Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
08/2007
08/14/2007US7255809 Hard magentic disks; abrasion using diamond particles in aqueous solution
08/14/2007US7255784 Polishing method and electropolishing apparatus
08/14/2007US7255771 Multiple zone carrier head with flexible membrane
08/14/2007US7255637 Carrier head vibration damping
08/14/2007US7255635 Polishing apparatus
08/14/2007US7255633 Radial-biased polishing pad
08/14/2007US7255632 Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
08/14/2007US7255630 Methods of manufacturing carrier heads for polishing micro-device workpieces
08/14/2007US7255629 Polishing assembly with a window
08/09/2007WO2007089004A1 Chemical mechanical polishing pad
08/09/2007WO2007088868A1 Cmp abrasive for polishing insulating film, polishing method and semiconductor electronic component polished by such polishing method
08/09/2007WO2007087830A1 Initiating chemical mechanical polishing with slurries having small abrasive particles
08/09/2007US20070184761 Method and apparatus for measuring abrasion amount and pad friction force of polishing pad using thickness change of slurry film
08/09/2007US20070184757 Polishing sheet and polishing work method
08/09/2007US20070184662 Double-side polishing carrier and fabrication method thereof
08/09/2007US20070181851 Polishing composition and polishing method
08/09/2007US20070181850 Polishing liquid for barrier layer
08/09/2007US20070181534 Barrier polishing liquid and chemical mechanical polishing method
08/09/2007US20070181432 Electrolytic processing apparatus and substrate processing apparatus and method
08/09/2007US20070180778 CMP Porous Pad with Component-Filled Pores
08/08/2007EP1814694A2 Polishing pad with microporous regions
08/08/2007EP1633528A4 Substrate polishing apparatus
08/08/2007CN1330733C Abrasive slurry having high dispersion stability and manufacturing method for a substrate
08/08/2007CN1330459C Apparatus and method for controlling wafer temp. in chemical mechanical polishing
08/08/2007CN101014446A Methods for producing in-situ grooves in chemical mechanical planarization (cmp) pads, and novel cmp pad designs
08/08/2007CN101012356A Polishing liquid for barrier layer
08/08/2007CN101012313A Polishing composition
08/07/2007US7253111 Barrier polishing solution
08/07/2007US7252871 Polishing pad having a pressure relief channel
08/07/2007US7252695 aqueous acid suspension of individualized colloidal silica particles not linked to each other by siloxane bonds, and a surfactant; for mechanical chemical polishing
08/07/2007US7252575 Polishing state monitoring apparatus and polishing apparatus and method
08/02/2007WO2007086529A1 Chemical mechanical polishing pad and method for manufacturing same
08/02/2007WO2007055678A3 Polishing pad with microporous regions
08/02/2007US20070179238 Method for improving mechanical properties of polymer particles and its applications
08/02/2007US20070178812 Polishing pad and method for manufacture of semiconductor device using the same
08/02/2007US20070178701 Method of processing a substrate
08/02/2007US20070176142 Metal- polishing liquid and chemical-mechanical polishing method using the same
08/02/2007US20070176140 Polishing composition and polishing method
08/02/2007US20070175104 Polishing slurry for silicon oxide, additive liquid and polishing method
08/02/2007DE102007004120A1 Aqueous composition for polishing silicon dioxide and boron-phosphate-silicate glass on semiconductor wafers, contains polyacrylic acid, abrasive and polyvinyl-pyrrolidone
08/01/2007EP1814149A1 METHOD FOR ABRASING GaN SUBSTRATE
08/01/2007EP1813658A2 Polishing liquid for barrier layer
08/01/2007EP1813657A2 Metal-polishing liquid and chemical-mechanical polishing method using the same
08/01/2007EP1813641A1 A method for improving mechanical properties of polymer particles and its applications
08/01/2007EP1812205A1 Method and device for measuring semiconductor plates
08/01/2007EP1558426A4 Polishing apparatus
08/01/2007EP1478012B1 Polishing method and polishing fluid
08/01/2007EP1369200B1 Device for polishing optical disk
08/01/2007CN1329960C CMP apparatus and polishing method
08/01/2007CN101010736A Magnetic disk substrate and production method of magnetic disk
