| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 07/11/2007 | CN2920529Y Internal protection gas feeding device with internal grinding mechanism for pipe welding machine |
| 07/11/2007 | CN1326212C Process for chemical-mechanical polishing of metal substrates |
| 07/11/2007 | CN1326199C Polishing composition including inhibitor of tungsten etching |
| 07/11/2007 | CN1325591C Anionic abrasive particles treated with positively charged polyelectrolytes for cmp |
| 07/10/2007 | US7241725 comprising imine compounds and hydrazine compounds; for polishing tantalum-containing barrier; abrasive free |
| 07/10/2007 | US7241205 Method of processing a substrate |
| 07/10/2007 | US7241202 Substrate polishing apparatus |
| 07/05/2007 | WO2007074734A1 Abrasive grain-free polishing liquid and cmp polishing method |
| 07/05/2007 | WO2006127780B1 Cmp retaining ring |
| 07/05/2007 | US20070155294 Chemical mechanical polishing system |
| 07/05/2007 | US20070155178 Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the same |
| 07/04/2007 | EP1803533A1 Chemical mechanical polishing pad and chemical mechanical polishing method |
| 07/04/2007 | EP1802725A1 Method of sharpening cutting edges |
| 07/04/2007 | EP1567306B1 Transparent microporous materials for cmp |
| 07/04/2007 | CN2917942Y Abrasive disk actuating mechanism for two-lap lapping machine |
| 07/04/2007 | CN1993206A Method of manufacturing polishing carrier and silicon substrate for magnetic recording medium, and silicon substrate for magnetic recording medium |
| 07/04/2007 | CN1990183A 化学机械抛光垫和化学机械抛光方法 The chemical mechanical polishing pad and chemical mechanical polishing method |
| 07/04/2007 | CN1324106C Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method |
| 07/04/2007 | CN1324105C Multiple process polishing solution for chemical mechanical planarization |
| 07/03/2007 | US7238618 System for the preferential removal of silicon oxide |
| 07/03/2007 | US7238097 Polishing pad and method of producing same |
| 07/03/2007 | US7238093 Polishing cloth for chemical mechanical polishing, and chemical mechanical polishing apparatus using said cloth |
| 07/03/2007 | US7238092 Low-force electrochemical mechanical processing method and apparatus |
| 07/03/2007 | US7238090 Polishing apparatus having a trough |
| 07/03/2007 | US7238087 Planarizing device and a planarization method for semiconductor substrates |
| 07/03/2007 | US7238083 Wafer carrier with pressurized membrane and retaining ring actuator |
| 06/28/2007 | WO2007072918A1 Polishing composition, polishing method, and method for forming copper wiring for semiconductor integrated circuit |
| 06/28/2007 | WO2007072890A1 Glass substrate for mask blank and method of polishing for producing the same |
| 06/28/2007 | US20070149096 Chemical mechanical polishing pad and chemical mechanical polishing method |
| 06/28/2007 | US20070148916 Semiconductor surface protecting sheet and method |
| 06/28/2007 | US20070145013 Method for polishing workpiece, polishing apparatus and method for manufacturing semiconductor device |
| 06/28/2007 | US20070145011 Chemical mechanical polishing system and process |
| 06/28/2007 | US20070145010 Removal rate estimating method of a chemical mechanical polishing process under mixed products or mixed layers |
| 06/27/2007 | EP1800800A1 Abrasive pad |
| 06/27/2007 | EP1799402A1 Method and apparatus for improved chemical mechanical planarization |
| 06/27/2007 | EP1176630B1 Polishing body, polisher, method for adjusting polisher, method for measuring thickness of polished film or end point of polishing, method for producing semiconductor device |
| 06/27/2007 | CN2915378Y 化学机械抛光垫及化学机械装置 Chemical mechanical polishing pad and chemical mechanical means |
| 06/27/2007 | CN1986717A Polishing composition for hard disk substrate |
| 06/27/2007 | CN1986154A Silicon wafer grinding apparatus, retaining assembly, and silicon wafer flatness correcting method |
| 06/27/2007 | CN1323124C Cerium oxide abrasive material and grinding method of base plate |
| 06/26/2007 | US7235488 In-situ chemical-mechanical planarization pad metrology using ultrasonic imaging |
| 06/26/2007 | US7235154 Devices and methods for optical endpoint detection during semiconductor wafer polishing |
| 06/26/2007 | US7235001 Polishing apparatus |
| 06/26/2007 | US7235000 Methods and systems for conditioning planarizing pads used in planarizing substrates |
| 06/26/2007 | US7234999 Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus |
| 06/26/2007 | US7234998 Chemical mechanical polishing method, chemical mechanical polishing system, and manufacturing method of semiconductor device |
| 06/21/2007 | WO2007069488A1 Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, and kit for preparing aqueous dispersion for chemical mechanical polishing |
| 06/21/2007 | US20070141958 Silicon Wafer Grinding Apparatus, Retaining Assembly Used for the Same and Silicon Wafer Flatness Correcting Method |
