Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
12/2007
12/05/2007EP1863073A1 Polishing pad
12/05/2007EP1862259A1 Workpiece centering apparatus and method of centering workpiece
12/05/2007EP1365445B1 Working shape prediction method, working requirement determination method, working method, working system, method of manufacturing semiconductor device, computer program, and computer program storage medium
12/05/2007CN100353502C 抛光垫 Polishing pad
12/05/2007CN100352874C Apparatus and method for replacing a media content item
12/05/2007CN100352607C Abrasive articles with a liner with protrusions and methods of making and using the same
12/05/2007CN100352605C 化学机械抛光垫以及化学机械抛光方法 Chemical mechanical polishing pad and chemical mechanical polishing method
12/04/2007US7303662 Contacts for electrochemical processing
12/04/2007US7303601 Slurries comprising mixtures of silica sol, hydrogen peroxide, 1-hydroxyethylidene-1,1-diphosphonic acid and water, used for planarization of nickel phosphide plated substrates; high density magnetic recording media; disk drives
12/04/2007US7303599 Manufacture of lapping board
12/04/2007US7303467 Chemical mechanical polishing apparatus with rotating belt
12/04/2007US7303466 Carrier head of chemical mechanical polishing apparatus having barriers dividing pressure chamber into a plurality of pressure zones
12/04/2007US7303462 Edge bead removal by an electro polishing process
11/2007
11/29/2007WO2007135794A1 Slurry for chemical mechanical polishing, method of chemical mechanical polishing and process for manufacturing electronic device
11/29/2007US20070275639 Workpiece centering apparatus and method of centering workpiece
11/29/2007US20070275637 Methods and systems for planarizing workpieces, e.g., microelectronic workpieces
11/29/2007US20070275260 Palladium-containing particles, method and apparatus of manufacturing palladium-containing devices made therefrom
11/29/2007US20070272356 Multipe zone carrier head with flexible membrane
11/28/2007EP1860689A1 Polishing head for semiconductor wafer, polishing apparatus and polishing method
11/28/2007EP1860688A1 Abrasive for semiconductor integrated circuit device, method for polishing semiconductor integrated circuit device and semiconductor integrated circuit device manufacturing method
11/28/2007CN100351282C Polyol composition of the two-part system for foam grindstone, two-part curable composition for foam grindstone, foam grindstone, and process for production thereof
11/28/2007CN100351063C Brazed diamond tools and methods for making the same
11/28/2007CN100351040C Chip grinding stage
11/27/2007US7300877 Method of manufacturing a semiconductor device
11/27/2007US7300874 Chemical mechanical polishing compositions and methods relating thereto
11/27/2007US7300603 Aqueous solution mixture of oxidizer and abrasive; using polymaleic acid; acidity pH
11/27/2007US7300480 Comprises oxidizer (hydrogen peroxide), inhibitor of nonferrous metal, abrasive, complexing agent, imine derivatives (acetamidine hydrochloride), hydrazine derivatives (carbohydrazide), and water; for use with polyurethane polishing pads; for semiconductor substrates
11/27/2007US7300335 Glass substrate for data recording medium, manufacturing method thereof and polishing pad used in the method
11/27/2007US7300332 Polished state monitoring apparatus and polishing apparatus using the same
11/22/2007WO2007132933A1 Method for producing polishing composition
11/22/2007WO2007132881A1 Double sided adhesive tape for fixing polishing pad
11/22/2007WO2007132855A1 Polishing pad
11/22/2007WO2007132854A1 Polishing pad
11/22/2007US20070270089 Polishing device
11/22/2007US20070270087 Polishing device and method
11/22/2007US20070270086 Polishing solution supply system, method of supplying polishing solution, apparatus for and method of polishing semiconductor substrate and method of manufacturing semiconductor device
11/22/2007US20070270083 Methods and apparatus for controlling the lapping of a slider based on an amplitude of a readback signal produced from an externally applied magnetic field
11/22/2007US20070270082 Methods and apparatus for controlling the lapping of a slider based on an amplitude of a readback signal produced from an externally applied magnetic field
11/22/2007US20070269986 Method, apparatus and system for use in processing wafers
11/22/2007US20070269684 Magnetic Disk Substrate and Production Method of Magnetic Disk
11/22/2007US20070266642 Abrasive, method of polishing target member and process for producing semiconductor device
11/22/2007US20070266640 Includes aqueous dispersion solution of fumed silica; efficiently polishing semiconductor device such as wafer at high polishing speed without causing flaw
11/21/2007CN101075472A System and method for using chemical and mechanical polishing technology to generating micro grain on sliding device substrate
11/21/2007CN101073880A Grinding pad and its production
