Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
09/2008
09/17/2008CN100418702C Ultrafine fiber polishing sheet and its manufacturing method
09/16/2008US7425250 Electrochemical mechanical processing apparatus
09/16/2008US7425172 Customized polish pads for chemical mechanical planarization
09/12/2008WO2008109576A2 Systems and methods for efficient slurry application for chemical mechanical polishing
09/12/2008WO2008108463A1 Polishing tool and polishing device
09/11/2008US20080220698 Systems and methods for efficient slurry application for chemical mechanical polishing
09/11/2008US20080220694 Centerless feed-through super-finishing device having a lapping system containing a freely-disposed abrasive
09/11/2008US20080220585 Method of manufacturing a semiconductor device
09/11/2008US20080219130 Methods and Apparatus for Formatting and Tracking Information for Three-Dimensional Storage Medium
09/11/2008DE102006056339A1 Vorrichtung zum Trennen von zwei aufeinander angeordneten scheibenförmigen Elementen bei der Entnahme Device for separating two successive disc-shaped elements arranged in the extraction
09/10/2008CN101263583A Polishing compound, method for polishing surface to be polished, and process for producing semiconductor integrated circuit device
09/10/2008CN101262982A Polishing platen and polishing apparatus
09/10/2008CN101262981A Polishing method and polishing apparatus, and program for controlling polishing apparatus
09/10/2008CN100417493C Polishing pad with window for planarization
09/09/2008US7422677 Membrane-mediated electropolishing
09/09/2008US7422516 Conductive polishing article for electrochemical mechanical polishing
09/09/2008US7422511 Element for detecting the amount of lapping having a resistive film electrically connected to the substrate
09/04/2008WO2008105342A1 Metal polishing liquid and polishing method
09/04/2008WO2008105223A1 Cmp slurry for silicon film
09/04/2008WO2008105137A1 Polishing apparatus
09/04/2008WO2008064268A3 Friction sensor for polishing system
09/04/2008US20080214093 cerium oxide particles, a dispersing agent (lauryl betaine), a water-soluble polymer containing N-mono-substituted product and an N,N-di-substituted product of any one selected from acrylamide, methacrylamide and alpha -substituted product; polishing a silicon dioxide film
09/04/2008US20080214005 Chemical solution feeding apparatus and method for preparing slurry
09/04/2008US20080210665 Polishing composition and polishing method
09/03/2008EP1965417A1 Polishing composition, polishing method, and method for forming copper wiring for semiconductor integrated circuit
09/03/2008EP1963048A1 Method for manufacturing microporous cmp materials having controlled pore size
09/03/2008EP1626840A4 Apparatus and method for polishing semiconductor wafers using one or more polishing surfaces
09/03/2008CN101258106A Cerium oxide powder for one-component CMP slurry, preparation method thereof, one-component CMP slurry composition comprising the same, and method of shallow trench isolation using the slurry
09/03/2008CN101255316A Polishing liquid
09/03/2008CN101254586A Polishing apparatus
09/03/2008CN100416868C Nitride semiconductor wafer and method of processing nitride semiconductor wafer
09/03/2008CN100416770C Method of flatting semiconductor die
09/03/2008CN100416753C Method of manufacturing semiconductor device
09/03/2008CN100415447C Polishing apparatus and method
09/02/2008US7419946 Chemical solution feeding apparatus and method for preparing slurry
09/02/2008US7419910 Slurry for CMP, polishing method and method of manufacturing semiconductor device
09/02/2008US7419420 Substrate holding mechanism, substrate polishing apparatus and substrate polishing method
08/2008
08/28/2008WO2008102672A1 Polishing slurry, method for manufacturing the polishing slurry, nitride crystalline material and method for polishing surface of the nitride crystalline material
08/28/2008WO2008102521A1 Final polishing process for silicon single crystal wafer and silicon single crystal wafer
08/28/2008US20080207089 Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool
08/28/2008US20080206995 Metal-polishing liquid and polishing method therewith
08/28/2008US20080203354 Polishing liquid
08/28/2008US20080202036 Covering with photo-reactive film coating; exposure to light through mask; removal using developers; etching; polishing
08/27/2008EP1961519A1 Grinding tools
08/27/2008CN201105409Y Chemical mechanical grinder bench discharging pipe
08/27/2008CN101253606A Polishing composition
08/27/2008CN101253022A Polishing pad
08/27/2008CN101249623A Grinding method and grinding device of circular disk shape substrate
08/26/2008US7416962 Method for processing a semiconductor wafer including back side grinding
08/26/2008US7416942 Method for manufacturing semiconductor device
08/21/2008WO2008100400A1 Cmp system utilizing halogen adduct
