Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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08/07/2008 | DE202008003361U1 Spitzenlose Durchführ-Super-Poliervorrichtung mit einem Läppsystem, das ein frei angeordnetes Schleifmittel enthält Centerless through-super-polishing apparatus with a lapping system containing a freely arranged abrasive |
08/07/2008 | DE102008007607A1 Läppmaschine Lapping Machine |
08/07/2008 | DE102008005331A1 Polierkissen mit Rillen zur Verminderung des Aufschlämmungsverbrauchs Polishing pad with grooves to reduce the Aufschlämmungsverbrauchs |
08/06/2008 | EP1952945A2 Polishing apparatus |
08/06/2008 | EP1809439B1 Electronic die positioning device and method |
08/06/2008 | EP1505639B1 Polishing fluid and polishing method |
08/06/2008 | CN101238552A Chemical mechanical polishing apparatus |
08/06/2008 | CN101237960A 精密加工设备和精密加工方法 Precision machining equipment and precision machining method |
08/06/2008 | CN101235253A 抛光组合物和抛光方法 Polishing composition and polishing method |
08/06/2008 | CN101234482A Polishing pad with grooves to reduce slurry consumption |
08/06/2008 | CN101234481A Polishing pad with grooves to retain slurry on the pad texture |
08/06/2008 | CN100409412C Abrasive compound for semiconductor planarization and manufacturing method thereof |
08/06/2008 | CN100408270C Polishing machine |
08/06/2008 | CN100408267C Methods for planarization of group viii metal-containing surfaces using a fixed abrasive article |
08/05/2008 | CA2407800C Polishing composition |
07/31/2008 | US20080182484 Lapping apparatus and lapping method |
07/31/2008 | US20080180695 Unevenness elimination end-point detecting apparatus and unevenness elimination end-point detecting method for CMP apparatus |
07/30/2008 | EP1950263A2 Polishing composition and polishing method |
07/30/2008 | CN101233607A Measuring alignment between a wafer chuck and polishing/plating receptacle |
07/30/2008 | CN101232970A Chemically modified polishing pad for chemical mechanical polishing |
07/30/2008 | CN101232969A Abrasive agglomerate polishing method |
07/30/2008 | CN101232968A Self-contained conditioning abrasive article |
07/30/2008 | CN101230238A Metal-polishing liquid and polishing method therewith |
07/30/2008 | CN100406199C Apparatus and methods for aligning surface of active retainer ring with wafer surface for chemical mechanical polishing |
07/29/2008 | US7404757 Apparatus and method for breaking in multiple pad conditioning disks for use in a chemical mechanical polishing system |
07/24/2008 | WO2008088848A1 Enhanced diamond polishing |
07/24/2008 | WO2008087797A1 Polishing pad and method for producing the same |
07/24/2008 | US20080176982 slurries comprising cerium oxide particles, a water soluble polymer selected from acrylic polymers, polyvinyl acetate, polyvinyl imidazole and polyvinyl pyrrolidone, and an acetylenic organic compound such as ethoxylated tetramethyl-5-decyne-4,7-diol; polishes for dielectrics; semiconductors |
07/24/2008 | US20080176490 Capillary, capillary polishing method, and capillary polishing apparatus |
07/24/2008 | US20080176486 Polishing apparatus including separate retainer rings |
07/24/2008 | US20080173843 Ammonium vanadate, sodium vanadate, potassium vanadate, hydrogen peroxide, ozone; colloidal silica abrasive and a pH adjusting agent; polish a hexagonal silicon carbide single crystal wafer |
07/23/2008 | EP1946886A1 Capillary, capillary polishing method, and capillary polishing apparatus |
07/23/2008 | EP1945829A1 Method for depositing reflective multilayer film of reflective mask blank for euv lithography and method for producing reflective mask blank for euv lithography |
07/23/2008 | EP1649075B1 Cvd diamond-coated composite substrate and method for making same |
07/23/2008 | EP1512168A4 Subpad having robust, sealed edges |
07/23/2008 | EP1412130A4 Polishing apparatus and polishing method |
07/23/2008 | EP1399291B1 Apparatus and method for measuring tool degradation |
07/23/2008 | CN201089114Y Abrasive pad |
07/23/2008 | CN201089113Y Cushioning structure for grinding pad controller |
07/23/2008 | CN101228216A Polishing pad containing interpenetrating liquified vinyl monomer network with polyurethane matrix therein |
07/23/2008 | CN101224552A Grinding method of a disk-shaped substrate and grinding apparatus |
07/23/2008 | CN100404634C 抛光液组合物 A polishing solution composition |
07/22/2008 | US7402521 Method for chemically mechanically polishing organic film, method of manufacturing semiconductor device, and program therefor |
07/22/2008 | US7402261 Acidic aqueous solution, amphoteric surfactant/corrosion inhibitor of lysine, proline or arginine; glycol selected from diethylene glycol, ethylene glycol, and polyoxyethylene glycol; hydrogen peroxide, benzoyl peroxide, barium peroxide, calcium peroxide or sodium peroxide; applied to tungsten layer |
07/22/2008 | US7402259 Chemical-mechanical polishing methods |
07/22/2008 | US7402094 Fixed-abrasive chemical-mechanical planarization of titanium nitride |
07/17/2008 | WO2008086295A1 Planarized metalization high-density power mosfet |
07/17/2008 | WO2008084481A2 Tribological surface and lapping method and system therefor |
