Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
09/2007
09/20/2007US20070218807 Method and apparatus for producing micro-texture on a slider substrate using chemical & mechanical polishing techniques
09/20/2007US20070218279 Abrasive Cloth and Method for Producing Nanofiber Structure
09/20/2007US20070215463 Pre-conditioning a sputtering target prior to sputtering
09/19/2007EP1833640A1 Substrate holding device and polishing apparatus
09/19/2007EP1469971B1 Grooved rollers for a linear chemical mechanical planarization system
09/19/2007EP1340588B1 Abrasive cloth and polishing method
09/19/2007CN101037586A Polishing fluid and method of polishing
09/19/2007CN101037585A Polishing fluid and polishing method
09/19/2007CN100337926C Cerium oxide particles and process for the production thereof
09/19/2007CN100337790C Small-sized precise hand operated grinding and polishing apparatus
09/18/2007US7270597 Rinsing to remove by-products; conditioning wafer surface of copper or oxide; applying ammonium chloride, copper chloride, hydrochloric acid, ammonium persulfate, sulfuric acid, ammonium hydroxide, citric acid, ammonium citrate, hydrofluoric acid, tetramethylammonium hydroxide, and/or chelate compound
09/18/2007US7270595 Polishing pad with oscillating path groove network
09/18/2007US7270594 Polishing apparatus
09/13/2007WO2007104063A1 Composite polishing pad
09/13/2007WO2007103578A1 Method of polishing a tungsten carbide surface
09/13/2007US20070212988 Polishing apparatus
09/13/2007US20070212987 Monitoring a metal layer during chemical mechanical polishing
09/13/2007US20070212980 Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting
09/13/2007US20070212979 Composite polishing pad
09/13/2007US20070212882 Substrate polishing method and method of manufacturing semiconductor device
09/13/2007DE102007005919A1 Polierzusammensetzung und Polierverfahren Polishing composition and polishing method
09/12/2007EP1833085A1 Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same
09/12/2007EP1833084A2 Cerium oxide abrasive and method of polishing substrates
09/12/2007EP1833083A1 Silicon wafer polishing method and silicon wafer producing method, apparatus for polishing disc-like work and silicon wafer
09/12/2007EP1830985A2 Polishing apparatus and polishing method
09/12/2007EP1594656B1 Polishing article for electro-chemical mechanical polishing
09/12/2007EP0946979B1 Method for chemical-mechanical planarization of a substrate on a fixed-abrasive polishing pad
09/12/2007CN200945582Y Wafer grinding ring special abrading processing machine
09/11/2007US7268000 Method and system for controlling the chemical mechanical polishing of substrates by calculating an overpolishing time and/or a polishing time of a final polishing step
09/11/2007US7267702 Abrasive with an average particle size of 1 to 30 nm and water and having a packing ratio of from 79 to 90% by weight; suitable for precision parts including such as magnetic recording media, photomask substrates, optical disks, lenses, mirrors, and prisms, and semiconductor substrates
09/11/2007US7267608 Method and apparatus for conditioning a chemical-mechanical polishing pad
09/11/2007US7267607 Transparent microporous materials for CMP
09/11/2007US7267604 Grinding abrasive grains, abrasive, abrasive solution, abrasive solution preparation method, grinding method, and semiconductor device fabrication method
09/11/2007US7267602 Seal assembly manufacturing methods
09/11/2007US7267601 Method of producing polishing cloth
09/07/2007WO2007100093A1 Metal oxide particle, polishing material containing same, substrate polishing method using such polishing material, and method for manufacturing semiconductor device
09/07/2007WO2007099976A1 Substrate treating device, substrate convey device, substrate grasping device, and chemical solution treating device
09/07/2007WO2007099799A1 Cerium-based abrasive material
09/06/2007US20070207938 Cleaning compositions and methods of use thereof
09/06/2007US20070204724 Aerosol method and apparatus, particulate products, and electronic devices made therefrom
09/05/2007EP1828333A1 Polishing composition and polishing method
09/05/2007CN200942486Y Programmable controlled full-automatic movable polishing machine
09/05/2007CN101032001A CMP polishing compound and method for polishing substrate
09/05/2007CN101028700A Processing device with rotary table
09/05/2007CN101028699A Polishing head for trimming polished wafter evenness
09/05/2007CN100336188C Method for copper CMP using polymeric complexing agents
