| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 04/02/2009 | WO2005036605A3 Improved retaining ring for wafer carriers |
| 04/02/2009 | US20090087988 Polishing liquid and polishing method |
| 04/01/2009 | EP2042267A1 Carrier for double side polishing device, and double side polishing device and double side polishing method using the carrier |
| 04/01/2009 | EP2042264A1 System and method for polishing surface of tape-like metal base material |
| 04/01/2009 | EP2041779A1 System and method for delivering chemicals |
| 04/01/2009 | EP2040878A2 Polishing pad having micro-grooves on the pad surface |
| 04/01/2009 | CN201214213Y Grinding machine with sieving mechanism |
| 04/01/2009 | CN101397481A Polishing liquid |
| 04/01/2009 | CN101397480A 抛光液和抛光方法 Polishing liquid and polishing method |
| 04/01/2009 | CN101396805A Carrier head with retaining ring and carrier ring |
| 04/01/2009 | CN101396804A Deburring method and device of steps inner-holes |
| 04/01/2009 | CN100474521C Temperature controlled hot edge ring assembly, and device comprising the same and the use thereof |
| 04/01/2009 | CN100473501C Method for prolonging service-life of grinding pad in chemical-mechanical polishing |
| 04/01/2009 | CN100473496C Automatic pressure regulating method |
| 03/31/2009 | US7510585 Heat treating the aluminum oxide-based glass particles above the glass transition temperature so the glass particles coalesce; cooling to crystallize and form a ceramic; bonded, coated and nonwoven abrasives; abrasive brushes |
| 03/31/2009 | US7510461 Grinding jig set and grinding method |
| 03/31/2009 | US7510460 Substrate polishing apparatus |
| 03/26/2009 | WO2009037903A1 Cmp slurry for silicon film polishing and polishing method |
| 03/26/2009 | US20090081852 Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure |
| 03/26/2009 | US20090078908 Polishing liquid |
| 03/26/2009 | US20090077899 exhibits uniform dispersibility and reduced changes in hardness of the urethane pad due to heat and slurry, thereby resulting in no deterioration of polishing efficiency due to abrasion heat and solubility in the slurry upon polishing, and also enables a high-temperature polishing operation |
| 03/25/2009 | EP2039733A1 Method of surface treatment of group III nitride crystal film, group III nitride crystal substrate, group III nitride crystal substrate with epitaxial layer, and semiconductor device |
| 03/25/2009 | EP2039474A1 Polishing slurry, method for manufacturing the polishing slurry, nitride crystalline material and method for polishing surface of the nitride crystalline material |
| 03/25/2009 | EP1526948A4 Uniform thin films produced by magnetorheological finishing |
| 03/25/2009 | CN101395097A Method of processing glass base and rinse composition for glass base processing |
| 03/25/2009 | CN101391402A Brazed diamond tools and methods for making the same |
| 03/25/2009 | CN101391397A Apparatus and methods for spectrum based monitoring of chemical mechanical polishing |
| 03/25/2009 | CN100472728C CMP polishing method, CMP polishing apparatus, and process for producing semiconductor device |
| 03/25/2009 | CA2638584A1 Smoothing and / or lapping tool particularly for finishing stone materials |
| 03/24/2009 | US7507668 Chemically mechanically polishing the surface gallium-indium-arsenide-phosphide crystal using polishing slurry containing abrasive grains formed of SiO2; crystal surface having a small surface roughness can be formed at a high polishing rate and effectively |
| 03/24/2009 | US7507148 Polishing apparatus, polishing head and polishing method |
| 03/24/2009 | US7507144 Substrate polishing apparatus |
| 03/24/2009 | CA2500543C Flow control system |
| 03/19/2009 | WO2009035518A1 Cmp sensor and control system |
| 03/19/2009 | WO2009035073A1 Polishing apparatus, polishing method and substrate manufacturing method wherein substrate is polish-processed using the polishing method |
| 03/19/2009 | WO2009034924A1 Magnetorheological polishing slurry composition |
| 03/19/2009 | WO2009034905A1 Cerium oxide and method for producing the same |
| 03/19/2009 | WO2009034765A1 Base material for polishing or wiping |
| 03/19/2009 | US20090075574 Polishing apparatus, substrate manufacturing method, and electronic apparatus manufacturing method |
| 03/19/2009 | US20090075568 Polishing pad, method of producing the same and method of producing semiconductor device by using the same |
| 03/19/2009 | US20090075487 Method of manufacturing semiconductor device |
| 03/19/2009 | DE102007044077A1 Poliervorrichtung Polishing apparatus |
| 03/18/2009 | EP2035187A2 Abrasive articles, cmp monitoring system and method |
| 03/18/2009 | EP1708848B1 Chemical mechanical planarization process control utilizing in-situ conditioning process |
| 03/18/2009 | EP1579482A4 Method and apparatus for planarizing a semiconductor wafer |
| 03/18/2009 | EP1473115B1 Polishing method and polishing device |
| 03/18/2009 | CN101390197A Substrate treating device, substrate convey device, substrate grasping device, and chemical solution treating device |
