Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
08/2008
08/07/2008DE202008003361U1 Spitzenlose Durchführ-Super-Poliervorrichtung mit einem Läppsystem, das ein frei angeordnetes Schleifmittel enthält Centerless through-super-polishing apparatus with a lapping system containing a freely arranged abrasive
08/07/2008DE102008007607A1 Läppmaschine Lapping Machine
08/07/2008DE102008005331A1 Polierkissen mit Rillen zur Verminderung des Aufschlämmungsverbrauchs Polishing pad with grooves to reduce the Aufschlämmungsverbrauchs
08/06/2008EP1952945A2 Polishing apparatus
08/06/2008EP1809439B1 Electronic die positioning device and method
08/06/2008EP1505639B1 Polishing fluid and polishing method
08/06/2008CN101238552A Chemical mechanical polishing apparatus
08/06/2008CN101237960A 精密加工设备和精密加工方法 Precision machining equipment and precision machining method
08/06/2008CN101235253A 抛光组合物和抛光方法 Polishing composition and polishing method
08/06/2008CN101234482A Polishing pad with grooves to reduce slurry consumption
08/06/2008CN101234481A Polishing pad with grooves to retain slurry on the pad texture
08/06/2008CN100409412C Abrasive compound for semiconductor planarization and manufacturing method thereof
08/06/2008CN100408270C Polishing machine
08/06/2008CN100408267C Methods for planarization of group viii metal-containing surfaces using a fixed abrasive article
08/05/2008CA2407800C Polishing composition
07/2008
07/31/2008US20080182484 Lapping apparatus and lapping method
07/31/2008US20080180695 Unevenness elimination end-point detecting apparatus and unevenness elimination end-point detecting method for CMP apparatus
07/30/2008EP1950263A2 Polishing composition and polishing method
07/30/2008CN101233607A Measuring alignment between a wafer chuck and polishing/plating receptacle
07/30/2008CN101232970A Chemically modified polishing pad for chemical mechanical polishing
07/30/2008CN101232969A Abrasive agglomerate polishing method
07/30/2008CN101232968A Self-contained conditioning abrasive article
07/30/2008CN101230238A Metal-polishing liquid and polishing method therewith
07/30/2008CN100406199C Apparatus and methods for aligning surface of active retainer ring with wafer surface for chemical mechanical polishing
07/29/2008US7404757 Apparatus and method for breaking in multiple pad conditioning disks for use in a chemical mechanical polishing system
07/24/2008WO2008088848A1 Enhanced diamond polishing
07/24/2008WO2008087797A1 Polishing pad and method for producing the same
07/24/2008US20080176982 slurries comprising cerium oxide particles, a water soluble polymer selected from acrylic polymers, polyvinyl acetate, polyvinyl imidazole and polyvinyl pyrrolidone, and an acetylenic organic compound such as ethoxylated tetramethyl-5-decyne-4,7-diol; polishes for dielectrics; semiconductors
07/24/2008US20080176490 Capillary, capillary polishing method, and capillary polishing apparatus
07/24/2008US20080176486 Polishing apparatus including separate retainer rings
07/24/2008US20080173843 Ammonium vanadate, sodium vanadate, potassium vanadate, hydrogen peroxide, ozone; colloidal silica abrasive and a pH adjusting agent; polish a hexagonal silicon carbide single crystal wafer
07/23/2008EP1946886A1 Capillary, capillary polishing method, and capillary polishing apparatus
07/23/2008EP1945829A1 Method for depositing reflective multilayer film of reflective mask blank for euv lithography and method for producing reflective mask blank for euv lithography
07/23/2008EP1649075B1 Cvd diamond-coated composite substrate and method for making same
07/23/2008EP1512168A4 Subpad having robust, sealed edges
07/23/2008EP1412130A4 Polishing apparatus and polishing method
07/23/2008EP1399291B1 Apparatus and method for measuring tool degradation
07/23/2008CN201089114Y Abrasive pad
07/23/2008CN201089113Y Cushioning structure for grinding pad controller
07/23/2008CN101228216A Polishing pad containing interpenetrating liquified vinyl monomer network with polyurethane matrix therein
07/23/2008CN101224552A Grinding method of a disk-shaped substrate and grinding apparatus
07/23/2008CN100404634C 抛光液组合物 A polishing solution composition
07/22/2008US7402521 Method for chemically mechanically polishing organic film, method of manufacturing semiconductor device, and program therefor
07/22/2008US7402261 Acidic aqueous solution, amphoteric surfactant/corrosion inhibitor of lysine, proline or arginine; glycol selected from diethylene glycol, ethylene glycol, and polyoxyethylene glycol; hydrogen peroxide, benzoyl peroxide, barium peroxide, calcium peroxide or sodium peroxide; applied to tungsten layer
07/22/2008US7402259 Chemical-mechanical polishing methods
07/22/2008US7402094 Fixed-abrasive chemical-mechanical planarization of titanium nitride
07/17/2008WO2008086295A1 Planarized metalization high-density power mosfet
07/17/2008WO2008084481A2 Tribological surface and lapping method and system therefor
