Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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08/14/2007 | US7255809 Hard magentic disks; abrasion using diamond particles in aqueous solution |
08/14/2007 | US7255784 Polishing method and electropolishing apparatus |
08/14/2007 | US7255771 Multiple zone carrier head with flexible membrane |
08/14/2007 | US7255637 Carrier head vibration damping |
08/14/2007 | US7255635 Polishing apparatus |
08/14/2007 | US7255633 Radial-biased polishing pad |
08/14/2007 | US7255632 Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion |
08/14/2007 | US7255630 Methods of manufacturing carrier heads for polishing micro-device workpieces |
08/14/2007 | US7255629 Polishing assembly with a window |
08/09/2007 | WO2007089004A1 Chemical mechanical polishing pad |
08/09/2007 | WO2007088868A1 Cmp abrasive for polishing insulating film, polishing method and semiconductor electronic component polished by such polishing method |
08/09/2007 | WO2007087830A1 Initiating chemical mechanical polishing with slurries having small abrasive particles |
08/09/2007 | US20070184761 Method and apparatus for measuring abrasion amount and pad friction force of polishing pad using thickness change of slurry film |
08/09/2007 | US20070184757 Polishing sheet and polishing work method |
08/09/2007 | US20070184662 Double-side polishing carrier and fabrication method thereof |
08/09/2007 | US20070181851 Polishing composition and polishing method |
08/09/2007 | US20070181850 Polishing liquid for barrier layer |
08/09/2007 | US20070181534 Barrier polishing liquid and chemical mechanical polishing method |
08/09/2007 | US20070181432 Electrolytic processing apparatus and substrate processing apparatus and method |
08/09/2007 | US20070180778 CMP Porous Pad with Component-Filled Pores |
08/08/2007 | EP1814694A2 Polishing pad with microporous regions |
08/08/2007 | EP1633528A4 Substrate polishing apparatus |
08/08/2007 | CN1330733C Abrasive slurry having high dispersion stability and manufacturing method for a substrate |
08/08/2007 | CN1330459C Apparatus and method for controlling wafer temp. in chemical mechanical polishing |
08/08/2007 | CN101014446A Methods for producing in-situ grooves in chemical mechanical planarization (cmp) pads, and novel cmp pad designs |
08/08/2007 | CN101012356A Polishing liquid for barrier layer |
08/08/2007 | CN101012313A Polishing composition |
08/07/2007 | US7253111 Barrier polishing solution |
08/07/2007 | US7252871 Polishing pad having a pressure relief channel |
08/07/2007 | US7252695 aqueous acid suspension of individualized colloidal silica particles not linked to each other by siloxane bonds, and a surfactant; for mechanical chemical polishing |
08/07/2007 | US7252575 Polishing state monitoring apparatus and polishing apparatus and method |
08/02/2007 | WO2007086529A1 Chemical mechanical polishing pad and method for manufacturing same |
08/02/2007 | WO2007055678A3 Polishing pad with microporous regions |
08/02/2007 | US20070179238 Method for improving mechanical properties of polymer particles and its applications |
08/02/2007 | US20070178812 Polishing pad and method for manufacture of semiconductor device using the same |
08/02/2007 | US20070178701 Method of processing a substrate |
08/02/2007 | US20070176142 Metal- polishing liquid and chemical-mechanical polishing method using the same |
08/02/2007 | US20070176140 Polishing composition and polishing method |
08/02/2007 | US20070175104 Polishing slurry for silicon oxide, additive liquid and polishing method |
08/02/2007 | DE102007004120A1 Aqueous composition for polishing silicon dioxide and boron-phosphate-silicate glass on semiconductor wafers, contains polyacrylic acid, abrasive and polyvinyl-pyrrolidone |
08/01/2007 | EP1814149A1 METHOD FOR ABRASING GaN SUBSTRATE |
08/01/2007 | EP1813658A2 Polishing liquid for barrier layer |
08/01/2007 | EP1813657A2 Metal-polishing liquid and chemical-mechanical polishing method using the same |
08/01/2007 | EP1813641A1 A method for improving mechanical properties of polymer particles and its applications |
08/01/2007 | EP1812205A1 Method and device for measuring semiconductor plates |
08/01/2007 | EP1558426A4 Polishing apparatus |
08/01/2007 | EP1478012B1 Polishing method and polishing fluid |
08/01/2007 | EP1369200B1 Device for polishing optical disk |
08/01/2007 | CN1329960C CMP apparatus and polishing method |
08/01/2007 | CN101010736A Magnetic disk substrate and production method of magnetic disk |
