| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 10/23/2008 | WO2008126497A1 Process for producing polyurethane foam |
| 10/23/2008 | US20080261497 Retainer Ring For Cmp Device |
| 10/23/2008 | DE20221892U1 Kettenrad eines Kettenantriebs für ein Fahrrad A chain drive sprocket for a bicycle |
| 10/23/2008 | DE112006003221T5 Glassubstrat für eine Maskenvorform und Polierverfahren zur Herstellung desselben Of the same glass substrate for mask blank, and polishing method for producing |
| 10/22/2008 | EP1983558A1 Abrasive pad and abrasion device |
| 10/22/2008 | CN201136124Y Locating ring for grinding semiconductor chip |
| 10/22/2008 | CN101291778A Cerium oxide slurry, cerium oxide polishing slurry and method for polishing substrate using the same |
| 10/22/2008 | CN100427270C Maintenance method of dedicated digit controlled machine tool plastic jacket |
| 10/21/2008 | US7438795 Electrochemical-mechanical polishing system |
| 10/21/2008 | US7438632 Method and apparatus for cleaning a web-based chemical mechanical planarization system |
| 10/21/2008 | US7438627 Polishing state monitoring method |
| 10/16/2008 | WO2008123373A1 Colloidal silica, and method for production thereof |
| 10/16/2008 | WO2008123085A1 Cushion for polishing pad and polishing pad using the cushion |
| 10/16/2008 | WO2008023288A8 An apparatus for and method of polishing a semiconductor wafer using chemical mechanical planarization |
| 10/16/2008 | US20080254720 Polishing Head, Polishing Apparatus and Polishing Method for Semiconductor Wafer |
| 10/16/2008 | US20080254717 Cmp Polishing Slurry and Method of Polishing Substrate |
| 10/16/2008 | US20080254714 Polishing method and polishing apparatus |
| 10/16/2008 | US20080254713 Pad assemblies for electrochemically assisted planarization |
| 10/16/2008 | US20080253025 Method and apparatus for providing an additional ground pad and electric al connection for grounding a magnetic recording head |
| 10/15/2008 | EP1981070A1 Chemical mechanical polishing pad |
| 10/15/2008 | EP1568074B1 Carrier head for chemical mechanical polishing apparatus |
| 10/15/2008 | CN100426470C Multipurpose slurry delivery arm for chemical mechanical polishing |
| 10/15/2008 | CN100425666C Boron-containing polishing system and method |
| 10/15/2008 | CN100425404C Process control in electro-chemical mechanical polishing |
| 10/14/2008 | US7435165 Transparent microporous materials for CMP |
| 10/14/2008 | US7435163 Grinding sheet and grinding method |
| 10/14/2008 | US7435161 Multi-layer polishing pad material for CMP |
| 10/09/2008 | WO2008120578A1 Metal film polishing pad and method for polishing metal film using the same |
| 10/09/2008 | US20080248728 Method for manufacturing polishing pad, polishing pad, and method for polishing wafer |
| 10/09/2008 | US20080248727 Polishing Slurry |
| 10/09/2008 | US20080248723 Polishing condition control apparatus and polishing condition control method of CMP apparatus |
| 10/08/2008 | CN201128105Y Ring structure for grinding semiconductor chip |
| 10/08/2008 | CN101283441A Polishing slurry for CMP and polishing method |
| 10/08/2008 | CN101283070A Cerium polishing material |
| 10/08/2008 | CN101282818A Microporous polishing pads |
| 10/08/2008 | CN100424830C Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor wafer |
| 10/02/2008 | WO2008117593A1 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method for semiconductor device |
| 10/02/2008 | WO2008117592A1 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method for semiconductor device |
| 10/02/2008 | WO2008117573A1 Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion, chemical mechanical polishing method, and method for manufacturing semiconductor device |
| 10/02/2008 | US20080242755 Density, porosity uniformity; made with controlled isocyanate concentration; precision planarization of semiconductor, optical and magnetic substrates |
| 10/02/2008 | US20080242203 Apparatus and method for lapping slider using floating lapping head |
| 10/02/2008 | US20080242197 Wafer polish monitoring method and device |
| 10/02/2008 | US20080242196 Method and system for controlling chemical mechanical polishing by taking zone specific substrate data into account |
| 10/02/2008 | US20080242091 Mixture of tetrazole compound and abrasive grains with oxidizer |
| 10/02/2008 | US20080242090 Metal-polishing liquid and polishing method |
| 10/02/2008 | US20080242081 Polishing method, polishing apparatus, and method for manufacturing semiconductor device |
| 10/02/2008 | US20080237535 Fumed silica particles produced by wet grinding having a specific surface area of 50 to 200 m2/g, an average particle diameter of 10 to 50 nm, and an average ratio A/B of the major axis A to the minor axis B of the fumed silica particles of 1.2 to 2.0 |
| 10/02/2008 | DE102007015503A1 Verfahren und System zum Steuern des chemisch-mechanischen Polierens durch Berücksichtigung zonenspezifischer Substratdaten A method and system for controlling the chemical mechanical polishing zone by taking into account specific data substrate |
| 10/01/2008 | EP1975985A1 Chemical mechanical polishing pad and method for manufacturing same |