09/05/2007CN100336179C Polishing fluid and polishing method
09/05/2007CN100336104C Grinding guide with dual-purpose for producing magnetoresistive head
09/05/2007CN100335580C Polishing system with stopping compound and method of its use
09/04/2007US7264641 Polishing pad comprising biodegradable polymer
09/04/2007US7264536 Polishing pad with window
09/04/2007US7264535 Run-to-run control of backside pressure for CMP radial uniformity optimization based on center-to-edge model
08/2007
08/30/2007WO2006081286A8 Multi-layer polishing pad for low-pressure polishing
08/30/2007US20070202777 Linearly Advancing Polishing Method And Apparatus
08/30/2007US20070202703 Polishing composition and polishing method
08/30/2007US20070199923 Polishing device and polishing method
08/30/2007DE202007005774U1 Reparaturwerkzeug für übliche Haushaltswasserhähne Repair tool for common household taps
08/29/2007EP1299490B1 Silane containing polishing composition for cmp
08/29/2007CN101025166A Rotary pump, hydrodynamic mixer with a rotary pump, and the use of the rotary pump
08/29/2007CN100334691C Substrate processing apparatus and substrate processing method
08/28/2007US7261832 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
08/28/2007US7261616 Magnetorheological polishing devices and methods
08/28/2007US7260887 Apparatus for controlling the lapping of a slider based on an amplitude of a readback signal produced from an externally applied magnetic field
08/23/2007WO2007095421A2 Method for electrochemically polishing a conductive material on a substrate
08/23/2007US20070197147 Polishing system with spiral-grooved subpad
08/23/2007US20070197145 Polishing article with window stripe
08/23/2007US20070197141 Polishing apparatus with grooved subpad
08/23/2007US20070197134 Polishing article with integrated window stripe
08/23/2007US20070197133 Polishing article with integrated window stripe
08/23/2007US20070197132 Dechuck using subpad with recess
08/23/2007US20070196975 Metal-Polishing Liquid And Polishing Method Using The Same
08/23/2007US20070193686 Method of manufacturing semiconductor substrate and method of evaluating quality of semiconductor substrate
08/22/2007EP1820603A2 Wafer and method for producing the same
08/22/2007CN2936578Y Processing pad and substrate processing equipment including said processing pad
08/22/2007CN101023512A Cmp polishing agent and method for polishing substrate
08/22/2007CN101023511A Method for manufacturing semiconductor device
08/22/2007CN101023429A Method, apparatus and system for use in processing wafers
08/22/2007CN101022921A Method and apparatus for conditioning a polishing pad
08/22/2007CN101022920A Retaining ring with conductive portion
08/22/2007CN101022918A 抛光垫 Polishing pad
08/22/2007CN101022910A 全序列金属和阻挡层电化学机械处理 Sequence metal and barrier layer electrochemical mechanical treatment
08/21/2007US7258602 Polishing pad having grooved window therein and method of forming the same
08/21/2007US7258598 Polishing solution supply system, method of supplying polishing solution, apparatus for and method of polishing semiconductor substrate and method of manufacturing semiconductor device
08/21/2007US7258596 Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces
08/21/2007US7258595 Polishing apparatus
08/16/2007WO2007091439A1 Abrasive pad and abrasion device
08/16/2007US20070190913 Polishing apparatus and polishing method
08/16/2007US20070190911 Polishing pad and forming method
08/16/2007US20070190909 Three-dimensional network for chemical mechanical polishing
08/16/2007US20070190905 Polishing pad and semiconductor device manufacturing method
08/16/2007US20070190903 Apparatus and method for polishing semiconductor wafers using one or more polishing surfaces
08/16/2007US20070190770 Post-cmp treating liquid and manufacturing method of semiconductor device using the same
08/16/2007US20070187258 Method for electrochemically polishing a conductive material on a substrate
08/16/2007US20070187257 Electrolytic processing apparatus and electrolytic processing method
08/16/2007US20070186486 Polishing composition and rinse composition
08/16/2007US20070186485 Polishing composition and rinse composition
08/15/2007EP1818312A1 METHOD FOR PRODUCING CeO2 FINE PARTICLES AND POLISHING SLURRY CONTAINING SUCH FINE PARTICLES
08/15/2007EP1719161A4 Polishing apparatus and substrate processing apparatus
08/15/2007CN1331635C Electric current variable effect grinding method and its grinding device
08/15/2007CN101015907A Grinding device for controlling grinding thickness
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