Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
01/2009
01/21/2009CN101350302A GaN基板 GaN substrates
01/21/2009CN101347923A Method and apparatus for improving insufficiency of wafer grinding and thick thickness
01/21/2009CN101347922A Method for cleaning grinding pad
01/21/2009CN101347920A Maintenance method of chemical and mechanical grinder
01/21/2009CN100453486C Method of making amorphous materials and ceramics
01/20/2009US7479206 Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
01/20/2009US7479204 Method of manufacturing semiconductor substrate and method of evaluating quality of semiconductor substrate
01/15/2009WO2009008431A1 Metal film polishing liquid and polishing method
01/15/2009DE112006003810T5 Polierzusammensetzung für Siliciumwafer, Polierzusammensetzungskit für Siliciumwafer und Verfahren zum Siliciumwaferpolieren Polishing composition for silicon wafers, Polierzusammensetzungskit for silicon wafer and method for silicon wafer polishing
01/14/2009EP2014417A1 Abrasive coating and method of manufacturing same
01/14/2009CN101346806A Metal polishing liquid and method for polishing film to be polished
01/14/2009CN101346805A Abrasive grain-free polishing liquid and CMP polishing method
01/14/2009CN101346804A Polishing composition, polishing method, and method for forming copper wiring for semiconductor integrated circuit
01/14/2009CN100452311C Inlaid polishing pad and method of producing the same
01/14/2009CN100450716C Abrasive article for the deposition and polishing of a conductive material
01/14/2009CN100450715C Lapping apparatus and lapping method
01/08/2009WO2009005143A1 Polishing liquid for metal film and polishing method
01/08/2009US20090011690 Polishing apparatus and polishing method
01/08/2009US20090011681 Method of producing a glass substrate for a mask blank, method of producing a mask blank, and method of producing a transfer mask
01/08/2009US20090011680 Polishing state monitoring apparatus and polishing apparatus and method
01/08/2009US20090011221 Cushioning Material for a Polishing Pad
01/08/2009DE102008030067A1 Metal workpiece holder for polishing machine has ring shaped apertures with soft liners to reduce damage risk to workpieces
01/08/2009DE102007031299A1 Workpiece i.e. semiconductor wafer, machining tool i.e. double side machining tool, has wear sensor with sections running out from machining surfaces plane, where electrical resistances of sections exhibit different temperature dependencies
01/07/2009EP2012345A1 Semiconductor production plant
01/07/2009EP2011765A1 Oxide crystal fine particle and polishing slurry including the fine particle
01/07/2009CN101339893A Method for judging wafer thinning, device structure and device and its manufacture method
01/07/2009CN101337336A Method for grinding semiconductor chip
01/07/2009CN100449726C Support system for semiconductor wafers and methods thereof
01/07/2009CN100449705C Electrolytic processing device and substrate processing appts.
01/06/2009US7474507 Storage device having slider with sacrificial extension aligned with channel on opposite surface
01/06/2009US7473161 Lapping machine and head device manufacturing method
01/02/2009DE102007029907A1 Rotor disk for material-erosive processing of tool in e.g. double-sided processing machine, has insert ring engaged into recess and comprises another recess for receiving tool to be processed
01/01/2009US20090004863 Polishing liquid and polishing method using the same
01/01/2009US20090001340 Chemical Mechanical Polishing Slurry Composition for Polishing Phase-Change Memory Device and Method for Polishing Phase-Change Memory Device Using the Same
01/01/2009US20090001339 Chemical Mechanical Polishing Slurry Composition for Polishing Phase-Change Memory Device and Method for Polishing Phase-Change Memory Device Using the Same
12/2008
12/31/2008CN101333421A Chemical mechanical polishing slurry composition and polishing method
12/31/2008CN101333418A Cmp polishing compound and method for polishing substrate
12/31/2008CN101333417A Polishing liquid and polishing method using the same
12/31/2008CN101332584A Grinding method of sheet metal
12/31/2008CN100447959C Metal polishing liquid and polishing method using it
12/31/2008CN100447958C Loading device for chemical mechanical polisher of semiconductor wafer
12/31/2008CN100447218C Cerium-based polishing material
12/31/2008CN100446927C Modeling an abrasive process to achieve controlled material removal
12/31/2008CN100446926C Polishing composition
12/30/2008US7470623 Method of forming a platinum pattern
12/30/2008US7470171 Surface polishing method and apparatus thereof
12/30/2008US7470170 Polishing pad and method for manufacture of semiconductor device using the same
12/30/2008US7470169 Method of polishing semiconductor wafers by using double-sided polisher
12/25/2008US20080318503 Substrate holding mechanism, substrate polishing apparatus and substrate polishing method