08/21/2008US20080200033 Chemical mechanical planarization of silicon carbide at high removal rate without affecting silicon dioxide dielectric layer; abrasive particles combined with benzotriazole, 1H-tetrazole, benzene sulfonic acid, phosphoric acid or organic phosphonic acid in solvent and water
08/21/2008US20080200032 Polishing method of semiconductor substrate
08/21/2008US20080197456 Substrate polishing method, semiconductor device and fabrication method therefor
08/21/2008US20080196833 Retaining ring with shaped surface
08/20/2008EP1957600A1 Adjuvant for controlling polishing selectivity and chemical mechanical polishing slurry comprising the same
08/20/2008EP1957599A1 Adjuvant for controlling polishing selectivity and chemical mechanical polishing slurry comprising the same
08/20/2008EP1593148A4 Substrate holding apparatus and polishing apparatus
08/20/2008EP1218464B1 Chemical mechanical polishing systems and methods for their use
08/20/2008CN101244536A Substrate polishing method, semiconductor device and fabrication method therefor
08/20/2008CN101244535A Polishing article
08/20/2008CN101244524A Surface finish method for magnesium alloy parts
08/20/2008CN100413037C Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate
08/20/2008CN100413033C Polishing cloth and method of manufacturing semiconductor device
08/20/2008CN100413032C Conductive polishing article for electrochemical mechanical polishing
08/20/2008CN100412152C CMP systems and methods utilizing amine-containing polymers
08/19/2008US7414080 Density, porosity uniformity; made with controlled isocyanate concentration; precision planarization of semiconductor, optical and magnetic substrates
08/19/2008US7413989 Method of manufacturing semiconductor device
08/19/2008US7413986 Feedforward and feedback control for conditioning of chemical mechanical polishing pad
08/19/2008US7413832 Method of producing a glass substrate for a mask blank, method of producing a mask blank, and method of producing a transfer mask
08/19/2008US7413498 Lapping apparatus and lapping method
08/19/2008US7413497 Chemical mechanical polishing slurry pump monitoring system and method
08/14/2008WO2008079516A3 Clean chemistry composition, method of manufacturing same, and system making use of same
08/14/2008US20080194183 Planarization polishing method and method for manufacturing semiconductor device
08/14/2008US20080194182 Mechano-chemical polishing method for GaAs wafer
08/14/2008DE102008004874A1 Polierkissen mit Rillen zum Halten einer Aufschlämmung auf der Kissentextur Polishing pad with grooves for holding a slurry on the pad texture
08/14/2008DE102008004441A1 Mechano-chemisches Polierverfahren für GaAs-Wafer Mechano-chemical polishing process for GaAs wafers
08/13/2008EP1956642A1 Polishing agent for silicon oxide, liquid additive, and method of polishing
08/13/2008EP1954776A2 Abrasive aqueous suspension based on cerium and silica dioxide particles for polishing surfaces of materials
08/13/2008CN101242931A Apparatus and methods for spectrum based monitoring of chemical mechanical polishing
08/13/2008CN101241843A Substrate polishing apparatus
08/13/2008CN101240159A Polishing liquid composition
08/13/2008CN101240146A Metal-polishing composition and chemical mechanical polishing method by using the same
08/13/2008CN101239453A Planarization grinding method and method for manufacturing semiconductor device
08/13/2008CN101239450A Chemical mechanical polishing method for GaAs wafer
08/13/2008CN100411109C Method for polishing material layer on a semiconductor wafer
08/13/2008CN100410017C Chemical mechanical polishing pad, production method thereof, and chemical mechanical polishing process
08/13/2008CN100410016C Polishing pad, method for manufacturing the same, polishing system and method
08/13/2008CN100410011C A grinding jig set and a method for grinding a number of objects
08/12/2008US7410411 Method of determining the number of active diamonds on a conditioning disk
08/12/2008US7410409 Abrasive compound for CMP, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive compound
08/12/2008CA2280865C Aerosol method and apparatus, particulate products, and electronic devices made therefrom
08/07/2008WO2008093850A1 Polishing pad and process for production of polishing pad
08/07/2008WO2008093450A1 Additive for abrasive composition
08/07/2008WO2008042903A3 Systems for sensing pressure/shear force
08/07/2008US20080188166 Lapping machine
08/07/2008US20080188165 Method for manufacturing disk-substrates for magnetic recording media, disk-substrates for magnetic recording media, method for manufacturing magnetic recording media, magnetic recording media, and magnetic recording device
08/07/2008US20080188163 Method of polishing a substrate
08/07/2008US20080188162 Electrochemical mechanical polishing apparatus conditioning method, and conditioning solution
08/07/2008US20080188079 Metal-polishing composition and chemical mechanical polishing method by using the same
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