Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
05/2008
05/20/2008US7374476 Method and apparatus for forming a planarizing pad having a film and texture elements for planarization of microelectronic substrates
05/20/2008US7374474 Polishing pad for CMP, method for polishing substrate using it and method for producing polishing pad for CMP
05/20/2008US7374473 Texturing slurry and texturing method by using same
05/20/2008US7374471 Apparatus and method for polishing semiconductor wafers using one or more pivotable load-and-unload cups
05/15/2008US20080113509 Polishing method and polishing device
05/14/2008EP1920883A1 Electron beam assisted eem method
05/14/2008CN201059293Y Pneumatic system of two-sided finishing machine
05/14/2008CN201058410Y Hanging wallrelocation mechanism of two-sided grinder
05/14/2008CN101180158A Polishing pad
05/14/2008CN101177603A Polishing composition and polishing method
05/14/2008CN101177602A Lapping liquid
05/14/2008CN101177592A Composition for polishing
05/14/2008CN101176988A Endpoint detection for electro chemical mechanical polishing and electropolishing processes
05/14/2008CN100388431C Polishing pad having a pressure relief channel
05/13/2008US7371156 Off-line tool for breaking in multiple pad conditioning disks used in a chemical mechanical polishing system
05/13/2008US7371152 Non-uniform subaperture polishing
05/08/2008WO2008053948A1 Method for manufacturing chemical mechanical polishing pad and method for processing material to be polished
05/08/2008WO2008036108A3 Bubble suppressing flow controller with ultrasonic flow meter
05/08/2008US20080109089 Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
05/08/2008US20080108288 Conductive Polishing Article for Electrochemical Mechanical Polishing
05/08/2008US20080104893 Polishing composition and polishing method
05/08/2008DE19733097B4 Schleifkörper, Schleifblatt und Schleifverfahren Abrasive wheels and blade and grinding processes
05/07/2008EP1918340A2 Polishing composition and polishing method
05/07/2008EP1918069A1 Double side polishing method for wafer
05/07/2008EP1917123A1 Precision machining apparatus and precision machining method
05/07/2008EP1917122A2 Use of cmp for aluminum mirror and solar cell fabrication
05/07/2008EP1917121A2 Method and device for subsequently treating glass panes
05/07/2008EP1216316B1 Polishing of fluoride crystal optical lenses and preforms using cerium oxide for microlithography
05/07/2008CN101176187A Shower plate and method for manufacturing the same
05/07/2008CN101175603A Polishing pad, process for producing the same, and process for producing semiconductor device using said polishing pad
05/07/2008CN101173160A Roll-off reducing agent
05/07/2008CN101172332A Polishing pads useful for endpoint detection in chemical mechanical polishing
05/07/2008CN100386850C Polishing fluid and polishing method
05/06/2008US7368387 Polishing composition and polishing method
05/06/2008US7367875 CVD diamond-coated composite substrate containing a carbide-forming material and ceramic phases and method for making same
05/06/2008US7367872 Conditioner disk for use in chemical mechanical polishing
05/06/2008US7367871 Semiconductor processing methods of removing conductive material
05/06/2008US7367870 Polishing fluid and polishing method
05/06/2008US7367865 Methods for making wafers with low-defect surfaces, wafers obtained thereby and electronic components made from the wafers
05/02/2008WO2008050475A1 Polishing head and polishing apparatus
05/01/2008US20080102741 Single-layer polishing pad
05/01/2008US20080099344 Immersing a contact electrode in a solution;contacting the surface of the conductive layer with the contact solution to define a contact region;immersing a process electrode in a process solution;contacting the surface of the conductive layer with the process solution, applying an electrical potential
04/2008
04/30/2008EP1915234A2 Polishing pad comprising magnetically sensitive particles and method for the use thereof
04/30/2008EP1915233A1 Transparent microporous materials for cmp
04/30/2008CN101168241A Voltage mode current control
04/30/2008CN100385632C Chemical machanical grinding method, and equipment for preventing rudimental grinding pulp
04/30/2008CN100385631C Polishing pad for electrochemical mechanical polishing
04/29/2008US7365013 System for the preferential removal of silicon oxide
04/29/2008US7364667 Slurry for CMP and CMP method
04/29/2008US7364495 Wafer double-side polishing apparatus and double-side polishing method
04/24/2008WO2008047631A1 Method for producing long polishing pad
04/24/2008US20080096478 Polishing Tool Comprising a Drive Plate and a Removable Pad for Finishing an Ophthalmic Lens