12/25/2008US20080318499 Substrate holding apparatus, polishing apparatus, and polishing method
12/25/2008US20080318493 Method of Manufacturing Polishing Carrier and Silicon Substrate for Magnetic Recording Medium, and Silicon Substrate for Magnetic Recording Medium
12/25/2008US20080318492 Substrate holding apparatus, polishing apparatus, and polishing method
12/25/2008US20080318427 Chemical mechanical polishing aqueous dispersion preparation set, method of preparing chemical mechanical polishing aqueous dispersion, chemical mechanical polishing aqueous dispersion, and chemical mechanical polishing method
12/25/2008US20080313967 Polishing pad and production method thereof
12/24/2008WO2008156054A1 Polishing composition and method for manufacturing semiconductor integrated circuit device
12/24/2008WO2008156002A1 Polishing sheet and method for manufacturing the same
12/24/2008WO2008155987A1 Polishing composition, method for polishing the surface of semiconductor integrated circuit, and method for production of copper interconnect for semiconductor integrated circuit
12/24/2008WO2008109576A3 Systems and methods for efficient slurry application for chemical mechanical polishing
12/24/2008WO2008079704A3 Methods for machining inorganic, non-metallic workpieces
12/24/2008EP2006891A1 Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, and kit for preparing aqueous dispersion for chemical mechanical polishing
12/24/2008EP2006890A2 Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, kit for chemical mechanical polishing, and kit for preparing aqueous dispersion for chemical mechanical polishing
12/24/2008EP2006051A2 Abrasive cloth and method for producing nanofiber structure
12/24/2008EP1446263B1 Method for polishing a substrate surface
12/24/2008DE102004004556B4 Verfahren zur Herstellung einer Halbleiterscheibe A process for producing a semiconductor wafer
12/24/2008CN201168908Y Full-automatic three-disk horizontal type grinding miller
12/24/2008CN101331593A Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, and kit for preparing aqueous dispersion for chemical mechanical polishing
12/24/2008CN101328399A Reagent kit for preparing chemical mechanical polishing aqueous dispersion, and use thereof
12/24/2008CN101327577A Fixed abrasive polishing pad with self-finishing function and even wear
12/24/2008CN101327573A 抛光方法 Polishing method
12/24/2008CN101327572A Technique for thinning back side of silicon wafer
12/24/2008CN100445091C Controlled penetration subpad
12/23/2008US7467990 Back pressure control system for CMP and wafer polishing
12/18/2008WO2008154185A2 Thin polishing pad with window and molding process
12/18/2008WO2008153782A2 Methods and apparatus for polishing a semiconductor wafer
12/18/2008WO2008152883A1 Method of polishing glass substrate
12/18/2008WO2008116049A3 Methods of removing defects in surfaces
12/18/2008US20080311825 Incorporation of Particulate Additives Into Metal Working Surfaces
12/18/2008US20080311823 Apparatus for heating or cooling a polishing surface of a polishing appratus
12/18/2008US20080311750 Polishing composition for semiconductor wafer and polishing method
12/18/2008US20080311487 Glass substrate for mask blank and method of polishing for producing the same
12/18/2008DE10020347B4 Vorrichtung zum Schlafen von kugelförmigen Objekten Device to sleep by spherical objects
12/17/2008EP2001787A2 Liquid dispense system
12/17/2008CN101326257A Adjuvant for controlling polishing selectivity and chemical mechanical polishing slurry comprising the same
12/17/2008CN101326256A Adjuvant capable of controlling a polishing selectivity and chemical mechanical polishing slurry comprising the same
12/17/2008CN100443265C Polishing pad
12/17/2008CN100443263C 抛光垫 Polishing pad
12/16/2008US7465668 Method of manufacturing semiconductor device
12/16/2008US7465221 Polishing apparatus
12/16/2008US7465216 Polishing apparatus
12/16/2008US7465214 Substrate holding apparatus and polishing apparatus
12/16/2008CA2463209C Proportional pressure regulator having positive and negative pressure delivery capability
12/11/2008WO2008150012A1 Polishing composition
12/11/2008WO2008149937A1 Pad and method for polishing device wafer
12/11/2008WO2008149864A1 Method of polishing glass substrate
12/11/2008WO2008149650A1 Process for manufacturing polishing pad
12/11/2008US20080305722 Method for the single-sided polishing of bare semiconductor wafers
12/11/2008US20080305720 Method for Production of a Laminate Polishing Pad
12/11/2008US20080304929 Machining machine with means for acquiring machining parameters
12/11/2008DE20221899U1 Feinschleifmaschine Fine grinding machine
12/11/2008DE102007026292A1 Verfahren zur einseitigen Politur nicht strukturierter Halbleiterscheiben A method for unilateral polish not structured semiconductor wafers
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