| 03/18/2009 | CN101386149A Cleaning device for chemical mechanical polishing device |
| 03/18/2009 | CN100470732C Silicon wafer, polishing method and producing method thereof, and apparatus for polishing disc-like workpiece |
| 03/18/2009 | CN100470731C Process for producing abrasive and process for producing silicon wafer |
| 03/18/2009 | CN100469531C Polishing method for zinc oxide single crystal substrate level substrate |
| 03/18/2009 | CN100469527C Substrate for magnetic disc |
| 03/17/2009 | US7503833 Three-dimensional network for chemical mechanical polishing |
| 03/17/2009 | US7503830 Apparatus for reduction of defects in wet processed layers |
| 03/12/2009 | WO2009032549A1 Polishing pad and method of use |
| 03/12/2009 | WO2009031515A1 Water-soluble cutting fluid for loose abrasive type wire saw slicing machines, slurry and cutting process |
| 03/12/2009 | WO2009031389A1 Aqueous dispersion for chemical mechanical polishing and method for preparing the same, kit for preparing aqueous dispersion for chemical mechanical polishing, and chemical mechanical polishing method for semiconductor device |
| 03/12/2009 | US20090068935 Polishing apparatus |
| 03/12/2009 | US20090068934 Wafer polishing carrier apparatus and chemical mechanical polishing equipment using the same |
| 03/12/2009 | US20090068840 Polishing liquid and method for manufacturing semiconductor device |
| 03/12/2009 | US20090067959 Substrate processing apparatus, substrate transfer apparatus, substrate clamp apparatus, and chemical liquid treatment apparatus |
| 03/11/2009 | EP1616662B1 Both side grinding method and both side grinder of thin disc-like work |
| 03/11/2009 | CN100468647C Grinding agent and grinding method |
| 03/11/2009 | CN100468646C Chemical-mechanical grinding method |
| 03/11/2009 | CN100468645C Method for producing semiconductor wafer |
| 03/11/2009 | CN100468643C Substrate holding apparatus and polishing apparatus |
| 03/11/2009 | CN100467225C LCD glass grinder |
| 03/11/2009 | CN100467224C Abrasive cloth, polishing device and method for manufacturing semiconductor device |
| 03/11/2009 | CN100467223C Sphericity part fixed abrasive lapping method |
| 03/11/2009 | CN100467215C Subpad having firmly sealed edges |
| 03/11/2009 | CN100467210C Vacuum chuck and suction board |
| 03/10/2009 | US7501001 Abrasive particles, and methods of making and using the same |
| 03/10/2009 | US7501000 Abrasive particles, abrasive articles, and methods of making and using the same |
| 03/10/2009 | US7500901 Data processing for monitoring chemical mechanical polishing |
| 03/05/2009 | WO2009029322A1 System and method for producing damping polyurethane cmp pads |
| 03/05/2009 | WO2009028471A1 Polishing composition |
| 03/05/2009 | WO2009028256A1 Set for preparation of aqueous dispersion for chemical mechanical polishing and method for preparing aqueous dispersion for chemical mechanical polishing |
| 03/05/2009 | US20090061748 Substrate holding apparatus |
| 03/05/2009 | US20090061745 Polishing head using zone control |
| 03/05/2009 | US20090061744 Polishing pad and method of use |
| 03/05/2009 | US20090061743 Method of soft pad preparation to reduce removal rate ramp-up effect and to stabilize defect rate |
| 03/05/2009 | US20090061737 Lapping apparatus and lapping method |
| 03/05/2009 | US20090060688 Suction apparatus, polishing apparatus, semiconductor device, and method of manufacturing a semiconductor device |
| 03/05/2009 | US20090058409 Method and device for forecasting polishing end point |
| 03/05/2009 | US20090056102 Method for fabricating semiconductor device |
| 03/05/2009 | DE10226358B4 Verbesserte konstruierte Schleifmittel Improved engineered abrasives |
| 03/05/2009 | DE102007041209A1 Polierkopf, der Zonenkontrolle verwendet Polishing head zone control used |
| 03/04/2009 | EP2031645A1 Device for elevating up and down cleaning brush of chemical-mechanical wafer polishing apparatus |
| 03/04/2009 | CN101379598A 化学机械研磨垫 The chemical mechanical polishing pad |
| 03/04/2009 | CN101376232A Chemical mechanical polishing method capable of enhancing polishing performance |
| 03/04/2009 | CN101376230A Lapping apparatus and lapping method |
| 03/04/2009 | CN100466191C Polishing device |
| 03/04/2009 | CN100466188C Conductive polishing component used for electrochemical mechanical polishing process |
| 03/03/2009 | US7497767 Vibration damping during chemical mechanical polishing |
| 02/26/2009 | WO2009026419A1 Optimized cmp conditioner design for next generation oxide/metal cmp |
| 02/26/2009 | WO2009025748A1 Polishing pad |
| 02/26/2009 | WO2009025259A1 Process for producing glass substrate for magnetic disk |
| 02/26/2009 | US20090054243 Method of polishing tape-shaped substrate and substrate for oxide superconductor |
| 02/26/2009 | US20090053983 Chemical mechanical polishing pad and method for manufacturing same |
| 02/26/2009 | US20090051939 Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus |