| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 03/05/2008 | CN100372902C Rare earth salt oxidizer based CMP method |
| 03/05/2008 | CN100372648C A polishing machine and method |
| 03/04/2008 | US7338904 Method for manufacturing single-side mirror surface wafer |
| 03/04/2008 | US7338353 Loading device for chemical mechanical polisher of semiconductor wafer |
| 02/28/2008 | WO2008023782A1 Method for polishing tape substrate for oxide superconductor and oxide superconductor and substrate for oxide superconductor |
| 02/28/2008 | WO2008023288A2 An apparatus for and method of polishing a semiconductor wafer using chemical mechanical planarization |
| 02/28/2008 | WO2007149113A9 Friction reducing aid for cmp |
| 02/28/2008 | WO2007120163A3 Use of cmp for aluminum mirror and solar cell fabrication |
| 02/28/2008 | US20080051010 Polishing Composition and Polishing Method |
| 02/28/2008 | US20080051009 Endpoint for electroprocessing |
| 02/28/2008 | US20080051008 Apparatus and method for chemical mechanical polishing with improved uniformity |
| 02/28/2008 | US20080047841 Electroprocessing profile control |
| 02/28/2008 | US20080047667 Substrate holding apparatus and substrate polishing apparatus |
| 02/27/2008 | EP1459368B1 Use of strontium carbonate as polishing agent for the chemical and mechanical polishing of microelectronic components |
| 02/27/2008 | CN201026590Y Split type small circular machine gun barrel |
| 02/27/2008 | CN101130668A Polishing composition and polishing method |
| 02/27/2008 | CN101130667A Polishing composition and polishing method with low content of sodium and acetate ions. |
| 02/27/2008 | CN101130234A Polishing pad and method of producing the same |
| 02/27/2008 | CN101130233A Polishing pad and method of producing the same |
| 02/27/2008 | CN101130232A Polishing pad and method of producing the same |
| 02/27/2008 | CN101130231A Polishing pad and method of producing the same |
| 02/27/2008 | CN100372073C Polishing fluid and method of polishing |
| 02/26/2008 | US7335094 Single-layer polishing pad and method of producing the same |
| 02/21/2008 | WO2007125511A3 Wafer de-chucking |
| 02/21/2008 | US20080045125 Polishing Pad and Chemical Mechanical Polishing Apparatus |
| 02/21/2008 | US20080045021 Dual reduced agents for barrier removal in chemical mechanical polishing |
| 02/21/2008 | US20080045012 Electroprocessing profile control |
| 02/21/2008 | DE102007034959A1 Polierpad und Chemisch-Mechanische Poliervorrichtung Polishing and chemical-mechanical polishing apparatus |
| 02/20/2008 | EP1890321A1 Semiconductor abrasive |
| 02/20/2008 | EP1445796B1 Polishing compound, method for production thereof and polishing method |
| 02/20/2008 | CN201023212Y Chemical machinery polishing grinding head |
| 02/20/2008 | CN201023210Y Grinding device and centrifugal grinding separator |
| 02/20/2008 | CN101128920A Carrier for double side polishing machine and double side polishing machine employing it, and double side polishing method |
| 02/20/2008 | CN101128285A Polishing device and polishing method |
| 02/20/2008 | CN101125419A 抛光垫和化学机械抛光装置 Polishing pad and chemical mechanical polishing apparatus |
| 02/20/2008 | CN101125416A Polishing method for zinc oxide single crystal substrate level substrate |
| 02/20/2008 | CN100369713C Chemico-mechanical diamond film polisher and polishing method |
| 02/19/2008 | US7333300 Magnetoresistive device with lapping guide treated to eliminate magnetoresistive effect thereof |
| 02/19/2008 | US7332438 Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool |
| 02/19/2008 | US7332104 Slurry for CMP, polishing method and method of manufacturing semiconductor device |
| 02/19/2008 | US7332099 Ion bombardment of electrical lapping guides to decrease noise during lapping process |
| 02/19/2008 | US7331847 Vibration damping in chemical mechanical polishing system |
| 02/19/2008 | US7331844 Polishing method |
| 02/19/2008 | US7331843 Substrate polishing method and method of manufacturing semiconductor device |
| 02/14/2008 | WO2007114964A3 A method for adjusting substrate processing times in a substrate polishing system |
| 02/14/2008 | US20080039000 Reataining ring and articles for carrier head |
| 02/14/2008 | US20080038999 Retaining ring with conductive portion |
| 02/14/2008 | US20080038998 Method for processing a substrate using multiple fluid distribtuions on a polishing surface |
| 02/14/2008 | US20080034670 Chemically modified chemical mechanical polishing pad |
| 02/13/2008 | CN101121248A Large-scale curved surface self-grinding-and-polishing working micro-robot |
| 02/13/2008 | CN101121237A Device for grinding and cutting wafer |
| 02/13/2008 | CN100369212C CMP polishing method and method for manufacturing semiconductor device |
