| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
|---|
| 01/23/2008 | EP1879720A1 Multi-layer polishing pad material for cmp |
| 01/23/2008 | EP1755826A4 Polishing pad |
| 01/23/2008 | CN101108470A LCD glass grinder |
| 01/23/2008 | CN100363152C False making process and grinding pad regulating method for chemomechanical grinding process |
| 01/22/2008 | US7320635 Device for sharpening chain saw teeth |
| 01/17/2008 | WO2008008593A1 Polishing pad with window for planarization |
| 01/17/2008 | US20080014841 Low friction planarizing/polishing pads and use thereof |
| 01/17/2008 | US20080014839 Method For The Simultaneous Double-Side Grinding Of A Plurality Of Semiconductor Wafers, And Semiconductor Wafer Having Outstanding Flatness |
| 01/17/2008 | US20080014838 Additive composition, slurry composition including the same, and method of polishing an object using the slurry composition |
| 01/17/2008 | US20080014756 Method of producing group 3 nitride substrate wafers and group 3 nitride substrate wafers |
| 01/17/2008 | US20080014751 Method of manufacturing semiconductor device |
| 01/17/2008 | US20080012556 Element for detecting the amount of lapping having a resistive film electrically connected to the substrate |
| 01/17/2008 | US20080012157 System and method for delivering chemicals |
| 01/16/2008 | EP1879222A2 Method of producing group 3 nitride substrate wafers and group 3 nitride substrate wafers |
| 01/16/2008 | CN201006583Y Fixed grinding aids high efficiency grinding equipment for high precision ceramic |
| 01/16/2008 | CN101107697A CMP polishing method, CMP polishing apparatus, and process for producing semiconductor device |
| 01/16/2008 | CN101107098A Chemical-mechanical planarization tool force calibration method and system |
| 01/16/2008 | CN101107097A Substrate polishing method and apparatus |
| 01/16/2008 | CN101107095A Multi-layer polishing pad for low-pressure polishing |
| 01/16/2008 | CN101107090A Electroprocessing profile control |
| 01/16/2008 | CN101106905A Polishing pad and method of making same |
| 01/16/2008 | CN101106085A Method of manufacturing semiconductor device |
| 01/16/2008 | CN101106082A Method for the simultaneous double-side grinding of a plurality of semiconductor wafers, and semiconductor wafer having outstanding flatness |
| 01/16/2008 | CN101104791A Cerium based polishing material and raw materials therefor |
| 01/16/2008 | CN101104250A Method for effectively controlling CMP milling residual-film thickness |
| 01/16/2008 | CN100362630C Polishing body, polishing device, semiconductor device, and method of manufacturing semiconductor device |
| 01/16/2008 | CN100361784C Method and apparatus for heating polishing pad |
| 01/10/2008 | WO2008004601A1 System and method for polishing surface of tape-like metal base material |
| 01/10/2008 | WO2008004579A1 Polishing liquid for cmp and polishing method |
| 01/10/2008 | WO2008004534A1 Polishing liquid for cmp |
| 01/10/2008 | US20080009228 Polishing pad, method for manufacturing the polishing pad, and method for polishing an object |
| 01/10/2008 | US20080007872 Storage device with slider with sacrificial lapping extension |
| 01/09/2008 | EP1876639A1 Shower plate and method for manufacturing the same |
| 01/09/2008 | EP1875987A2 Method and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate |
| 01/09/2008 | CN201002204Y Steel ball grinding machine |
| 01/09/2008 | CN201002203Y Steel ball flashing machine |
| 01/09/2008 | CN101100595A Lapping liquid composition for glass substrate |
| 01/09/2008 | CN100361277C Polishing composition and method for forming wiring structure using the same |
| 01/09/2008 | CN100360447C Glass-ceramics |
| 01/08/2008 | US7316976 Polishing method to reduce dishing of tungsten on a dielectric |
| 01/08/2008 | US7316790 Securing a document by applying a metal sulfide phosphor powder containing particles that are spherical and have an average particle size of 0.3 to not greater than 10 mu m.; up-converter particles; emits at least two different wavelengths |
| 01/08/2008 | US7316786 Method of polishing film to be polished |
| 01/08/2008 | US7316725 Copper powders methods for producing powders and devices fabricated from same |
| 01/03/2008 | US20080004193 Semiconductor process residue removal composition and process |
| 01/03/2008 | US20080003936 Polishing pad for eddy current monitoring |
| 01/03/2008 | US20080003925 Cmp Polishing Slurry and Method of Polishing Substrate |
| 01/03/2008 | US20080003924 Polishing slurry and polishing method |
| 01/03/2008 | US20080003828 Method for planarizing thin layer of semiconductor device |
| 01/03/2008 | US20080000878 Method of texturing |
| 01/02/2008 | EP1873820A1 Wafer transfer apparatus, polishing apparatus and wafer receiving method |
| 01/02/2008 | CN101098944A Abrasive composition |
| 01/02/2008 | CN101097834A Method for planarizing film of semiconductor device |
| 01/02/2008 | CN101096077A Substrate holding device and polishing device |
| 01/01/2008 | US7314402 Method and apparatus for controlling slurry distribution |
