B24B 37 - Lapping machines or devices; Accessories

Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
10/2007
10/31/2007	CN200967170Y Centerless grinder automatic feeding unit
10/31/2007	CN101065218A Flexible rinsing step in a CMP process
10/31/2007	CN101064268A Chip holder
10/30/2007	US7289872 Method and apparatus for prediction of polishing condition, and computer product
10/30/2007	US7288212 Comprises acrylic acid-maleic acid copolymer and sodium hydroxide; for chemical mechanical polishing of semiconductors
10/30/2007	US7288165 Pad conditioning head for CMP process
10/25/2007	WO2007119875A1 Method for manufacturing polishing pad
10/25/2007	WO2007119845A1 Device wafer polishing pad
10/25/2007	WO2007119775A1 Method of processing glass base and rinse composition for glass base processing
10/25/2007	WO2007119537A1 Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, kit for chemical mechanical polishing, and kit for preparing aqueous dispersion for chemical mechanical polishing
10/24/2007	EP1536919B1 Method and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate
10/24/2007	EP1525074B1 Abrasive articles with a liner with protrusions and methods of making and using the same
10/24/2007	EP1295682B1 Abrasive material
10/24/2007	EP1118429B1 Method and device for simultaneously grinding double surfaces, and method and device for simultaneously lapping double surfaces
10/24/2007	CN101058713A Polishing slurry and polishing method
10/24/2007	CN101058711A Grinding fluid for metal and grinding method
10/24/2007	CN101058169A 抛光表面 Polished surface
10/24/2007	CN101058166A Small quantity liquid type abrading machine for bearing steel balls
10/24/2007	CN100344408C Polishing pad having grooved window therein and method of forming the same
10/23/2007	US7285233 Method of manufacturing polishing pad
10/23/2007	US7285037 Systems including differential pressure application apparatus
10/23/2007	US7285036 Pad assembly for electrochemical mechanical polishing
10/18/2007	WO2007117301A2 Ball contact cover for copper loss reduction and spike reduction
10/18/2007	WO2007116770A1 Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, and kit for preparing aqueous dispersion for chemical mechanical polishing
10/18/2007	US20070243797 Polishing method and polishing apparatus
10/18/2007	US20070243796 Method and apparatus for polishing a wafer with a higher in-plane uniformity
10/18/2007	US20070243795 Polishing Apparatus And Polishing Method
10/18/2007	US20070243794 Apparatus for measurement of parameters in process equipment
10/18/2007	US20070243421 Magnetic Disk Substrate and Production Method of Magnetic Disk
10/18/2007	US20070240366 Composition for Polishing
10/17/2007	EP1108500B1 Polishing pad
10/17/2007	CN101056742A Polishing pad and methods of improving pad removal rates and planarization
10/17/2007	CN100343958C Polishing pad having slurry utilization enhancing grooves
10/17/2007	CN100343362C Polishing fluid for metal and polishing Method
10/16/2007	CA2287404C Method of planarizing the upper surface of a semiconductor wafer
10/11/2007	WO2007114964A2 A method for adjusting substrate processing times in a substrate polishing system
10/11/2007	US20070239309 Polishing apparatus and polishing method
10/11/2007	US20070238399 Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
10/11/2007	US20070238395 Substrate polishing apparatus and substrate polishing method
10/11/2007	US20070238394 Method and system for endpoint detection
10/11/2007	DE102007007341A1 Chemical mechanical polishing pad for semiconductor substrate, has interconnected cell units reticulated for allowing fluid flow and removal of debris, and polishing elements with ends connected to adjacent polishing elements
10/10/2007	EP1841832A1 Abrasive composition
10/10/2007	EP1841831A2 Polishing composition and polishing method
10/10/2007	EP1584365B1 Transmitter for wireless control
10/10/2007	CN101053069A 抛光设备 Polishing Equipment
10/10/2007	CN101050348A Etchant composition, composition for polishing, method for producing polishing composition and polishing method
10/10/2007	CN101049681A Method for controlling scoring abrasive surface of silicon chip
10/10/2007	CN100342499C CMP process control method
10/10/2007	CN100341966C Polishing composition for semiconductor wafers
10/10/2007	CN100341666C Polishing pad with optimized grooves and method of using same
