| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 05/14/2009 | CA2706285A1 Method and device for mechanically processing diamond |
| 05/13/2009 | EP1448736B1 Boron-containing polishing system and method |
| 05/13/2009 | CN201235498Y Lapping machine for two-side of wafer |
| 05/13/2009 | CN101432854A Polishing liquid for CMP and method of polishing |
| 05/13/2009 | CN101428398A 磨削装置 Grinding apparatus |
| 05/13/2009 | CN101428383A Automotive drum type braking device grinding and renovating method |
| 05/13/2009 | CN100487870C Cmp polishing system and abrasive solution |
| 05/13/2009 | CN100486771C Loading and unloading system and method for grinding plates |
| 05/13/2009 | CN100486770C Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method for semiconductor wafers |
| 05/12/2009 | US7531108 Fine particle sizes; narrow particle size distribution; display devices and lighting elements; printed on explosives or ammunitions; currency; printed on confidential documentation |
| 05/12/2009 | US7530877 Semiconductor processor systems, a system configured to provide a semiconductor workpiece process fluid |
| 05/07/2009 | WO2009057258A1 Work polishing head, and polishing apparatus having the polishing head |
| 05/07/2009 | US20090117829 Polishing slurry for metal, and polishing method |
| 05/07/2009 | US20090117828 Polishing apparatus and substrate processing apparatus |
| 05/06/2009 | EP2055429A2 Polishing apparatus |
| 05/06/2009 | CN201231446Y Cleaning cushion for chemical and mechanical grinding |
| 05/06/2009 | CN101426730A Method for producing oxide particle, slurry, polishing agent and method for polishing substrate |
| 05/06/2009 | CN101426618A Manufacturing method of polishing pad |
| 05/06/2009 | CN101423747A Abrasive, method of polishing wafer, and method of producing semiconductor device |
| 05/06/2009 | CN101422882A Grinding mat and method |
| 05/06/2009 | CN101422877A Grinding mat trimmer for chemical mechanical grinding |
| 05/06/2009 | CN101422874A Polishing apparatus |
| 05/06/2009 | CN100484718C Cushion layer for polishing pad |
| 05/05/2009 | US7527723 Ion exchanger; surface smoothness; removal residues from workpiece |
| 05/05/2009 | US7527722 Electrochemical mechanical planarization |
| 05/05/2009 | US7527662 Resin structure and abrasive grains, wherein a critical surface tension of the resin is within a specified range; for chemical mechanical polishing; polishing efficiency, quality without any slurry |
| 05/05/2009 | US7527546 Viscoelastic polisher and polishing method using the same |
| 04/30/2009 | WO2009054370A1 Cmp polishing liquid and method for polishing substrate using the same |
| 04/30/2009 | WO2009054297A1 Method for polishing substrate |
| 04/30/2009 | US20090111362 Polishing Apparatus |
| 04/30/2009 | US20090111358 Polishing apparatus and polishing method |
| 04/30/2009 | US20090108266 Friction Control in Apparatus Having Wide Bandgap Semiconductors |
| 04/29/2009 | CN101417408A Synchronous belt drive four-position plane grinding device |
| 04/29/2009 | CN101417407A Chemical mechanical grinding method |
| 04/29/2009 | CN100482417C Lapping carrier for use in fabricating sliders |
| 04/29/2009 | CN100482408C Attitude control device and precision machining apparatus comprising same |
| 04/28/2009 | US7524801 Process for removing contaminant from a surface and composition useful therefor |
| 04/28/2009 | US7524475 abrasive material for polishing silicon oxide layer or silicon nitride layer on silicon substrate; forming a shallow trench isolation; chemical mechanical polishing; obtained via a low-temperature calcination, pulverization, and a high-temperature calcination; high pore fraction and low strength |
| 04/28/2009 | US7524410 Methods and apparatus for removing conductive material from a microelectronic substrate |
| 04/28/2009 | US7524232 Workpiece centering apparatus and method of centering workpiece |
| 04/23/2009 | WO2009051895A1 Method of forming a polyurea polyurethane elastomer containing chemical mechanical polishing pad |
| 04/23/2009 | US20090104856 abrasion resistant; excellent in removal rate and in-plane uniformity; stable removal rate even when polishing a number of objects; irradiating sheet-shaped polymer molded article with an electron beam within an irradiation dose of 10 to 400 kGy; less processing time; 1,2-polybutadiene; cyclodextrin |
| 04/23/2009 | US20090104852 Carrier, Method For Coating A Carrier, and Method For The Simultaneous Double-Side Material-Removing Machining Of Semiconductor Wafers |
| 04/23/2009 | US20090104850 Polishing pad |
| 04/23/2009 | US20090104847 Polishing monitoring method and polishing apparatus |
| 04/23/2009 | US20090104778 Polishing Composition for CMP and device wafer producing method using the same |
| 04/23/2009 | US20090103993 Method of Polishing a Tungsten Carbide Surface |
| 04/23/2009 | US20090100764 Composition for removing photoresist layer and method for using it |
| 04/23/2009 | DE102007050482A1 Workpiece finishing device, has processing spindle attached to frame, and electronic gradometer arranged at processing spindle for determining adjustment of spindle axis relative to vertical axis |
