| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
|---|
| 04/09/2008 | CN100379522C Polishing pad, method of manufacturing the polishing pad, and cushion layer for polishing pad |
| 04/08/2008 | US7354861 Polishing method and polishing liquid |
| 04/08/2008 | US7354530 Chemical mechanical polishing systems and methods for their use |
| 04/08/2008 | US7354527 Chemical mechanical polishing pad and chemical mechanical polishing process |
| 04/08/2008 | US7354471 Coated silver-containing particles, method and apparatus of manufacture, and silver-containing devices made therefrom |
| 04/08/2008 | US7354335 CMP apparatus and load cup mechanism |
| 04/08/2008 | US7354332 Technique for process-qualifying a semiconductor manufacturing tool using metrology data |
| 04/03/2008 | WO2008038583A1 Cmp conditioner and process for producing the same |
| 04/03/2008 | US20080081541 Rough polishing method of semiconductor wafer and polishing apparatus of semiconductor wafer |
| 04/03/2008 | US20080081540 Substrate processing apparatus and substrate processing method |
| 04/03/2008 | US20080081469 Method for forming contact plug in a semiconductor device |
| 04/03/2008 | US20080078231 Method of determining the number of active diamonds on a conditioning disk |
| 04/03/2008 | DE102006044367A1 Verfahren zum Polieren einer Halbleiterscheibe und eine nach dem Verfahren herstellbare polierte Halbleiterscheibe A method of polishing a semiconductor wafer and a manufacturable by the method polished semiconductor wafer |
| 04/02/2008 | EP1905542A1 Method of determining the number of active abrasive grains on a conditioning disk |
| 04/02/2008 | EP1905539A1 Manufacturing an orthopaedic joint prosthesis component |
| 04/02/2008 | EP1651386B1 In situ activation of a three-dimensional fixed abrasive article |
| 04/02/2008 | EP1412129A4 Method for fabricating chemical mechanical polishing pad using laser |
| 04/02/2008 | CN101155891A Cerium oxide abrasives, process for production of the same, and use thereof |
| 04/02/2008 | CN101153838A Method of determining the number of active diamonds on a conditioning disk |
| 04/02/2008 | CN100378940C Method and system for polishing semiconductor wafers |
| 04/02/2008 | CN100377837C Microporous polishing pads |
| 04/01/2008 | US7352102 Motor |
| 03/27/2008 | WO2008036892A1 Conditioning tools and techniques for chemical mechanical planarization |
| 03/27/2008 | WO2008036108A2 Bubble suppressing flow controller with ultrasonic flow meter |
| 03/27/2008 | WO2008035586A1 Process for producing glass substrate for magnetic disk and process for manufacturing magnetic disk |
| 03/27/2008 | US20080076336 Surface plate protecting device in CMP apparatus |
| 03/27/2008 | US20080076335 Polishing apparatus and polishing method |
| 03/27/2008 | US20080076330 Chemical mechanical polishing with napped poromeric |
| 03/27/2008 | US20080076327 for soft magnetic layer on the surface of a perpendicular magnetic recording hard disk; without corroding it excessively and at a high polishing rate at a high level of accuracy; silica abrasive, a polishing accelerator, an anticorrosion agent, a pH conditioner and water; |
| 03/27/2008 | US20080076253 Adhesive Sheet,Semiconductor Device,and Process for Producing Semiconductor Device |
| 03/27/2008 | DE102007039911A1 Polierzusammensetzung und Polierverfahren Polishing composition and polishing method |
| 03/27/2008 | DE102007039910A1 Polierzusammensetzung und Polierverfahren Polishing composition and polishing method |
| 03/27/2008 | DE102007020342A1 Polierverfahren und Poliervorrichtung Polishing method and polishing apparatus |
| 03/26/2008 | EP1756244A4 Cerium oxide abrasive and slurry containing the same |
| 03/26/2008 | CN101151402A Seventy five millimeter silicon carbide wafer with low warp, bow, and TTV |
| 03/26/2008 | CN101148031A Polishing pad and method of producing the same |
| 03/26/2008 | CN101148030A Polishing pad and method of producing the same |
| 03/26/2008 | CN101148025A Method for polishing a semiconductor wafer and polished semiconductor wafer producible according to the method |
| 03/26/2008 | CN101148016A Method for correcting CMP working technology condition |
| 03/26/2008 | CN100377311C Substrate holding apparatus and polishing apparatus |
| 03/26/2008 | CN100377310C CMP polishing compound and polishing method |
| 03/26/2008 | CN100376653C Cerium based polishing material and raw materials therefor |
| 03/26/2008 | CN100376652C Cerium based abrasive material and abrasive material slurry, and method for producing cerium based abrasive material |
| 03/25/2008 | US7348276 Fabrication process of semiconductor device and polishing method |
| 03/20/2008 | WO2008032794A1 Cmp polishing agent, additive solution for cmp polishing agent, and method for polishing substrate by using the polishing agent and the additive solution |
| 03/20/2008 | WO2008032753A1 Polishing apparatus and polishing method |
| 03/20/2008 | WO2008032681A1 Polishing agent for semiconductor integrated circuit device, polishing method, and method for manufacturing semiconductor integrated circuit device |