04/24/2008US20080096475 Polishing Composition and Polishing Method
04/23/2008EP1912760A1 Chemically modified polishing pad for chemical mechanical polishing
04/23/2008CN201049437Y Polishing pad adjuster and chemical machinery device with the same
04/23/2008CN101166604A Customized polishing pads for CMP and methods of fabrication and use thereof
04/23/2008CN100383068C Method for preparing amorphous material and ceramics
04/22/2008US7361971 Semiconductor wafer protection structure and laminated protective sheet for use therein
04/22/2008US7361600 Semiconductor manufacturing apparatus having a built-in inspection apparatus and a device manufacturing method using said manufacturing apparatus
04/22/2008US7361078 Subpad support with releasable subpad securing element and polishing apparatus
04/22/2008US7361076 Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus
04/17/2008WO2008045132A1 Stepped retaining ring
04/17/2008WO2008044786A1 Machining end point detecting method, grinding method, and grinder
04/17/2008WO2008044477A1 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method for semiconductor device
04/17/2008US20080090501 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
04/17/2008US20080090498 Customized polish pads for chemical mechanical planarization
04/17/2008US20080087644 Polishing Composition And Polishing Method
04/17/2008US20080086950 Cerium oxide abrasive particles, water and acid selected from adipic, pentanedioic, butanedioic, and malonic acid; dispersion stability and removal rate; chemical mechanical polishing
04/16/2008EP1910026A1 Self-contained conditioning abrasive article
04/16/2008EP1910025A1 Abrasive agglomerate polishing method
04/16/2008EP1412443B1 Cerium oxide slurry and method of manufacturing a substrate
04/16/2008EP1287088A4 Polishing composition
04/16/2008CN101164155A Wafer transfer apparatus, polishing apparatus and wafer receiving method
04/16/2008CN101161412A Substrate retaining ring for cmp
04/16/2008CN100381963C Proportional pressure regulator having positive and negative pressure delivery capability
04/15/2008US7357704 Polishing pad
04/15/2008US7357703 Chemical mechanical polishing pad and chemical mechanical polishing method
04/15/2008US7357699 Substrate holding apparatus and polishing apparatus
04/15/2008US7357698 Polishing pad and chemical mechanical polishing apparatus using the same
04/15/2008US7357695 Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces
04/10/2008WO2008042903A2 Systems for sensing pressure/shear force
04/10/2008WO2007149113A3 Friction reducing aid for cmp
04/10/2008US20080085943 Chain extension and curing of an isocyanate-terminated prepolymer with an aromatic diamine to produce a polyurethane foam with uniform, fine cells; improved dressability with maintained planarization characteristics and polishing speed; halogen-free
04/10/2008US20080085663 comprises cerium oxide particles having an average particle size from 0.01 to 0.5 mu m, a water-soluble polyamine having a weight average molecular weight from 100 to 100,000 selected from polyether polyamine, polyalkylene polyamine, polyethyleneimine, polyvinylamine, polyallylamine, polylysine
04/10/2008US20080085658 Substrate polishing apparatus and method
04/10/2008DE102006032455A1 Verfahren zum gleichzeitigen beidseitigen Schleifen mehrerer Halbleiterscheiben sowie Halbleierscheibe mit hervorragender Ebenheit Method for simultaneous double-side grinding plurality of semiconductor wafers and semi-gurdy disc with excellent flatness
04/09/2008EP1909312A1 Abrasive and process for producing semiconductor integrated-circuit unit
04/09/2008EP1478011B1 Method and device for polishing
04/09/2008EP1433197A4 Chemical mechanical polishing pad having wave-shaped grooves
04/09/2008EP1430520A4 Chemical mechanical polishing pad with micro-holes
04/09/2008EP1417703A4 Chemical mechanical polishing pad having holes and/or grooves
04/09/2008CN101160644A 研磨组合物 Polishing composition
04/09/2008CN101159230A Substrate processing apparatus and substrate processing method
04/09/2008CN101157848A Cerium oxide type abrasive material
04/09/2008CN101157201A Finishing controlled ultraprecise polisher
04/09/2008CN101157199A Substrate polishing apparatus and method
04/09/2008CN100380600C Double side polishing device for wafer and double side polishing method
04/09/2008CN100380599C 抛光装置及基片处理装置 A polishing apparatus and a substrate processing apparatus
04/09/2008CN100380597C Method and apparatus for applying differential removal rates to a surface of a substrate
04/09/2008CN100379523C System and method for changing media surface state
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