| 04/23/2009 | DE102007049811A1 Läuferscheibe, Verfahren zur Beschichtung einer Läuferscheibe sowie Verfahren zur gleichzeitigen beidseitigen Material abtragenden Bearbeitung von Halbleiterscheiben Rotor disc, method for coating a rotor disc and method for simultaneous two-sided material-removing processing of semiconductor wafers |
| 04/22/2009 | EP2051040A2 Polishing monitoring method and polishing apparatus |
| 04/22/2009 | EP2049304A1 Chemical mechanical polishing pads comprising liquid organic material core encapsulated in polymer shell and methods for producing the same |
| 04/22/2009 | CN101413780A Polishing monitoring method and polishing apparatus |
| 04/22/2009 | CN101412202A Method for determining grinding time in chemico-mechanical polishing process |
| 04/22/2009 | CN101412201A Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafers |
| 04/22/2009 | CN101412200A Nozzle arm for chemico-mechanical grinding and control device thereof |
| 04/22/2009 | CN100481341C Carrier for double side polishing machine and double side polishing machine employing the same, and double side polishing method |
| 04/22/2009 | CN100481210C Apparatus for grounding a magnetic recording head |
| 04/22/2009 | CN100480929C System and method for point of use delivery, control and mixing chemical and slurry for CMP/cleaning system |
| 04/22/2009 | CN100479995C Adhering stripping method and device for plate on clamp |
| 04/22/2009 | CN100479992C Polishing seat with concave structure for improving mixed tail trace |
| 04/21/2009 | US7520968 Conductive pad design modification for better wafer-pad contact |
| 04/21/2009 | US7520955 Carrier head with a multilayer retaining ring for chemical mechanical polishing |
| 04/21/2009 | US7520795 Grooved retaining ring |
| 04/16/2009 | WO2009048099A1 Polishing tool structure, polishing surface layer and polishing method |
| 04/16/2009 | WO2009017782A3 Ruthenium cmp compositions and methods |
| 04/16/2009 | WO2008153782A3 Methods and apparatus for polishing a semiconductor wafer |
| 04/16/2009 | WO2007060673A3 Incorporation of particulate additives into metal working surfaces |
| 04/16/2009 | WO2006110224A3 Slurry composition and method for polishing organic polymer-based ophthalmic substrates |
| 04/16/2009 | US20090098376 Double-Sided Adhesive Tape for Securing Polishing-Pad |
| 04/16/2009 | US20090096446 Polishing monitoring method, polishing apparatus and monitoring apparatus |
| 04/16/2009 | US20090094901 CMP Polishing Liquid and Polishing Method |
| 04/16/2009 | DE102004058708B4 Polierkopf, Poliervorrichtung sowie Polierverfahren Polishing head, polishing apparatus and polishing method |
| 04/15/2009 | EP2048208A2 Free radical-forming activator attached to solid and used to enhanced CMP formulations |
| 04/15/2009 | EP2046531A2 System and method for processing high purity materials |
| 04/15/2009 | EP1389152A4 Delivery system for magnetorheological fluid |
| 04/15/2009 | CN101410956A Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, and kit for preparing aqueous dispersion for chemical mechanical polishing |
| 04/15/2009 | CN101410955A Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, kit for chemical mechanical polishing, and kit for preparing aqueous dispersion for chemical mechanical poli |
| 04/15/2009 | CN101407040A Face lapping mill with abrasive disk cooling mechanism |
| 04/15/2009 | CN101407039A Sprayer capable of preventing abrasive on grinder table from aggregating and use method thereof |
| 04/09/2009 | WO2009023663A3 Combinatorial processing including movement and rotation within a region |
| 04/09/2009 | WO2009017652A3 Compositions and methods for chemical-mechanical polishing of phase change materials |
| 04/09/2009 | US20090093202 Method for manufacturing polishing pad |
| 04/09/2009 | US20090093201 Polishing pad |
| 04/09/2009 | US20090093200 Polishing pad |
| 04/09/2009 | US20090093193 Chemical mechanical polishing apparatus |
| 04/09/2009 | US20090093118 Polishing composition |
| 04/08/2009 | EP2045307A1 Polishing composition |
| 04/08/2009 | EP2045038A1 Polishing Pad |
| 04/08/2009 | CN201217175Y Miniature robot for self-determination grinding and casting operation of large-scale curve |
| 04/08/2009 | CN101402187A Polishing pad |
| 04/08/2009 | CN100475445C Method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner |
| 04/07/2009 | US7513820 Method and apparatus for producing micro-texture on a slider substrate using chemical and mechanical polishing techniques |
| 04/07/2009 | US7513819 Polishing apparatus and method |
| 04/07/2009 | US7513818 Polishing endpoint detection system and method using friction sensor |
| 04/02/2009 | WO2009041697A1 Polishing composition |
| 04/02/2009 | WO2009041422A1 Polishing pad |
| 04/02/2009 | WO2009041277A1 Semiconductor wafer manufacturing method |
| 04/02/2009 | WO2006115581A3 Composition and method for polishing a sapphire surface |
| 04/02/2009 | WO2005059970A3 Controlling removal rate uniformity of an electropolishing process in integrated circuit fabrication |