| 03/20/2008 | WO2008032680A1 Polishing agent for semiconductor integrated circuit device, polishing method, and method for manufacturing semiconductor integrated circuit device |
| 03/20/2008 | WO2008011014A3 System and method for processing high puruity materials |
| 03/20/2008 | US20080070488 Polishing method and polishing apparatus |
| 03/20/2008 | US20080070483 Method For Polishing A Semiconductor Wafer And Polished Semiconductor Wafer Producible According To The Method |
| 03/20/2008 | US20080070479 Polishing Apparatus |
| 03/20/2008 | US20080070412 Polishing compound for semiconductor integrated circuit device, polishing method and method for producing semiconductor integrated circuit device |
| 03/20/2008 | US20080066862 Substrate holding apparatus and substrate polishing apparatus |
| 03/19/2008 | EP1899110A2 Cmp retaining ring |
| 03/19/2008 | EP1218143A4 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives |
| 03/19/2008 | CN101147242A Polishing compound for semiconductor integrated circuit device, polishing method and method for producing semiconductor integrated circuit device |
| 03/19/2008 | CN101147232A Smart conditioner rinse station |
| 03/19/2008 | CN101143433A Electroprocessing profile control |
| 03/19/2008 | CN101143432A Multi-layer polishing pad for low-pressure polishing |
| 03/19/2008 | CN101143428A Polishing pad and method of producing the same |
| 03/19/2008 | CN101143275A Bubble damper of slurry supply apparatus |
| 03/18/2008 | US7344434 Retaining ring with shaped surface |
| 03/18/2008 | US7344432 Conductive pad with ion exchange membrane for electrochemical mechanical polishing |
| 03/18/2008 | US7344431 Pad assembly for electrochemical mechanical processing |
| 03/13/2008 | WO2008029725A1 Polishing pad |
| 03/13/2008 | WO2008029538A1 Polishing pad |
| 03/13/2008 | WO2008029537A1 Method for production of polishing pad |
| 03/13/2008 | US20080064311 Polishing Pad |
| 03/13/2008 | US20080064308 Polishing apparatus and manufacturing method of an electronic apparatus |
| 03/13/2008 | US20080064302 Polishing apparatus, polishing pad, and polishing method |
| 03/13/2008 | US20080064301 Method and Apparatus Of Eddy Current Monitoring For Chemical Mechanical Polishing |
| 03/13/2008 | US20080064300 Polishing System With In-Line and In-Situ Metrology |
| 03/13/2008 | US20080060525 Bubble damper of slurry supply apparatus |
| 03/12/2008 | EP1897978A1 Manufacturing method of group III nitride substrate, group III nitride substrate, group III nitride substrate with epitaxial layer, group III nitride device, manufacturing method of group III nidtride substrate with epitaxial layer, and manufacturing method of group III nitride device |
| 03/12/2008 | CN101142659A Abrasive for semiconductor integrated circuit device, method for polishing semiconductor integrated circuit device and semiconductor integrated circuit device manufacturing method |
| 03/12/2008 | CN101140857A Method and appratus of manufacturing semiconductor device |
| 03/12/2008 | CN101138833A Group iii nitride substrate and manufacturing method of group iii nitride substrate |
| 03/11/2008 | US7341649 Apparatus for electroprocessing a workpiece surface |
| 03/11/2008 | US7341502 Methods and systems for planarizing workpieces, e.g., microelectronic workpieces |
| 03/06/2008 | WO2008027680A1 Methods and tools for controlling the removal of material from microfeature workpieces |
| 03/06/2008 | WO2008026488A1 Polishing pad |
| 03/06/2008 | WO2008026451A1 Polishing pad |
| 03/06/2008 | WO2008002735A3 Abrasive articles, cmp monitoring system and method |
| 03/06/2008 | US20080057845 Method for manufacturing microporous CMP materials having controlled pore size |
| 03/06/2008 | US20080057837 Method and appratus of manufacturing semiconductor device |
| 03/06/2008 | US20080057836 Pad conditioning head for cmp process |
| 03/06/2008 | US20080057831 Double face polishing apparatus |
| 03/06/2008 | US20080057830 Advanced workpiece finishing |
| 03/06/2008 | US20080057715 Cmp system utilizing halogen adduct |
| 03/06/2008 | US20080057608 Manufacturing method of group III nitride substrate, group III nitride substrate, group III nitride substrate with epitaxial layer, manufacturing method of group III nitride substrate with epitaxial layer, and manufacturing method of group III nitride device |
| 03/06/2008 | US20080053001 Polishing Composition and Polishing Method |
| 03/05/2008 | EP1894675A1 Double face polishing apparatus |
| 03/05/2008 | EP1587649B1 Device for the high-precision machining of the surface of an object, especially for polishing and lapping semiconductor substrates |
| 03/05/2008 | CN101137740A Lubricant composition for bonded-abrasive polishing of magnetic head |
| 03/05/2008 | CN101137464A Retainer ring for CMP device, method of manufacturing the same, and CMP device |
| 03/05/2008 | CN101134294A Sphericity part fixed abrasive lapping method |
| 03/05/2008 | CN101134292A Cmp pad having overlaid constant area spiral grooves |
| 03/05/2008 | CN100373589C Method for reducing saucerization and etching of conductor structure in chemical mechanical lapping |
| 03/05/2008 | CN100373556C Abrasive and method of polishing |