10/10/2007	CN100341665C Apparatus and method for preheating
10/09/2007	US7279425 Polishing method
10/09/2007	US7279119 Silica and silica-based slurry
10/09/2007	US7278911 Conductive polishing article for electrochemical mechanical polishing
10/09/2007	US7278907 Method of adhering polishing pads and jig for adhering the same
10/09/2007	US7278905 Apparatus and method for conditioning polishing surface, and polishing apparatus and method of operation
10/09/2007	US7278901 Method and apparatus for measuring abrasion amount and pad friction force of polishing pad using thickness change of slurry film
10/04/2007	WO2007110896A1 Double side polishing machine
10/04/2007	US20070233306 Polishing apparatus and method of controlling the same
10/04/2007	US20070232209 Method for polishing a semiconductor wafer
10/04/2007	US20070232201 Apparatus and method for polishing semiconductor wafer
10/04/2007	US20070232200 Grinding sheet and grinding method
10/04/2007	US20070232197 Polishing slurry and polishing method
10/04/2007	US20070232193 Substrate holding apparatus, polishing apparatus, and polishing method
10/04/2007	US20070232068 Slurry for touch-up CMP and method of manufacturing semiconductor device
10/04/2007	US20070231245 Polishing material and production method therefor
10/04/2007	US20070230064 Polishing method of soft magnetic layer in thin-film magnetic head, manufacturing method of thin-film magnetic head and thin-film magnetic head
10/04/2007	US20070229812 Method and instrument for measuring semiconductor wafers
10/03/2007	EP1839812A2 Substrate holding apparatus, polishing apparatus, and polishing method
10/03/2007	CN101045855A Polishing fluid and polishing method
10/03/2007	CN101045288A 研磨片和研磨方法 Abrasive sheet and polishing method
10/03/2007	CN101045286A Substrate holding apparatus, polishing apparatus, and polishing method
10/03/2007	CN100341118C Wafer holding ring for chemical and mechanical polisher
10/03/2007	CN100341048C Apparatus and method for grinding thin film magnetic heads
10/02/2007	US7276743 Retaining ring with conductive portion
10/02/2007	US7276446 Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
10/02/2007	US7275311 Apparatus and system for precise lapping of recessed and protruding elements in a workpiece
09/2007
09/27/2007	WO2007108215A1 Polishing composition
09/27/2007	WO2007108153A1 Polishing composition for silicon wafer, composition kit for silicon wafer polishing, and methods of polishing silicon wafer
09/27/2007	WO2007107176A1 Method of reducing risk of delamination of a layer of a semiconductor device
09/27/2007	US20070224923 Polishing pad, chemical mechanical polishing apparatus and method for manufacturing polishing pad
09/27/2007	US20070224916 Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus
09/27/2007	US20070224864 CMP retaining ring
09/27/2007	US20070224806 Metal polishing slurry
09/27/2007	US20070224760 Method for manufacturing semiconductor device
09/27/2007	US20070224101 Semiconductor Polishing Composition
09/27/2007	US20070221615 Liquid supply method, liquid supply apparatus, substrate polishing apparatus, and method of measuring supply flow rate of liquid
09/26/2007	EP1837903A2 Metal polishing slurry
09/26/2007	EP1837901A1 Process for producing abrasive material, abrasive material produced by the same, and process for producing silicon wafer
09/26/2007	EP1837122A2 Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control
09/26/2007	EP0999013B1 Polishing grinding wheel and substrate polishing method with this grinding wheel
09/26/2007	CN101041769A Metal polishing slurry
09/26/2007	CN100339954C CMP abrasive and substrate polishing method
09/26/2007	CN100339420C Compositions and methods for chemical mechanical polishing silica and silicon nitride
09/25/2007	US7273411 Polishing apparatus
09/25/2007	US7273407 Transparent polishing pad
09/20/2007	WO2007105611A1 Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure, semiconductor wafer grinding method using such semiconductor wafer protecting structure, and semiconductor chip manufacturing method
09/20/2007	WO2007030779A3 Apparatus and method for polishing objects using object cleaners
09/20/2007	US20070218817 Loading device for chemical mechanical polisher of semiconductor wafer
09/20/2007	US20070218811 Cmp polishing slurry and method of polishing substrate

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