Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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12/05/2007 | EP1863073A1 Polishing pad |
12/05/2007 | EP1862259A1 Workpiece centering apparatus and method of centering workpiece |
12/05/2007 | EP1365445B1 Working shape prediction method, working requirement determination method, working method, working system, method of manufacturing semiconductor device, computer program, and computer program storage medium |
12/05/2007 | CN100353502C 抛光垫 Polishing pad |
12/05/2007 | CN100352874C Apparatus and method for replacing a media content item |
12/05/2007 | CN100352607C Abrasive articles with a liner with protrusions and methods of making and using the same |
12/05/2007 | CN100352605C 化学机械抛光垫以及化学机械抛光方法 Chemical mechanical polishing pad and chemical mechanical polishing method |
12/04/2007 | US7303662 Contacts for electrochemical processing |
12/04/2007 | US7303601 Slurries comprising mixtures of silica sol, hydrogen peroxide, 1-hydroxyethylidene-1,1-diphosphonic acid and water, used for planarization of nickel phosphide plated substrates; high density magnetic recording media; disk drives |
12/04/2007 | US7303599 Manufacture of lapping board |
12/04/2007 | US7303467 Chemical mechanical polishing apparatus with rotating belt |
12/04/2007 | US7303466 Carrier head of chemical mechanical polishing apparatus having barriers dividing pressure chamber into a plurality of pressure zones |
12/04/2007 | US7303462 Edge bead removal by an electro polishing process |
11/29/2007 | WO2007135794A1 Slurry for chemical mechanical polishing, method of chemical mechanical polishing and process for manufacturing electronic device |
11/29/2007 | US20070275639 Workpiece centering apparatus and method of centering workpiece |
11/29/2007 | US20070275637 Methods and systems for planarizing workpieces, e.g., microelectronic workpieces |
11/29/2007 | US20070275260 Palladium-containing particles, method and apparatus of manufacturing palladium-containing devices made therefrom |
11/29/2007 | US20070272356 Multipe zone carrier head with flexible membrane |
11/28/2007 | EP1860689A1 Polishing head for semiconductor wafer, polishing apparatus and polishing method |
11/28/2007 | EP1860688A1 Abrasive for semiconductor integrated circuit device, method for polishing semiconductor integrated circuit device and semiconductor integrated circuit device manufacturing method |
11/28/2007 | CN100351282C Polyol composition of the two-part system for foam grindstone, two-part curable composition for foam grindstone, foam grindstone, and process for production thereof |
11/28/2007 | CN100351063C Brazed diamond tools and methods for making the same |
11/28/2007 | CN100351040C Chip grinding stage |
11/27/2007 | US7300877 Method of manufacturing a semiconductor device |
11/27/2007 | US7300874 Chemical mechanical polishing compositions and methods relating thereto |
11/27/2007 | US7300603 Aqueous solution mixture of oxidizer and abrasive; using polymaleic acid; acidity pH |
11/27/2007 | US7300480 Comprises oxidizer (hydrogen peroxide), inhibitor of nonferrous metal, abrasive, complexing agent, imine derivatives (acetamidine hydrochloride), hydrazine derivatives (carbohydrazide), and water; for use with polyurethane polishing pads; for semiconductor substrates |
11/27/2007 | US7300335 Glass substrate for data recording medium, manufacturing method thereof and polishing pad used in the method |
11/27/2007 | US7300332 Polished state monitoring apparatus and polishing apparatus using the same |
11/22/2007 | WO2007132933A1 Method for producing polishing composition |
11/22/2007 | WO2007132881A1 Double sided adhesive tape for fixing polishing pad |
11/22/2007 | WO2007132855A1 Polishing pad |
11/22/2007 | WO2007132854A1 Polishing pad |
11/22/2007 | US20070270089 Polishing device |
11/22/2007 | US20070270087 Polishing device and method |
11/22/2007 | US20070270086 Polishing solution supply system, method of supplying polishing solution, apparatus for and method of polishing semiconductor substrate and method of manufacturing semiconductor device |
11/22/2007 | US20070270083 Methods and apparatus for controlling the lapping of a slider based on an amplitude of a readback signal produced from an externally applied magnetic field |
11/22/2007 | US20070270082 Methods and apparatus for controlling the lapping of a slider based on an amplitude of a readback signal produced from an externally applied magnetic field |
11/22/2007 | US20070269986 Method, apparatus and system for use in processing wafers |
11/22/2007 | US20070269684 Magnetic Disk Substrate and Production Method of Magnetic Disk |
11/22/2007 | US20070266642 Abrasive, method of polishing target member and process for producing semiconductor device |
11/22/2007 | US20070266640 Includes aqueous dispersion solution of fumed silica; efficiently polishing semiconductor device such as wafer at high polishing speed without causing flaw |
11/21/2007 | CN101075472A System and method for using chemical and mechanical polishing technology to generating micro grain on sliding device substrate |
11/21/2007 | CN101073880A Grinding pad and its production |