07/17/2008 | US20080171500 Retainer ring for polishing head |
07/17/2008 | DE102007052100A1 Haltering für Polierkopf Retaining ring for polishing head |
07/16/2008 | EP1944347A1 Abrasive material and process for producing the same |
07/16/2008 | EP1944123A2 Substrate holding apparatus |
07/16/2008 | EP1646478B9 Method for epiready surface treatment on sic thin films |
07/16/2008 | EP1625613A4 Substrate holding apparatus and polishing apparatus |
07/16/2008 | EP1497076A4 Method and apparatus for heating polishing pad |
07/16/2008 | CN201086231Y LCD glass grinder |
07/16/2008 | CN201086230Y Grinding tool for hole with structure small inside outside and large inside |
07/16/2008 | CN101223016A Manufacturing method of laminated sheet and laminated sheet |
07/16/2008 | CN101223006A Double side polishing method for wafer |
07/16/2008 | CN101220256A Polishing composition and polishing process |
07/16/2008 | CN101219531A Microporous polishing pads |
07/16/2008 | CN101219527A Methods and tool for maintenance of hard surfaces, and a method for manufacturing such a tool |
07/16/2008 | CN101219526A Methods and tool for maintenance of hard surfaces, and a method for manufacturing such a tool |
07/16/2008 | CN100403497C Methods for planarization of group VIII metal-containing surfaces using complexing agents |
07/16/2008 | CN100402624C Slurry for chemical-mechanical polishing and forming method, semiconductor device making method |
07/16/2008 | CN100402236C Method of manufacturing a semicondustor component and chemical-mechanical polishing system therefor |
07/15/2008 | US7400934 Methods and apparatus for polishing control |
07/15/2008 | US7399516 Long-life workpiece surface influencing device structure and manufacturing method |
07/10/2008 | WO2008081943A1 Polishing liquid composition |
07/10/2008 | WO2008064158A3 Lapping carrier and method |
07/10/2008 | US20080166957 Substrate holding apparatus and polishing apparatus |
07/10/2008 | US20080166952 Carrier For Double-Side Polishing Apparatus, Double-Side Polishing Apparatus And Double-Side Polishing Method Using The Same |
07/10/2008 | US20080166949 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device |
07/10/2008 | DE112006002327T5 Poliermittel Polish |
07/10/2008 | DE112006002323T5 Poliermittel Polish |
07/10/2008 | DE10392703B4 Metal oxide powder useful for high-precision polishing of a semiconductor device, substrate for organoluminescence, mechanical and optical elements, comprising aggregates formed by cohesion of primary particles |
07/09/2008 | EP1940587A2 Apertured conditioning brush for chemical mechanical planarization systems |
07/09/2008 | EP1404487A4 Substrate polishing machine |
07/09/2008 | CN101215447A Composition for polishing |
07/09/2008 | CN101214629A Method for revising wafer transferring device of milling equipment |
07/09/2008 | CN100401459C Chemical-mechanical polishing slurry and method |
07/09/2008 | CN100400236C Grinding apparatus, and wafer manufacturing method |
07/09/2008 | CN100400235C Lapping machine and method of grinding workpiece |
07/08/2008 | CA2305106C Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles |
07/03/2008 | WO2008079704A2 Methods for machining inorganic, non-metallic workpieces |
07/03/2008 | WO2008079516A2 Clean chemistry composition, method of manufacturing same, and system making use of same |
07/03/2008 | WO2008078666A1 Water-based polishing slurry for polishing silicon carbide single crystal substrate, and polishing method for the same |
07/03/2008 | WO2008078349A1 Process and apparatus for treating exhausted abrasive slurries from the lapping process for the recovery of their reusable abrasive component |
07/03/2008 | US20080160885 Retaining ring for a chemical mechanical polishing tool |
07/03/2008 | US20080160878 Failure Alarm Device and Failure Alarm Method |
07/03/2008 | US20080156773 End point detection method applying resonance phenomenon, end point detection apparatus, chemical mechanical polishing apparatus on which the detection apparatus is loaded, and semiconductor device fabricated by the chemical mechanical polishing apparatus |
07/03/2008 | US20080155903 Composite Polishing Pad |
07/03/2008 | DE10241155B4 Vorrichtung zum Beenden des Dünnens eines Werkstücks und Verfahren zum Beenden eines Bearbeitungsvorgangs Apparatus for terminating the thinning of a workpiece and method for terminating a machining operation |
07/03/2008 | DE102006062017A1 Holding ring for chemical-mechanical polishing device, has polishing cushion side surface, and normal surface of border area and normal surface of polishing cushion side surface that has spikes angle |
07/02/2008 | CN201079923Y Device for cleaning space between grinding table of chemo-mechanical grinding device |
07/02/2008 | CN101209541A Fault alarming device and fault alarm method |
07/02/2008 | CN101209537A 'Suede' steel ball processing technique for silent ball bearing |
07/02/2008 | CN100399525C Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing |
07/02/2008 | CN100399500C Eddy current system for in-situ profile measurement |
07/02/2008 | CN100398598C Composition for grinding pad and grinding pad using the same |