| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 07/02/2008 | CN100398261C Conductive polishing article for electrochemical mechanical polishing |
| 07/01/2008 | US7393262 Apparatus including pin adapter for air bearing surface (ABS) lapping |
| 06/26/2008 | US20080153397 Methods for machining inorganic, non-metallic workpieces |
| 06/26/2008 | DE102007058292A1 Substrat und Herstellungsverfahren desselben Of the same substrate and manufacturing processes |
| 06/25/2008 | EP1936673A1 Polishing solution for cmp and method of polishing |
| 06/25/2008 | EP1935954A1 Compositions for chemical mechanical planarization of copper |
| 06/25/2008 | EP1935566A2 Substrate holding apparatus |
| 06/25/2008 | EP1934017A1 Polishing platen and polishing apparatus |
| 06/25/2008 | EP1934015A1 Cmp of copper/ruthenium substrates |
| 06/25/2008 | CN101208781A Polishing compound and method for producing semiconductor integrated circuit device |
| 06/25/2008 | CN101208180A Transparent microporous materials for CMP |
| 06/25/2008 | CN101208178A Use of CMP for aluminum mirror and solar cell fabrication |
| 06/25/2008 | CN100397584C Wafer grinding device and method |
| 06/25/2008 | CN100397582C Grinding pad and its production method |
| 06/25/2008 | CN100396750C Cerium-based abrasive material and method for preparation thereof |
| 06/25/2008 | CN100396749C Chemical machine flating method, use of alumina slurry, and abradant for customing and machining |
| 06/24/2008 | US7391594 Apparatus for providing an additional ground pad and electrical connection for grounding a magnetic recording head |
| 06/24/2008 | US7391086 Conductive contacts and methods for fabricating conductive contacts for elctrochemical planarization of a work piece |
| 06/19/2008 | WO2008072543A1 Method for separating bonded substrates, apparatus for separating bonded substrates and computer readable recording medium having program recorded thereon |
| 06/19/2008 | US20080146131 Polishing Pad |
| 06/19/2008 | US20080146128 Fabrication process of semiconductor device and polishing method |
| 06/19/2008 | US20080146123 Semiconductor device manufacturing apparatus and method |
| 06/19/2008 | DE112006001927T5 Polierkissen enthaltend ein Zwischenräume durchdringendes Netzwerk aus verflüssigtem Vinylmomomer mit darin befindlicher Polyurethanmatrix Polishing pad containing a spaces interpenetrating network of liquefied Vinylmomomer located therein with polyurethane matrix |
| 06/19/2008 | DE10022649B4 Polierflüssigkeit und Verfahren zur Strukturierung von Metalloxiden Polishing liquid and method for patterning metal oxides |
| 06/18/2008 | EP1931597A1 Cerium oxide powder for one-component cmp slurry, preparation method thereof, one-component cmp slurry composition comprising the same, and method of shallow trench isolation using the slurry |
| 06/18/2008 | EP1467839A4 Method and apparatus for applying downward force on wafer during cmp |
| 06/18/2008 | CN101203355A Polishing pad comprising magnetical sensitive particles and method for the use thereof |
| 06/18/2008 | CN101200628A Polishing composition and polishing process |
| 06/17/2008 | US7387970 Method of using an aqueous solution and composition thereof |
| 06/17/2008 | US7386935 Methods and apparatus for controlling the lapping of a slider based on an amplitude of a readback signal produced from an externally applied magnetic field |
| 06/12/2008 | WO2008069136A1 Method for purifying chemical added with chelating agent |
| 06/12/2008 | US20080139094 Polishing pad, method for processing polishing pad and method for producing substrate using it |
| 06/12/2008 | US20080139089 Method of polishing hard crystal substrate and polishing oil slurry therefor |
| 06/12/2008 | US20080139087 Substrate Polishing Apparatus And Substrate Polishing Method |
| 06/12/2008 | US20080138990 Polishing Composition and Polishing Method |
| 06/12/2008 | US20080138721 correcting flatness, a step of correcting surface unevenness wherein the substrate surface is polished by means of a polishing pad ( unwoven fabric impregnated with a resin ) with preferred hardness , then finishing surface roughness to provide a substrate having a high-accuracy surface profile |
| 06/11/2008 | EP1930938A1 Polishing agent, method for polishing surface to be polished, and method for manufacturing semiconductor integrated circuit device |
| 06/11/2008 | CN101195293A Pre-honed blade with a curved profile lamella and method for producing said blade |
| 06/11/2008 | CN101195206A Orthopaedic component manufacturing method and equipment |
| 06/11/2008 | CN100394555C Polishing method using polishing pad and polishing liquid, and polishing liquid |
| 06/11/2008 | CN100393832C Composition for polishing metal, polishing method for metal layer, and production method for wafer |
| 06/10/2008 | US7384534 Amines, amides, carboxylate, dicarboxylate or tri-carboxylate groups containing chelating agents, a substituted or unsubstituted benzotriazole or a polymeric corrosion resistance agent, sodium hydroxide or ammonium hydroxide as pH adjuster, a solvent |
| 06/10/2008 | US7384447 Coated nickel-containing powders, methods and apparatus for producing such powders and devices fabricated from same |
| 06/05/2008 | WO2008066213A1 Surface treatment method for coated cutting insert |