08/01/2007 | CN101010402A Mixed rare earth oxide, mixed rare earth fluoride, cerium-based abrasive using the materials and production processes thereof |
08/01/2007 | CN101010401A Polishing slurry, production method of glass substrate for information recording medium and production method of information recording medium |
08/01/2007 | CN101010169A Magnetic disk substrate and production method of magnetic disk |
08/01/2007 | CN101010168A Magnetic disk substrate and production method of magnetic disk |
08/01/2007 | CN101009240A Semiconductor device fabrication method and polishing apparatus |
08/01/2007 | CN101007393A Reversible drive device with two single action cylinder implemented by closed abrasive |
07/31/2007 | US7250369 Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same |
07/31/2007 | US7250368 Semiconductor wafer manufacturing method and wafer |
07/31/2007 | US7249995 Apparatus and method for feeding slurry |
07/31/2007 | US7249992 Method, apparatus and system for use in processing wafers |
07/26/2007 | US20070173187 Chemical mechanical polishing pad with micro-holes |
07/26/2007 | US20070173177 Substrate polishing apparatus |
07/26/2007 | US20070173056 Semiconductor device fabrication method and polishing apparatus |
07/26/2007 | US20070172977 Methods for forming alignment marks on semiconductor devices |
07/26/2007 | US20070169422 Aqueous abrasives dispersion medium composition |
07/26/2007 | US20070169421 CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive |
07/25/2007 | EP1811005A1 Polishing system and method of its use |
07/25/2007 | EP1809439A1 Electronic die positioning device and method |
07/25/2007 | EP1594653A4 Apparatus and method for polishing semiconductor wafers using one or more pivotable load-and-unload cups |
07/25/2007 | EP1390820B1 Apparatus and methods with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wafer |
07/25/2007 | CN1328778C Bubble detection between polishing pad and polishing disk |
07/25/2007 | CN1328765C All-functional semiconductor chip grinding process and device thereof |
07/25/2007 | CN1328010C Method for fabricating polishing pad using laser beam and mask |
07/25/2007 | CN1328009C Method for fabricating chemical mechanical polishing pad using laser |
07/25/2007 | CN101006153A Cerium oxide abrasive and slurry containing the same |
07/25/2007 | CN101005924A Magnetic disk substrate and production method of magnetic disk |
07/24/2007 | US7247577 Insulated pad conditioner and method of using same |
07/24/2007 | US7247083 Polishing apparatus |
07/19/2007 | WO2007080848A1 Polishing pad |
07/19/2007 | US20070167116 Polishing composition |
07/19/2007 | US20070167115 Chemical mechanical polishing system and process |
07/19/2007 | US20070167017 a mixture of oxidizers, oxidized-metal etchants, protective film-forming agents and diluents, used for polishing semiconductors |
07/19/2007 | US20070167016 Metal-polishing liquid and chemical-mechanical polishing method using the same |
07/19/2007 | US20070167015 Polishing method |
07/19/2007 | DE112005001772T5 Verfahren und Vorrichtung zum Aufbereiten eines Polierkissens Method and apparatus for conditioning a polishing pad |
07/18/2007 | EP1807865A1 Polishing apparatus |
07/18/2007 | CN1326962C 抛光组合物 The polishing composition |
07/17/2007 | US7244678 Methods for planarization of Group VIII metal-containing surfaces using complexing agents |
07/17/2007 | US7244169 In-line contiguous resistive lapping guide for magnetic sensors |
07/17/2007 | US7244168 Methods for reducing delamination during chemical mechanical polishing |
07/12/2007 | WO2007077886A1 Metal polishing liquid and method for polishing film to be polished |
07/12/2007 | WO2007024807A3 Apparatus and methods for spectrum based monitoring of chemical mechanical polishing |
07/12/2007 | WO2005096700A3 Polishing pad and method of making same |
07/12/2007 | US20070161342 Polishing pad, polishing apparatus and method for polishing wafer |
07/12/2007 | US20070161338 Wafer polishing apparatus and wafer polishing method |
07/12/2007 | US20070161333 In-situ chemical-mechanical planarization pad metrology using ultrasonic imaging |
07/12/2007 | US20070158308 Method for manufacturing single-side mirror surface wafer |
07/12/2007 | DE102005026547B4 Vorrichtung zum Drahttrennläppen Apparatus for Drahttrennläppen |
07/11/2007 | EP1467840B1 Process control in electro-chemical mechanical polishing |
07/11/2007 | CN2920536Y Guiding structure of horizontal closed steel ball polishing machine |