11/21/2007CN100350455C Method for polishing dielectric relative surface of thin-film magnetic head
11/21/2007CN100350008C 抛光组合物 The polishing composition
11/20/2007US7297047 Bubble suppressing flow controller with ultrasonic flow meter
11/15/2007WO2007131094A2 Method and apparatus for chemical mechanical polishing of large size wafer with capability of polishing individual die
11/15/2007US20070264919 Polishing pad
11/15/2007US20070264914 Substrate delivery mechanism
11/15/2007US20070264908 Polishing solution supply system, method of supplying polishing solution, apparatus for and method of polishing semiconductor substrate and method of manufacturing semiconductor device
11/15/2007US20070264829 Slurry and method for chemical mechanical polishing
11/15/2007DE10224559B4 Polierverfahren zur Entfernung von Eckmaterial von einem Halbleiterwafer A polishing method for removing corner material from a semiconductor wafer
11/14/2007EP1853406A1 Substrate polishing method and apparatus
11/14/2007CN101072658A Substrate holding device and polishing apparatus
11/14/2007CN101072657A Polishing pad and manufacturing method thereof
11/13/2007US7294044 Slurry composition and method for polishing organic polymer-based ophthalmic substrates
11/13/2007US7294043 CMP apparatus and process sequence method
11/13/2007US7294041 Moving head for semiconductor wafer polishing apparatus
11/13/2007US7294039 Polishing system with in-line and in-situ metrology
11/13/2007US7294038 Process control in electrochemically assisted planarization
11/08/2007WO2007126030A1 Oxide crystal fine particle and polishing slurry including the fine particle
11/08/2007WO2007125511A2 Wafer de-chucking
11/08/2007US20070258875 Mixed Rare Earth Oxide, Mixed Rare Earth Fluoride, Cerium-Based Abrasive Using the Materials and Production Processes Thereof
11/08/2007US20070257388 Aerosol method and apparatus, particulate products, and electronic devices made therefrom
11/08/2007US20070256517 Aerosol method and apparatus, particulate products, and electronic devices made therefrom
11/08/2007US20070256368 Polishing composition and polising method using the same
11/08/2007US20070256367 Polishing Slurry, Production Method of Glass Substrate for Information Recording Medium and Production Method of Information Recording Medium
11/07/2007EP1852900A1 Carrier for double side polishing machine and double side polishing machine employing it, and double side polishing method
11/07/2007EP1852898A1 Cmp polishing method, cmp polishing apparatus, and process for producing semiconductor device
11/07/2007EP1852481A1 Silane containing polishing composition for CMP
11/07/2007EP1852220A1 Substrate holding apparatus
11/07/2007EP1851002A1 Polishing apparatus and polishing method
11/07/2007CN200970715Y Polishing parts used for electrochemical mechinery polishing
11/07/2007CN101069271A Process for producing abrasive, abrasive produced by the same, and process for producing silicon wafer
11/07/2007CN101068901A Adjuvant for chemical mechanical polishing slurry
11/07/2007CN101068656A Polishing pad with microporous regions
11/07/2007CN100347828C Polishing pad having a groove arrangement for reducing slurry consumption
11/07/2007CN100347827C Polishing method and grinding fluid
11/07/2007CN100347826C Polishing pad with high optical transmission window
11/07/2007CN100347825C Polishing pad for electrochemical mechanical polishing
11/07/2007CN100347227C Composite for grinding
11/07/2007CN100346930C Polishing pad comprising particulate polymer and crosslinked polymer binder
11/07/2007CN100346926C Method and apparatus for polishing outer peripheral chamfered part of wafer
11/06/2007US7291188 Stable polishing performance for a long time and capable of improving the polishing rate without employing a dressing treatment
11/06/2007US7291057 Apparatus for polishing a substrate
11/06/2007US7291055 Wafer polishing method and apparatus
11/01/2007WO2007123235A1 Polishing liquid for cmp and method of polishing
11/01/2007WO2007123203A1 Method for producing oxide particle, slurry, polishing agent and method for polishing substrate
11/01/2007WO2007123168A1 Process for producing polishing pad
11/01/2007US20070254565 Substrate polishing apparatus
11/01/2007US20070254564 Base Pad Polishing Pad and Multi-Layer Pad Comprising the Same
11/01/2007US20070254558 Polishing Apparatus and Polishing Method
11/01/2007US20070254557 Polishing state monitoring apparatus and polishing apparatus and method
11/01/2007US20070254191 Magnetic Disk Substrate and Production Method of Magnetic Disk
11/01/2007US20070251157 Pre-coated particles for chemical mechanical polishing
10/2007
10/31/2007EP1848569A1 Customized polishing pads for cmp and methods of fabrication and use thereof
10/31/2007EP1641597A4 Substrate polishing apparatus
10/31/2007CN200967172Y Main pressure transmission mechanism of steel ball grinder
10/31/2007CN200967171Y Pressure-limiting device of steel ball flashing machine
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