08/01/2007CN101010402A Mixed rare earth oxide, mixed rare earth fluoride, cerium-based abrasive using the materials and production processes thereof
08/01/2007CN101010401A Polishing slurry, production method of glass substrate for information recording medium and production method of information recording medium
08/01/2007CN101010169A Magnetic disk substrate and production method of magnetic disk
08/01/2007CN101010168A Magnetic disk substrate and production method of magnetic disk
08/01/2007CN101009240A Semiconductor device fabrication method and polishing apparatus
08/01/2007CN101007393A Reversible drive device with two single action cylinder implemented by closed abrasive
07/2007
07/31/2007US7250369 Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same
07/31/2007US7250368 Semiconductor wafer manufacturing method and wafer
07/31/2007US7249995 Apparatus and method for feeding slurry
07/31/2007US7249992 Method, apparatus and system for use in processing wafers
07/26/2007US20070173187 Chemical mechanical polishing pad with micro-holes
07/26/2007US20070173177 Substrate polishing apparatus
07/26/2007US20070173056 Semiconductor device fabrication method and polishing apparatus
07/26/2007US20070172977 Methods for forming alignment marks on semiconductor devices
07/26/2007US20070169422 Aqueous abrasives dispersion medium composition
07/26/2007US20070169421 CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive
07/25/2007EP1811005A1 Polishing system and method of its use
07/25/2007EP1809439A1 Electronic die positioning device and method
07/25/2007EP1594653A4 Apparatus and method for polishing semiconductor wafers using one or more pivotable load-and-unload cups
07/25/2007EP1390820B1 Apparatus and methods with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wafer
07/25/2007CN1328778C Bubble detection between polishing pad and polishing disk
07/25/2007CN1328765C All-functional semiconductor chip grinding process and device thereof
07/25/2007CN1328010C Method for fabricating polishing pad using laser beam and mask
07/25/2007CN1328009C Method for fabricating chemical mechanical polishing pad using laser
07/25/2007CN101006153A Cerium oxide abrasive and slurry containing the same
07/25/2007CN101005924A Magnetic disk substrate and production method of magnetic disk
07/24/2007US7247577 Insulated pad conditioner and method of using same
07/24/2007US7247083 Polishing apparatus
07/19/2007WO2007080848A1 Polishing pad
07/19/2007US20070167116 Polishing composition
07/19/2007US20070167115 Chemical mechanical polishing system and process
07/19/2007US20070167017 a mixture of oxidizers, oxidized-metal etchants, protective film-forming agents and diluents, used for polishing semiconductors
07/19/2007US20070167016 Metal-polishing liquid and chemical-mechanical polishing method using the same
07/19/2007US20070167015 Polishing method
07/19/2007DE112005001772T5 Verfahren und Vorrichtung zum Aufbereiten eines Polierkissens Method and apparatus for conditioning a polishing pad
07/18/2007EP1807865A1 Polishing apparatus
07/18/2007CN1326962C 抛光组合物 The polishing composition
07/17/2007US7244678 Methods for planarization of Group VIII metal-containing surfaces using complexing agents
07/17/2007US7244169 In-line contiguous resistive lapping guide for magnetic sensors
07/17/2007US7244168 Methods for reducing delamination during chemical mechanical polishing
07/12/2007WO2007077886A1 Metal polishing liquid and method for polishing film to be polished
07/12/2007WO2007024807A3 Apparatus and methods for spectrum based monitoring of chemical mechanical polishing
07/12/2007WO2005096700A3 Polishing pad and method of making same
07/12/2007US20070161342 Polishing pad, polishing apparatus and method for polishing wafer
07/12/2007US20070161338 Wafer polishing apparatus and wafer polishing method
07/12/2007US20070161333 In-situ chemical-mechanical planarization pad metrology using ultrasonic imaging
07/12/2007US20070158308 Method for manufacturing single-side mirror surface wafer
07/12/2007DE102005026547B4 Vorrichtung zum Drahttrennläppen Apparatus for Drahttrennläppen
07/11/2007EP1467840B1 Process control in electro-chemical mechanical polishing
07/11/2007CN2920536Y Guiding structure of horizontal closed steel ball polishing machine
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