11/21/2007 | CN100350455C Method for polishing dielectric relative surface of thin-film magnetic head |
11/21/2007 | CN100350008C 抛光组合物 The polishing composition |
11/20/2007 | US7297047 Bubble suppressing flow controller with ultrasonic flow meter |
11/15/2007 | WO2007131094A2 Method and apparatus for chemical mechanical polishing of large size wafer with capability of polishing individual die |
11/15/2007 | US20070264919 Polishing pad |
11/15/2007 | US20070264914 Substrate delivery mechanism |
11/15/2007 | US20070264908 Polishing solution supply system, method of supplying polishing solution, apparatus for and method of polishing semiconductor substrate and method of manufacturing semiconductor device |
11/15/2007 | US20070264829 Slurry and method for chemical mechanical polishing |
11/15/2007 | DE10224559B4 Polierverfahren zur Entfernung von Eckmaterial von einem Halbleiterwafer A polishing method for removing corner material from a semiconductor wafer |
11/14/2007 | EP1853406A1 Substrate polishing method and apparatus |
11/14/2007 | CN101072658A Substrate holding device and polishing apparatus |
11/14/2007 | CN101072657A Polishing pad and manufacturing method thereof |
11/13/2007 | US7294044 Slurry composition and method for polishing organic polymer-based ophthalmic substrates |
11/13/2007 | US7294043 CMP apparatus and process sequence method |
11/13/2007 | US7294041 Moving head for semiconductor wafer polishing apparatus |
11/13/2007 | US7294039 Polishing system with in-line and in-situ metrology |
11/13/2007 | US7294038 Process control in electrochemically assisted planarization |
11/08/2007 | WO2007126030A1 Oxide crystal fine particle and polishing slurry including the fine particle |
11/08/2007 | WO2007125511A2 Wafer de-chucking |
11/08/2007 | US20070258875 Mixed Rare Earth Oxide, Mixed Rare Earth Fluoride, Cerium-Based Abrasive Using the Materials and Production Processes Thereof |
11/08/2007 | US20070257388 Aerosol method and apparatus, particulate products, and electronic devices made therefrom |
11/08/2007 | US20070256517 Aerosol method and apparatus, particulate products, and electronic devices made therefrom |
11/08/2007 | US20070256368 Polishing composition and polising method using the same |
11/08/2007 | US20070256367 Polishing Slurry, Production Method of Glass Substrate for Information Recording Medium and Production Method of Information Recording Medium |
11/07/2007 | EP1852900A1 Carrier for double side polishing machine and double side polishing machine employing it, and double side polishing method |
11/07/2007 | EP1852898A1 Cmp polishing method, cmp polishing apparatus, and process for producing semiconductor device |
11/07/2007 | EP1852481A1 Silane containing polishing composition for CMP |
11/07/2007 | EP1852220A1 Substrate holding apparatus |
11/07/2007 | EP1851002A1 Polishing apparatus and polishing method |
11/07/2007 | CN200970715Y Polishing parts used for electrochemical mechinery polishing |
11/07/2007 | CN101069271A Process for producing abrasive, abrasive produced by the same, and process for producing silicon wafer |
11/07/2007 | CN101068901A Adjuvant for chemical mechanical polishing slurry |
11/07/2007 | CN101068656A Polishing pad with microporous regions |
11/07/2007 | CN100347828C Polishing pad having a groove arrangement for reducing slurry consumption |
11/07/2007 | CN100347827C Polishing method and grinding fluid |
11/07/2007 | CN100347826C Polishing pad with high optical transmission window |
11/07/2007 | CN100347825C Polishing pad for electrochemical mechanical polishing |
11/07/2007 | CN100347227C Composite for grinding |
11/07/2007 | CN100346930C Polishing pad comprising particulate polymer and crosslinked polymer binder |
11/07/2007 | CN100346926C Method and apparatus for polishing outer peripheral chamfered part of wafer |
11/06/2007 | US7291188 Stable polishing performance for a long time and capable of improving the polishing rate without employing a dressing treatment |
11/06/2007 | US7291057 Apparatus for polishing a substrate |
11/06/2007 | US7291055 Wafer polishing method and apparatus |
11/01/2007 | WO2007123235A1 Polishing liquid for cmp and method of polishing |
11/01/2007 | WO2007123203A1 Method for producing oxide particle, slurry, polishing agent and method for polishing substrate |
11/01/2007 | WO2007123168A1 Process for producing polishing pad |
11/01/2007 | US20070254565 Substrate polishing apparatus |
11/01/2007 | US20070254564 Base Pad Polishing Pad and Multi-Layer Pad Comprising the Same |
11/01/2007 | US20070254558 Polishing Apparatus and Polishing Method |
11/01/2007 | US20070254557 Polishing state monitoring apparatus and polishing apparatus and method |
11/01/2007 | US20070254191 Magnetic Disk Substrate and Production Method of Magnetic Disk |
11/01/2007 | US20070251157 Pre-coated particles for chemical mechanical polishing |
10/31/2007 | EP1848569A1 Customized polishing pads for cmp and methods of fabrication and use thereof |
10/31/2007 | EP1641597A4 Substrate polishing apparatus |
10/31/2007 | CN200967172Y Main pressure transmission mechanism of steel ball grinder |
10/31/2007 | CN200967171Y Pressure-limiting device of steel ball flashing machine |