| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 02/26/2009 | US20090050897 Substrate, method of polishing the same, and polishing apparatus |
| 02/25/2009 | EP2027970A1 Polishing composition and polishing method |
| 02/25/2009 | CN101375376A CMP abrasive slurry for polishing insulation film, polishing method, and semiconductor electronic part polished by the polishing method |
| 02/25/2009 | CN101375375A Polishing pad and polishing apparatus |
| 02/25/2009 | CN101375374A Chemical mechanical polishing pad and method for manufacturing same |
| 02/25/2009 | CN101372090A Method for measuring thickness of substrate and equipment for processing substrate |
| 02/25/2009 | CN101372089A Method and slurry for tuning low-k versus copper removal rates during chemical mechanical polishing |
| 02/25/2009 | CN100464394C Manufacture of semiconductor device using CMP |
| 02/25/2009 | CN100463778C Parallel planar grinder |
| 02/24/2009 | US7494931 Method for fabricating semiconductor device and polishing method |
| 02/24/2009 | US7494519 moving the workpiece and the fixed abrasive article ( containing abrasive particles of diamond, SiC, B4C, BN and binder glass, metal) in the presence of the conditioning particles ( alumina, zironia, corundum, ceria, glass) to modify the surface of the workpiece and to condition the fixed abrasive |
| 02/19/2009 | WO2009023663A2 Combinatorial processing including movement and rotation within a region |
| 02/19/2009 | WO2009023400A1 Chemical mechanical polishing pad structure minimizing trapped air and polishing fluid intrusion |
| 02/19/2009 | WO2008085187A3 Compositions, methods and systems for polishing aluminum oxide and aluminum oxynitride substrates |
| 02/19/2009 | US20090047881 Combinatorial processing including rotation and movement within a region |
| 02/19/2009 | US20090047873 Substrate retainer |
| 02/19/2009 | US20090047872 Polishing pad |
| 02/19/2009 | US20090047785 CMP Polishing Method, CMP Polishing Apparatus, and Process for Producing Semiconductor Device |
| 02/19/2009 | US20090045410 GaN SUBSTRATE AND SEMICONDUCTOR DEVICE PREPARED BY USING METHOD AND APPARATUS OF POLISHING GaN SUBSTRATE |
| 02/18/2009 | EP2025470A1 Polishing apparatus, polishing method, substrate manufacturing method, and electronic apparatus manufacturing method |
| 02/18/2009 | EP2025469A1 Multi-layer polishing pad material for CMP |
| 02/18/2009 | EP2025468A2 Polishing method, substrate manufacturing method, and electronic apparatus manufacturing method |
| 02/18/2009 | EP2025467A1 Polishing apparatus, substrate manufacturing method, and electronic apparatus manufacturing method |
| 02/18/2009 | EP2025466A2 Polishing apparatus, substrate manufacturing method, and electronic apparatus manufacturing method |
| 02/18/2009 | EP2025460A2 Improved chemical mechanical polishing pad and methods of making and using same |
| 02/18/2009 | EP2025459A2 Layered-filament lattice for chemical mechanical polishing |
| 02/18/2009 | EP2025458A2 Interpenetrating network for chemical mechanical polishing |
| 02/18/2009 | EP2025457A2 Interconnected-multi-element-lattice polishing pad |
| 02/18/2009 | EP2025456A2 Chemical mechanical polishing pad with controlled wetting |
| 02/18/2009 | EP2025455A2 Chemical mechanical polishing method |
| 02/18/2009 | EP2025454A2 Improved chemical mechanical polishing pad and methods of making and using same |
| 02/18/2009 | EP2024136A2 Wafer de-chucking |
| 02/18/2009 | EP1757406B1 Abrasive cloth and method for preparing nano-fiber structure |
| 02/18/2009 | CN101367194A Silicon slice grinding rate control method |
| 02/18/2009 | CN101367193A Silicon slice grinding surface scuffing control method |
| 02/18/2009 | CN101367192A Wafer reverse side grinding method |
| 02/18/2009 | CN100462415C High-rate barrier polishing composition |
| 02/17/2009 | US7491252 Tantalum barrier removal solution |
| 02/17/2009 | US7491118 Chemical mechanical polishing apparatus and methods using a polishing surface with non-uniform rigidity |
| 02/17/2009 | US7491117 Substrate holding apparatus |
| 02/12/2009 | WO2008154185A3 Thin polishing pad with window and molding process |
| 02/12/2009 | US20090042490 Three-dimensional network for chemical mechanical polishing |
| 02/12/2009 | US20090042489 Wafer polishing apparatus and wafer polishing method |
| 02/12/2009 | US20090042486 Polishing method, substrate manufacturing method, and electronic apparatus manufacturing method |
| 02/12/2009 | US20090042482 Rough polishing method of semiconductor wafer and polishing apparatus of semiconductor wafer |
| 02/12/2009 | US20090042480 Polishing pad and polishing apparatus |
| 02/12/2009 | US20090042392 Polishing apparatus, substrate manufacturing method, and electronic apparatus manufacturing method |
| 02/12/2009 | US20090041563 Wafer Transferring Apparatus, Polishing Apparatus, and Wafer Receiving Method |
| 02/12/2009 | US20090038504 Polishing slurry for ionic materials |
