback control of chemical mechanical polishing device providing manipulation of removal rate profiles |
| 05/09/2007 | EP1570512A4 Slurry composition for secondary polishing of silicon wafer |
| 05/09/2007 | CN1958236A Method for processing grooves of grinding pads in chemico-mechanical polishing |
| 05/09/2007 | CN1958232A Surface treatment method for golf bar head |
| 05/09/2007 | CN1314514C Wafer carrier structure for chemical and mechanical grinder |
| 05/08/2007 | US7214623 Planarization system and method using a carbonate containing fluid |
| 05/08/2007 | US7214125 Method for controlling pH during planarization and cleaning of microelectronic substrates |
| 05/08/2007 | US7214124 Equipment and method for polishing both sides of a rectangular substrate |
| 05/08/2007 | US7214122 Substrate polishing apparatus |