07/17/2008US20080171500 Retainer ring for polishing head
07/17/2008DE102007052100A1 Haltering für Polierkopf Retaining ring for polishing head
07/16/2008EP1944347A1 Abrasive material and process for producing the same
07/16/2008EP1944123A2 Substrate holding apparatus
07/16/2008EP1646478B9 Method for epiready surface treatment on sic thin films
07/16/2008EP1625613A4 Substrate holding apparatus and polishing apparatus
07/16/2008EP1497076A4 Method and apparatus for heating polishing pad
07/16/2008CN201086231Y LCD glass grinder
07/16/2008CN201086230Y Grinding tool for hole with structure small inside outside and large inside
07/16/2008CN101223016A Manufacturing method of laminated sheet and laminated sheet
07/16/2008CN101223006A Double side polishing method for wafer
07/16/2008CN101220256A Polishing composition and polishing process
07/16/2008CN101219531A Microporous polishing pads
07/16/2008CN101219527A Methods and tool for maintenance of hard surfaces, and a method for manufacturing such a tool
07/16/2008CN101219526A Methods and tool for maintenance of hard surfaces, and a method for manufacturing such a tool
07/16/2008CN100403497C Methods for planarization of group VIII metal-containing surfaces using complexing agents
07/16/2008CN100402624C Slurry for chemical-mechanical polishing and forming method, semiconductor device making method
07/16/2008CN100402236C Method of manufacturing a semicondustor component and chemical-mechanical polishing system therefor
07/15/2008US7400934 Methods and apparatus for polishing control
07/15/2008US7399516 Long-life workpiece surface influencing device structure and manufacturing method
07/10/2008WO2008081943A1 Polishing liquid composition
07/10/2008WO2008064158A3 Lapping carrier and method
07/10/2008US20080166957 Substrate holding apparatus and polishing apparatus
07/10/2008US20080166952 Carrier For Double-Side Polishing Apparatus, Double-Side Polishing Apparatus And Double-Side Polishing Method Using The Same
07/10/2008US20080166949 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
07/10/2008DE112006002327T5 Poliermittel Polish
07/10/2008DE112006002323T5 Poliermittel Polish
07/10/2008DE10392703B4 Metal oxide powder useful for high-precision polishing of a semiconductor device, substrate for organoluminescence, mechanical and optical elements, comprising aggregates formed by cohesion of primary particles
07/09/2008EP1940587A2 Apertured conditioning brush for chemical mechanical planarization systems
07/09/2008EP1404487A4 Substrate polishing machine
07/09/2008CN101215447A Composition for polishing
07/09/2008CN101214629A Method for revising wafer transferring device of milling equipment
07/09/2008CN100401459C Chemical-mechanical polishing slurry and method
07/09/2008CN100400236C Grinding apparatus, and wafer manufacturing method
07/09/2008CN100400235C Lapping machine and method of grinding workpiece
07/08/2008CA2305106C Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles
07/03/2008WO2008079704A2 Methods for machining inorganic, non-metallic workpieces
07/03/2008WO2008079516A2 Clean chemistry composition, method of manufacturing same, and system making use of same
07/03/2008WO2008078666A1 Water-based polishing slurry for polishing silicon carbide single crystal substrate, and polishing method for the same
07/03/2008WO2008078349A1 Process and apparatus for treating exhausted abrasive slurries from the lapping process for the recovery of their reusable abrasive component
07/03/2008US20080160885 Retaining ring for a chemical mechanical polishing tool
07/03/2008US20080160878 Failure Alarm Device and Failure Alarm Method
07/03/2008US20080156773 End point detection method applying resonance phenomenon, end point detection apparatus, chemical mechanical polishing apparatus on which the detection apparatus is loaded, and semiconductor device fabricated by the chemical mechanical polishing apparatus
07/03/2008US20080155903 Composite Polishing Pad
07/03/2008DE10241155B4 Vorrichtung zum Beenden des Dünnens eines Werkstücks und Verfahren zum Beenden eines Bearbeitungsvorgangs Apparatus for terminating the thinning of a workpiece and method for terminating a machining operation
07/03/2008DE102006062017A1 Holding ring for chemical-mechanical polishing device, has polishing cushion side surface, and normal surface of border area and normal surface of polishing cushion side surface that has spikes angle
07/02/2008CN201079923Y Device for cleaning space between grinding table of chemo-mechanical grinding device
07/02/2008CN101209541A Fault alarming device and fault alarm method
07/02/2008CN101209537A 'Suede' steel ball processing technique for silent ball bearing
07/02/2008CN100399525C Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
07/02/2008CN100399500C Eddy current system for in-situ profile measurement
07/02/2008CN100398598C Composition for grinding pad and grinding pad using the same
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