| 06/05/2008 | US20080133163 Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing |
| 06/05/2008 | US20080132156 Polishing composition and polishing method |
| 06/05/2008 | US20080132152 Method and system for controlling chemical mechanical polishing by controllably moving a slurry outlet |
| 06/05/2008 | US20080127573 Deionized water, abrasive particles, pH adjusting agent, water soluble thickener, ethoxylated acetylene surfactant and heterocyclic amine; reducing haze and number of localized light scattering defects; microsmoothness |
| 06/05/2008 | DE102006056623A1 System for chemical mechanical polishing, has controllable movable foreman head, which is formed to mount substrate and to hold in position, and foreman cushion, is mounted on plate, which is coupled with drive arrangement |
| 06/04/2008 | EP1927605A1 Polymer material, foam obtained from same, and polishing pad using those |
| 06/04/2008 | EP1927434A1 CMP conditioner |
| 06/04/2008 | EP1927433A1 Device for separating two disc-shaped elements positioned one above the other when removing one |
| 06/04/2008 | CN101191036A Slurry composition for chemical mechanical polishing and precursor composition thereof |
| 06/04/2008 | CN101190502A Main pressure transmission mechanism of steel ball grinding machine |
| 06/04/2008 | CN101190501A Pressure-limiting device of steel ball finishing machine |
| 06/04/2008 | CN100392820C Method for polishing wafer |
| 06/04/2008 | CN100392818C Method for processing chip capable of improving semiconductor chip geometric parameter |
| 06/04/2008 | CN100392035C 抛光组合物 The polishing composition |
| 06/04/2008 | CN100391693C Grinder and method for grinding workpiece |
| 06/03/2008 | US7381647 Methods and systems for planarizing microelectronic devices with Ge-Se-Ag layers |
| 06/03/2008 | US7381121 Base pad polishing pad and multi-layer pad comprising the same |
| 06/03/2008 | US7381116 Polishing media stabilizer |
| 05/29/2008 | WO2008064268A2 Friction sensor for polishing system |
| 05/29/2008 | WO2008064158A2 Lapping carrier and method |
| 05/29/2008 | WO2008062846A1 Dressing stone, glass composition for holding abrasive grains, and glass-ceramic composition for holding abrasive grains |
| 05/29/2008 | WO2001074959A8 Method for polishing a memory or rigid disk with an amino acid-containing composition |
| 05/29/2008 | US20080125017 Polishing composition and polishing method |
| 05/29/2008 | US20080125016 Method for Producing Polishing Agent, Polishing Agent Produced Thereby and Method for Producing Silicon Wafer |
| 05/29/2008 | US20080124913 Slurry compositions and CMP methods using the same |
| 05/29/2008 | US20080121840 mixing oxidizers, oxidized-metal etchants, protective film-forming agents and diluents, used for polishing semiconductors |
| 05/29/2008 | US20080121839 Slurry Composition for Chemical Mechanical Polishing and Precursor Composition Thereof |
| 05/29/2008 | US20080120918 Polishing composition and polishing process |
| 05/28/2008 | EP1925649A2 Polishing composition and polishing process |
| 05/28/2008 | EP1925648A2 Polishing composition and polishing process |
| 05/28/2008 | EP1925647A2 Polishing composition and polishing method |
| 05/28/2008 | EP1925400A1 Carrier ring for carrier head |
| 05/28/2008 | EP1925399A2 Flexible membrane for carrier head |
| 05/28/2008 | EP1925398A1 Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly |
| 05/28/2008 | EP1796874B1 Polishing tool comprising a drive plate and a removable pad for finishing an ophthalmic lens |
| 05/28/2008 | EP1683195B1 Semiconductor surface protecting method |
| 05/28/2008 | EP1211023B1 Polishing body, polisher, polishing method, and method for producing semiconductor device |
| 05/28/2008 | EP1159107B1 Method and apparatus for controlling abrasive flow machining |
| 05/28/2008 | CN101189706A 半导体用研磨剂 Semiconductor abrasive |
| 05/28/2008 | CN101186784A 抛光组合物 The polishing composition |
| 05/28/2008 | CN101186711A Polishing composition and polishing method |
| 05/28/2008 | CN101186020A Polishing apparatus, polishing brush and manufacturing method of disk-shaped substrate |
| 05/28/2008 | CN100390942C Carrier head for chemical-mechanical polishing apparatus |
| 05/28/2008 | CN100390245C 抛光组合物 The polishing composition |
| 05/27/2008 | US7378454 Solid beads dispersed in aqueous solution; water swellable; wear resistance |
| 05/27/2008 | US7378004 Pad designs and structures for a versatile materials processing apparatus |
| 05/27/2008 | US7377170 System and method for the identification of chemical mechanical planarization defects |
| 05/27/2008 | US7377018 Method of replacing a subpad of a polishing apparatus |
| 05/22/2008 | US20080119122 Flexible Membrane for Carrier Head |
| 05/21/2008 | EP1129821B1 Method and device for polishing semiconductor wafer |
| 05/21/2008 | CN101184582A Multi-layer polishing pad material for cmp |
| 05/21/2008 | CN100389161C 抛光组合物 The polishing composition |
| 05/20/2008 | US7375830 Method and instrument for measuring semiconductor wafers |
| 05/20/2008 | US7375023 Method and apparatus for chemical mechanical polishing of semiconductor substrates |
| 05/20/2008 | US7374644 Conductive polishing article for electrochemical mechanical polishing |
| 05/20/2008 | US7374477 Polishing pads useful for endpoint detection in chemical mechanical polishing |