Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
12/2008
12/10/2008EP2000259A2 Substrate holding apparatus, polishing apparatus, and polishing method
12/10/2008EP1771279B1 Polishing apparatus and substrate processing method
12/10/2008EP1651388B1 Multi-layer polishing pad material for cmp
12/10/2008CN101321841A Cerium polishing agent
12/10/2008CN101320708A Manufacturing method of semiconductor integrated circuit device
12/10/2008CN101320690A Method for the single-sided polishing of bare semiconductor wafers
12/10/2008CN101318309A CMP systems and methods utilizing amine-contained polymer
12/10/2008CN100441654C Abrasive particles and methods of making and using the same
12/04/2008WO2008146641A1 Polishing composition
12/04/2008US20080299880 Substrate holding apparatus and substrate polishing apparatus
12/04/2008US20080299878 Systems and methods for reducing electrostatic charge of semiconductor wafers
12/04/2008US20080299350 Method of Polishing Compound Semiconductor Substrate, Compound Semiconductor Substrate, Method of Manufacturing Compound Semiconductor Epitaxial Substrate, and Compound Semiconductor Epitaxial Substrate
12/04/2008US20080297794 Apparatus for optical inspection of wafers during polishing
12/03/2008EP1997587A2 Method of polishing compound semiconductor substrate, compound semiconductor substrate, method of manufacturing compound semiconductor epitaxial substrate, and compound semiconductor epitaxial substrate
12/03/2008EP1501119B1 Semiconductor wafer manufacturing method and wafer
12/03/2008EP1358044B1 Chemical mechanical machining and surface finishing
12/03/2008CN101316683A Method for manufacturing microporous cmp materials having controlled pore size
12/03/2008CN101314216A Polishing pad, the use thereof and the method for manufacturing the same
12/03/2008CN101314211A Compound semiconductor substrate, method of polishing compound semiconductor substrate, method of manufacturing compound semiconductor epitaxial substrate, and compound semiconductor epitaxial substra
12/03/2008CN100440319C Method of lapping row bar in which perpendicular magnetic heads are formed and lapping machine
12/02/2008US7459398 Slurry for CMP, polishing method and method of manufacturing semiconductor device
12/02/2008US7459397 Polishing method for semiconductor substrate, and polishing jig used therein
12/02/2008US7459057 Substrate retainer
12/02/2008US7459056 Pad conditioning head for CMP process
12/02/2008US7458879 Dressing apparatus and substrate holding apparatus
11/2008
11/27/2008WO2008143278A1 Device wafer polishing pad, polishing body, polishing tool constituting body, and polishing method
11/27/2008WO2008143029A1 Polishing pad manufacturing method
11/27/2008US20080293336 Methods and apparatus to control substrate bevel and edge polishing profiles of films
11/27/2008US20080293332 Polishing pad and method of polishing
11/27/2008US20080293330 Alumina-film-polishing composition and chemical mechanical polishing method using the same
11/27/2008US20080289261 Polishing composition and polishing method
11/26/2008CN101313388A Friction reducing aid for cmp
11/26/2008CN101311205A Cmp研磨剂以及衬底的研磨方法 Cmp abrasive polishing method and substrate
11/26/2008CN101310929A Polishing pad, method for manufacturing same and polishing system and method
11/26/2008CN101310926A Silicon slice grinding surface roughness control method
11/26/2008CN101310925A Silicon slice grinding surface stress reduction method
11/26/2008CN100437925C Material for purification of semiconductor polishing slurry, module for purification of semiconductor polishing slurry and process for producing semiconductor polishing slurry
11/26/2008CN100437924C 化学机械抛光垫 The chemical mechanical polishing pad
11/26/2008CN100436060C Grinding pad and its making process
11/25/2008US7456106 Method for producing a silicon wafer
11/25/2008US7455799 Method of producing polishing pad-use polyurethane foam and polyurethane foam
11/25/2008US7455791 Abrasives for copper CMP and methods for making
11/25/2008US7455785 Method of determining a flatness of an electronic device substrate, method of producing the substrate, method of producing a mask blank, method of producing a transfer mask, polishing method, electronic device substrate, mask blank, transfer mask, and polishing apparatus
11/20/2008WO2007095421A3 Method for electrochemically polishing a conductive material on a substrate
11/20/2008US20080287043 Polishing apparatus
11/20/2008US20080287042 Manufacture of lapping board
11/20/2008US20080287038 Polishing composition for semiconductor wafer, method for production thereof and polishing method
11/20/2008DE112005003745T5 Aufschlämmzusammensetzung für das chemisch-mechanische Polieren zum Polieren von polykristallinem Siliciumfilm und Verfahren zur Herstellung derselben Aufschlämmzusammensetzung for chemical mechanical polishing for polishing polycrystalline silicon film and method for manufacturing the same