| 01/01/2008 | US7314401 Methods and systems for conditioning planarizing pads used in planarizing substrates |
| 12/27/2007 | WO2007149113A2 Friction reducing aid for cmp |
| 12/27/2007 | US20070298694 Wafer polishing head |
| 12/27/2007 | US20070298693 CMP-apparatus retainer ring and manufacturing method thereof, and CMP apparatus |
| 12/27/2007 | US20070298688 Magnetic Disk Substrate and Production Method of Magnetic Disk |
| 12/27/2007 | US20070298606 Chemical-mechanical polishing method and apparatus |
| 12/27/2007 | US20070295934 Polishing slurry and polishing method |
| 12/27/2007 | US20070295265 Method for Producing Silicon Wafer and Silicon Wafer |
| 12/26/2007 | EP1870928A1 Polishing composition |
| 12/26/2007 | EP1868953A2 Composition and method for polishing a sapphire surface |
| 12/26/2007 | EP1868769A2 Slurry composition and method for polishing organic polymer-based ophthalmic substrates |
| 12/26/2007 | EP1483349B1 Anionic abrasive particles treated with positively-charged polyelectrolytes for cmp |
| 12/26/2007 | CN101094748A Methods and apparatuses for electrochemical-mechanical polishing |
| 12/25/2007 | US7311862 Phase separation to form interpenetrating polymer network comprising a continuous polymer-rich phase interspersed with a continuous polymer-depleted phase; binodal or spinodal decomposition; solidifying polymer-rich phase; evaporating or solvent stripping polymer-depleted phase |
| 12/25/2007 | US7311855 Cerium oxide, acetylene compound, and water; flattening dielectrics; semiconductors |
| 12/25/2007 | US7311592 Conductive polishing article for electrochemical mechanical polishing |
| 12/25/2007 | US7311586 Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure |
| 12/20/2007 | US20070293129 Substrate Holding Device And Polishing Apparatus |
| 12/20/2007 | US20070293049 Slurry for CMP of Cu film, polishing method and method for manufacturing semiconductor device |
| 12/20/2007 | US20070293047 Polishing method and method for fabricating semiconductor device |
| 12/20/2007 | US20070289946 Method for polishing a substrate surface |
| 12/20/2007 | DE102007027443A1 Polishing device for polishing semiconductor wafer, has main polishing arrangement, which has multiple polishing tables, multiple polishing heads and multiple loading and unloading stations, which are coupled with main frame arrangement |
| 12/19/2007 | CN101091238A Silicon wafer polishing method and silicon wafer producing method, apparatus for polishing disc-like work and silicon wafer |
| 12/19/2007 | CN100356523C Microelectronic substrate having conductive material with blunt cornered apertures, and associated methods for removing conductive material |
| 12/19/2007 | CN100356516C Single-layer polishing pad and method of producing the same |
| 12/19/2007 | CN100356515C Polishing pad and semiconductor substrate manufacturing method using the polishing pad |
| 12/19/2007 | CN100355858C Slurry for chemical-mechanical polishing copper damascene structures |
| 12/19/2007 | CN100355798C Manufacturing method of potishing pad use polyurethane foam and polyurethane foam |
| 12/18/2007 | US7309618 Method and apparatus for real time metal film thickness measurement |
| 12/18/2007 | US7309406 Method and apparatus for plating and polishing semiconductor substrate |
| 12/13/2007 | WO2007142235A1 Polishing cloth for precision processing |
| 12/13/2007 | US20070287362 Polishing composition and method of polishing with the same |
| 12/13/2007 | US20070284338 Chemical mechanical polishing method |
| 12/12/2007 | EP1865546A1 Abrasive for semiconductor integrated circuit device, method of polishing therewith and process for producing semiconductor integrated circuit device |
| 12/12/2007 | EP1809439A4 Electronic die positioning device and method |
| 12/12/2007 | EP1222056B1 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization |
| 12/11/2007 | US7307023 Polishing method of Cu film and method for manufacturing semiconductor device |
| 12/11/2007 | US7306747 Use of fluorinated additives in the etching or polishing of integrated circuits |
| 12/11/2007 | US7306637 Chemical-mechanical polishing systems; particles are electrostatically associated with the polyelectrolyte, have a negative zeta potential, and are obtained by treating particles having a positive zeta potential with a charge-reversing agent. |
| 12/11/2007 | US7306510 Method of adhering polishing pads and jig for adhering the same |
| 12/11/2007 | US7306509 Processing device, processing method and method of manufacturing semiconductor device |
| 12/11/2007 | US7306506 In-situ chemical-mechanical planarization pad metrology using ultrasonic imaging |
| 12/06/2007 | WO2007138975A1 Polishing composition and polishing method |
| 12/06/2007 | WO2005123333A3 Single component pad backer for polishing head of an orbital chemical mechanical polishing machine and method therefor |
| 12/06/2007 | US20070281587 Method of making and apparatus having polishing pad with window |
| 12/06/2007 | US20070281485 Method of and apparatus for semiconductor device |