| 06/21/2007 | US20070141957 Polishing slurry for polishing aluminum film and polishing method for polishing aluminum film using the same |
| 06/21/2007 | US20070139043 Eddy current system for in-situ profile measurement |
| 06/21/2007 | US20070138438 Fine particle sizes; narrow particle size distribution; display devices and lighting elements; printed on explosives or ammunitions; currency; printed on confidential documentation |
| 06/20/2007 | EP1796874A1 Polishing tool comprising a drive plate and a removable pad for finishing an ophthalmic lens |
| 06/20/2007 | EP1796873A1 Flexible rinsing step in a cmp process |
| 06/20/2007 | EP1495837B1 Polishing method |
| 06/20/2007 | CN1985361A Cmp研磨剂以及衬底的研磨方法 Cmp abrasive polishing method and substrate |
| 06/20/2007 | CN1985306A Texturing processing composition |
| 06/20/2007 | CN1984750A Polishing pad with flow modifying groove network |
| 06/20/2007 | CN1981992A Method for automatically adjusting silicon wafer grinding pressure of chemical-mechanical polisher |
| 06/20/2007 | CN1981991A Clenaer of chemical-mechanical polisher head |
| 06/20/2007 | CN1981990A Chemical-mechanical polishing grinding pad |
| 06/20/2007 | CN1981987A Three-freedom degree rock grinding mechanism |
| 06/20/2007 | CN1322555C Method of fabricating semiconductor device |
| 06/20/2007 | CN1322554C Method for producing IC chip |
| 06/20/2007 | CN1322087C Composition for grinding agent and making-up method thereof |
| 06/19/2007 | US7232761 Method of chemical mechanical polishing with high throughput and low dishing |
| 06/19/2007 | US7232760 Method for producing semiconductor device, polishing apparatus, and polishing method |
| 06/19/2007 | US7232514 Minimizing damage to the surface to remove conductive materials by an electrochemical polishing technique using an acid-based electrolyte, chelating agent, corrosion inhibitor, acid salt; buffer, oxidizer and solvents; semiconductors |
| 06/19/2007 | US7232360 Uninterrupted abrasive fluid supply |
| 06/14/2007 | WO2007067001A1 Adjuvant for controlling polishing selectivity and chemical mechanical polishing slurry comprising the same |
| 06/14/2007 | WO2007066418A1 Retainer ring for cmp device |
| 06/14/2007 | WO2007014732A3 Method and device for subsequently treating glass panes |
| 06/14/2007 | US20070135958 Integrated endpoint detection system with optical and eddy current monitoring |
| 06/14/2007 | US20070135655 Use of fluorinated additives in the etching or polishing of integrated circuits |
| 06/14/2007 | US20070135030 Inlaid polishing pad |
| 06/14/2007 | US20070135023 Lapping system having a polymeric lapping tool |
| 06/14/2007 | US20070135022 Apparatus for reduction of defects in wet procssed layers |
| 06/14/2007 | US20070135020 Polishing apparatus and polishing method |
| 06/14/2007 | US20070132058 Adjuvant for controlling polishing selectivity and chemical mechanical polishing slurry comprising the same |
| 06/14/2007 | US20070131561 Controlling removal rate uniformity of an electropolishing process in integrated circuit fabrication |
| 06/13/2007 | EP1796152A1 Cmp polishing agent and method for polishing substrate |
| 06/13/2007 | EP1795302A1 Method of polishing work |
| 06/13/2007 | CN2910474Y Tray dumper speed display of steel balls grinding machine |
| 06/13/2007 | CN1978140A Method for prolonging service-life of grinding pad in chemical-mechanical polishing |
| 06/13/2007 | CN1321449C Protective structure of semiconductor wafer, method for protecting semiconductor wafer, multilayer protective sheet used therein, and method for processing semiconductor wafer |
| 06/13/2007 | CN1321166C Abradant, grinding method for substrate, and mfg. method for semiconductor device |
| 06/12/2007 | US7229572 Photoluminescent phosphor powders, methods for making phosphor powders and devices incorporating same |
| 06/12/2007 | US7229570 To polish and remove a barrier metal film |
| 06/12/2007 | US7229535 Hydrogen bubble reduction on the cathode using double-cell designs |
| 06/12/2007 | US7229484 Pre-coated particles for chemical mechanical polishing |
| 06/12/2007 | US7229343 Orbiting indexable belt polishing station for chemical mechanical polishing |
| 06/12/2007 | US7229340 Monitoring a metal layer during chemical mechanical polishing |
| 06/12/2007 | US7229338 Apparatuses and methods for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 06/12/2007 | US7229337 Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting |
| 06/12/2007 | US7229336 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization |
| 06/07/2007 | WO2007063873A1 Polishing method and polishing apparatus |
| 06/07/2007 | US20070128992 Method for conditioning processing pads |
| 06/07/2007 | US20070128985 Method of polishing work |
| 06/07/2007 | US20070128982 Bubble suppressing flow controller with ultrasonic flow meter |
| 06/07/2007 | US20070128874 Chemical mechanical polishing method and method of manufacturing semiconductor device |
| 06/07/2007 | US20070128873 Aqueous dispersion for cmp, polishing method and method for manufacturing semiconductor device |