11/19/2008CN201151081Y Guiding ring structure
11/19/2008CN101310365A Polishing fluid for polishing aluminum films and method for polishing aluminum films with the same
11/19/2008CN101308790A Method for removing dielectric layer on substrate and chemical mechanical polishing process
11/19/2008CN101306518A Polishing pad, use thereof and method for making the same
11/19/2008CN100435290C Polishing composition and polishing method
11/19/2008CN100435289C Manufacturing method of silicon wafer
11/18/2008US7452814 Method of polishing GaN substrate
11/18/2008CA2355614C Combination cmp-etch method for forming a thin planar layer over the surface of a device
11/13/2008WO2008137053A1 Cmp compositions containing a soluble peroxometalate complex and methods of use thereof
11/13/2008WO2008137033A1 Stacked polishing pad for high temperature applications
11/13/2008WO2008136240A1 Method for manufacturing semiconductor device
11/13/2008US20080280544 Apparatus for lapping sliders using axially deformable member
11/13/2008US20080280538 Polishing composition
11/13/2008DE10007390B4 Zweischeiben-Poliermaschine, insbesondere zur Bearbeitung von Halbleiterwafern Two-disc polishing machine, in particular for the processing of semiconductor wafers
11/12/2008CN101305450A Polishing agent for silicon oxide, liquid additive, and method of polishing
11/12/2008CN100433269C Pneumatic diaphragm head having independent retaining ring and multi-region pressure control, and method to use the same
11/12/2008CN100432178C Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates
11/12/2008CN100432174C Barrier polishing fluid
11/12/2008CN100431789C Air platen for leading edge and trailing edge control
11/11/2008US7448940 Polishing apparatus and polishing method
11/06/2008WO2008133286A1 Polishing apparatus and program for the same
11/06/2008WO2008133023A1 Polishing composition and polishing method
11/06/2008WO2008132983A1 Polishing agent composition and method for manufacturing semiconductor integrated circuit device
11/06/2008WO2008083081A3 Sapphire substrates and methods of making same
11/06/2008US20080274673 Wafer polishing apparatus, wafer polishing system and wafer polishing method
11/06/2008US20080273275 Fabricating a write head with multiple electronic lapping guides
11/06/2008US20080271383 Rapid surface treatment of silicon dioxide insulating films without scratching; aqueous slurry containing cerium oxide particles and acrylic acid polymer dispersant
11/06/2008DE102007021411A1 Polishing machine for producing workpieces with smooth surface area, has table top, operating disk and overlying straightening ring on operating disk
11/05/2008EP1988568A1 Substrate treating device, substrate convey device, substrate grasping device, and chemical solution treating device
11/05/2008EP1332385B1 Method for polishing optical fiber connectors
11/05/2008CN101300321A Polishing material and production method therefor
11/05/2008CN101300320A Chemical mechanical polishing slurry compositions, methods of preparing the same and methods of using the same
11/04/2008US7446889 Method of evaluating film thickness, method of detecting polishing terminal, and device-manufacturing apparatus
11/04/2008US7445543 Polishing apparatus
10/2008
10/30/2008US20080268751 Polishing condition control apparatus and polishing condition control method of CMP apparatus
10/30/2008US20080268643 Methods and apparatus for polishing control
10/30/2008US20080263965 Semiconductor Polishing Composition
10/30/2008DE102008007328A1 Machine for working large surface and thin workpieces holds the workpiece at an angle or vertically during working
10/30/2008DE102007060729A1 Waferpolieraufzeichnungsverfahren und Vorrichtung Wafer polishing recording method and apparatus
10/29/2008CN101297010A 粘接剂组合物以及粘接薄膜 Adhesive composition and adhesive film
10/29/2008CN101296780A Cmp of copper/ruthenium substrates
10/29/2008CN101293334A Flexible film for carrier head
10/29/2008CN101293333A Carrier ring for carrier head
10/29/2008CN101293332A Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly
10/29/2008CN101293320A Thread reeling technique with waste and old reinforcing rod of building
10/29/2008CN100429752C Polishing apparatus and substrate processing apparatus
10/29/2008CN100429043C Chemical and mechanical grinding method for aluminium
10/28/2008US7442116 Chemical mechanical polishing pad
10/28/2008US7442113 Visual wear confirmation polishing pad
10/28/2008US7442111 Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting
10/23/2008WO2008126611A1 Polishing pad
10/23/2008WO2008126578A1 Polishing pad
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