| 02/12/2009 | DE102007037964A1 Device for chemico-mechanical polishing of workpiece surface, especially semiconductor wafer surface useful in semiconductor technology is cost effective to produce, highly flexible in use and gives high thruput |
| 02/11/2009 | CN101362313A Chemical-mechanical grinding device and chemical-mechanical grinding method |
| 02/11/2009 | CN101362311A Polishing apparatus, substrate manufacturing method, and electronic apparatus manufacturing method |
| 02/11/2009 | CN101362310A Polishing apparatus, substrate manufacturing method, and electronic apparatus manufacturing method |
| 02/11/2009 | CN101362308A Polishing apparatus, substrate manufacturing method, and electronic apparatus manufacturing method |
| 02/11/2009 | CN100461364C Multiple zone carrier head with flexible membrane |
| 02/11/2009 | CN100461346C Polishing pad and method for manufacture of semiconductor device using the same |
| 02/11/2009 | CN100460478C Polishing composition for magnetic disk |
| 02/10/2009 | US7488240 Polishing device |
| 02/10/2009 | US7488236 Polishing pad and method of producing the same |
| 02/10/2009 | US7488235 Polishing apparatus and related polishing methods |
| 02/05/2009 | WO2009017782A2 Ruthenium cmp compositions and methods |
| 02/05/2009 | WO2009017652A2 Compositions and methods for chemical-mechanical polishing of phase change materials |
| 02/05/2009 | WO2009017095A1 Polishing liquid for metal and method of polishing |
| 02/05/2009 | US20090036045 Chemical mechanical polishing pad |
| 02/05/2009 | US20090036037 Apparatus for conditioning processing pads |
| 02/05/2009 | US20090036024 Cmp apparatus and method of polishing wafer using cmp |
| 02/05/2009 | US20090035202 Cerium Oxide-Based Abrasive, and Production Method and Use Thereof |
| 02/05/2009 | DE102007035405A1 Poliermaschine Polisher |
| 02/04/2009 | EP2020680A1 Polishing liquid for cmp and method of polishing |
| 02/04/2009 | CN201189632Y Carrier billet adjusting apparatus for grinding silicon chip |
| 02/04/2009 | CN101357451A Method for increasing grinding wafer flatness |
| 02/04/2009 | CN101357450A Chemically machinery grinding device and method for cleaning grinding pad and grinding head |
| 02/04/2009 | CN100458925C Method of texture processing on glass substrate for magnetic hard disk and slurry therefor |
| 02/04/2009 | CN100457394C Chemical mechanical polishing method for SIT |
| 02/03/2009 | US7485029 Double face polishing apparatus |
| 02/03/2009 | US7485028 Chemical mechanical polishing retaining ring, apparatuses and methods incorporating same |
| 01/29/2009 | WO2009014191A1 Polishing composition |
| 01/29/2009 | US20090029630 Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting |
| 01/29/2009 | US20090029553 Free radical-forming activator attached to solid and used to enhance CMP formulations |
| 01/29/2009 | US20090029552 Method For Polishing A Substrate Composed Of Semiconductor Material |
| 01/29/2009 | US20090026068 Revolution member supporting apparatus and semiconductor substrate processing apparatus |
| 01/29/2009 | DE10222956B4 Feinschleifmaschine Fine grinding machine |
| 01/29/2009 | DE102007035266A1 Verfahren zum Polieren eines Substrates aus Halbleitermaterial A method for polishing a substrate of semiconductor material |
| 01/28/2009 | EP2019419A1 Method for producing polishing composition |
| 01/28/2009 | CN201186403Y Adjusting ring capable of improving short finish of edge |
| 01/28/2009 | CN101356248A Cerium-based abrasive material |
| 01/28/2009 | CN101356040A Process for producing glass substrate for magnetic disk and process for manufacturing magnetic disk |
| 01/28/2009 | CN101355032A Method for polishing a substrate composed of semiconductor material |
| 01/28/2009 | CN101352834A Grinding pad collating unit and grinding pad collating method |
| 01/28/2009 | CN101352833A Method for polishing copper by chemical and mechanical methods |
| 01/28/2009 | CN101352830A Device for stabilizing current velocity liquid and lapping liquid feeding device of |
| 01/28/2009 | CN100455411C Viscoelastic polisher and polishing method using the same |
| 01/27/2009 | US7481950 Polishing composition and polishing method using the same |
| 01/27/2009 | US7481945 Polishing progress monitoring method and device thereof, polishing device, semiconductor device production method, and semiconductor device |
| 01/22/2009 | WO2009012444A1 Retaining ring with shaped profile |
| 01/22/2009 | US20090023362 Retaining ring for chemical mechanical polishing, its operational method and application system |
| 01/22/2009 | US20090023361 Cmp apparatus and method of polishing wafer using cmp |
| 01/22/2009 | US20090023291 Polishing Methods |
| 01/21/2009 | EP2017318A2 Chemical mechanical polishing aqueous dispersion preparation set, method of preparing chemical mechanical polishing aqueous dispersion, chemical mechanical polishing aqueous dispersion, and chemical mechanical polishing method |
| 01/21/2009 | CN101350332A Ultra thin wafers having an edge support ring and manufacture method thereof |