| 10/01/2008 | EP1973697A2 Incorporation of particulate additives into metal working surfaces |
| 10/01/2008 | EP1699596B1 Chemical mechanical polishing method for reducing slurry reflux |
| 10/01/2008 | CN101277787A Polishing apparatus and method with direct load platen |
| 10/01/2008 | CN101277786A Abrasive cloth and process for production thereof |
| 10/01/2008 | CN101275065A Lapping liquid |
| 10/01/2008 | CN101275057A Metal-polishing liquid and polishing method |
| 10/01/2008 | CN101274419A Method for abrasing GaN substrate |
| 10/01/2008 | CN100423203C Substrate holding device and polishing device |
| 09/30/2008 | US7429338 chemical mechanical polishing a semiconductor with an abrasive having a MIXTURE on the surface, CONTAINING STABILIZER, CATALYST, OXIDIZER |
| 09/30/2008 | US7429209 Method of polishing a glass substrate for use as an information recording medium |
| 09/30/2008 | US7429207 System for endpoint detection with polishing pad |
| 09/25/2008 | WO2008116049A2 Methods of removing defects in surfaces |
| 09/25/2008 | WO2008114805A1 Chemical-mechanical polishing pad, and chemical-mechanical polishing method |
| 09/25/2008 | WO2008114563A1 Aqueous dispersion for chemical mechanical polishing and method of chemical mechanical polishing of semiconductor device |
| 09/25/2008 | WO2008114520A1 Chemical mechanical polishing pad and chemical mechanical polishing method |
| 09/25/2008 | WO2007131094A3 Method and apparatus for chemical mechanical polishing of large size wafer with capability of polishing individual die |
| 09/25/2008 | US20080233844 Retainer ring and polishing machine |
| 09/25/2008 | US20080233840 Method For The Simultaneous Grinding Of A Plurality Of Semiconductor Wafers |
| 09/25/2008 | US20080233837 Methods of removing defects in surfaces |
| 09/25/2008 | US20080233836 Polishing composition and polishing method |
| 09/25/2008 | US20080233835 Pin adapter for air bearing surface (abs) lapping and method for using the same |
| 09/25/2008 | US20080233422 Coated nickel-containing powders |
| 09/25/2008 | DE112006003042T5 Klebstoffzusammensetzung und Klebstofffilm The adhesive composition and adhesive film |
| 09/25/2008 | DE102007056628A1 Verfahren zum gleichzeitigen Schleifen mehrerer Halbleiterscheiben A process for simultaneously grinding a plurality of semiconductor wafers |
| 09/25/2008 | DE102007056627A1 Verfahren zum gleichzeitigen Schleifen mehrerer Halbleiterscheiben A process for simultaneously grinding a plurality of semiconductor wafers |
| 09/25/2008 | DE102007013058A1 Method for simultaneous double-side grinding of semiconductor wafers, comprises moving the wafer freely into a recess of a circulating disk, and processing the wafer between two rotating circular working disk components |
| 09/25/2008 | CA2681316A1 Methods of removing defects in surfaces |
| 09/24/2008 | EP1972412A2 Two-sided surface grinding method and apparatus |
| 09/24/2008 | EP1485440B1 Free radical-forming activator attached to solid and used to enhance cmp formulations |
| 09/24/2008 | CN101269476A Method for the simultaneous grinding of a plurality of semiconductor wafers |
| 09/24/2008 | CN100421224C Method for grinding GaN substrate |
| 09/24/2008 | CN100420546C Assembly system for stationing semiconductor wafer suitable for processing and process for manufacturing semiconductor wafer |
| 09/23/2008 | US7428064 Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus |
| 09/23/2008 | US7427361 Chemical mechanical polishing slurry for semiconductors |
| 09/23/2008 | US7427337 System for electropolishing and electrochemical mechanical polishing |
| 09/23/2008 | US7427305 Free radical-forming activator attached to solid and used to enhance CMP formulations |
| 09/18/2008 | US20080227371 Double-side polishing apparatus |
| 09/18/2008 | US20080227370 Substrate for magnetic disk |
| 09/18/2008 | US20080227367 Substrate polishing metrology using interference signals |
| 09/18/2008 | US20080227297 Chemical mechanical polishing method and method for manufacturing semiconductor device |
| 09/18/2008 | US20080227296 Acidic aqueous solution, amphoteric surfactant/corrosion inhibitor; glycol selected from diethylene glycol, ethylene glycol, and polyoxyethylene glycol; hydrogen peroxide, benzoyl peroxide, barium peroxide, calcium peroxide or sodium peroxide; applied to tungsten layer |
| 09/18/2008 | DE102007011880A1 Bearbeitungsmaschine mit Mitteln zur Erfassung von Bearbeitungsparametern Processing machine with means for detecting machining parameters |
| 09/18/2008 | DE102005002167B4 Gerilltes Polierkissen Grooved polishing pad |
| 09/17/2008 | EP1970163A1 Double-side polishing apparatus |
| 09/17/2008 | EP1970161A1 Polishing head testing with movable pedestal |
| 09/17/2008 | EP1970159A1 Processing machine with means for recording processing parameters |
| 09/17/2008 | CN201115930Y Grinding devices |
| 09/17/2008 | CN201115929Y Dressing controllable type ultraprecise polishing machine |
| 09/17/2008 | CN101268111A Polymer material, foam obtained from same, and polishing pad using those |
| 09/17/2008 | CN101264585A Double-side polishing apparatus |
| 09/17/2008 | CN100419963C Forming a semiconductor structure using a combination of planarizing methods and electropolishing |