| 02/13/2008 | CN100369211C Semiconductor polishing compound, process for its production and polishing method |
| 02/13/2008 | CN100369210C Polising method and device |
| 02/13/2008 | CN100369114C Magnetic memory slide pad with grinding-consumed projection |
| 02/13/2008 | CN100368496C Polishing system and method of its use |
| 02/12/2008 | US7329171 Fixed abrasive article for use in modifying a semiconductor wafer |
| 02/12/2008 | US7329170 Method of producing polishing pad |
| 02/07/2008 | WO2008016073A1 Method for polishing tape substrate for oxide superconductor, oxide superconductor, and base material for oxide superconductor |
| 02/07/2008 | WO2008015771A1 Support plate, method of detaching wafer, and method of thinning wafer |
| 02/07/2008 | US20080032602 Devices and Methods for Optical Endpoint Detection During Semiconductor Wafer Polishing |
| 02/07/2008 | US20080032504 Polishing cloth and method of manufacturing semiconductor device |
| 02/07/2008 | DE112005003420T5 Haltering für CMP-Vorrichtung und Herstellungsverfahren dafür, und CMP-Vorrichtung Retaining ring for CMP apparatus and manufacturing method thereof, and CMP apparatus |
| 02/06/2008 | EP1833640A4 Substrate holding device and polishing apparatus |
| 02/06/2008 | CN101119829A 抛光垫 Polishing pad |
| 02/06/2008 | CN101117548A Polishing composition and polishing process |
| 02/06/2008 | CN100367468C System and method of broad band optical end point detection for film change indication |
| 02/06/2008 | CN100366693C 抛光组合物 The polishing composition |
| 02/06/2008 | CN100366391C Chemical mechanical polishing pad having a process-dependent groove configuration |
| 02/06/2008 | CN100366386C Method and system for controlling the chemical mechanical polishing of substrates by calculating an overpolishing time and/or a polishing time of a final polishing step |
| 02/05/2008 | US7327034 Compositions for planarization of metal-containing surfaces using halogens and halide salts |
| 02/05/2008 | US7326103 Vertically adjustable chemical mechanical polishing head and method for use thereof |
| 02/05/2008 | US7326102 Apparatus for lapping thin film magnetic heads |
| 01/31/2008 | WO2008013226A1 Polishing composition |
| 01/31/2008 | WO2008012909A1 Interpenetrating polymer network structure and polishing pad and processes for producing them |
| 01/31/2008 | WO2007117301A3 Ball contact cover for copper loss reduction and spike reduction |
| 01/31/2008 | US20080026681 Conductive polishing article for electrochemical mechanical polishing |
| 01/31/2008 | US20080026677 Lapping machine and head device manufacturing method |
| 01/31/2008 | US20080026185 Method for Polishing Silicon Wafer, Method for Producing Silicon Wafer, Apparatus for Polishing Disk-Shaped Workpiece, and Silicon Wafer |
| 01/30/2008 | CN201012468Y Sand-rolling machine |
| 01/30/2008 | CN101115779A Polishing pad and process for producing the same |
| 01/30/2008 | CN101113996A Element for detecting the amount of lapping having a resistive film electrically connected to the substrate |
| 01/30/2008 | CN100365774C 半导体晶片的制造方法及晶片 The semiconductor wafer manufacturing method and a wafer |
| 01/30/2008 | CN100365773C Polishing pad, polishing device, and polishing method |
| 01/30/2008 | CN100364909C Aluminium-zirconium oxide and their preparing and using method |
| 01/30/2008 | CN100364720C Partial-membrane carrier head |
| 01/29/2008 | US7323415 Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor wafer |
| 01/29/2008 | US7323414 Method for polishing a substrate surface |
| 01/29/2008 | US7323095 Integrated multi-step gap fill and all feature planarization for conductive materials |
| 01/24/2008 | WO2008011014A2 System and method for processing high puruity materials |
| 01/24/2008 | WO2008010995A1 System and method for delivering chemicals |
| 01/24/2008 | WO2008010617A1 Drive mechanism of a chemical mechanical polishing apparatus |
| 01/24/2008 | WO2008010499A1 Aqueous dispersion for chemical mechanical polishing, method for producing the same, and chemical mechanical polishing method |
| 01/24/2008 | WO2008010357A1 Carrier for double side polishing device, and double side polishing device and double side polishing method using the carrier |
| 01/24/2008 | WO2008010310A1 Retainer ring of double-layer structure |
| 01/24/2008 | US20080020683 Polishing method and polishing pad |
| 01/24/2008 | US20080020676 Run-To-Run Control Of Backside Pressure For CMP Radial Uniformity Optimization Based On Center-To-Edge Model |
| 01/24/2008 | US20080017521 Process control in electro-chemical mechanical polishing |
| 01/24/2008 | CA2658127A1 Polishing pad having micro-grooves on the pad surface |
| 01/23/2008 | EP1881524A1 Polishing slurry and polishing method |