| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 06/24/2009 | CN100503168C Polishing disk with end-point detection port |
| 06/24/2009 | CN100503167C Composition for polishing |
| 06/24/2009 | CN100503161C Method and apparatus for processing sliders for use in disk drives and the like |
| 06/24/2009 | CN100503114C Methods and apparatus for electromechanically and/or electrochemically removing conductive material from a microelectronic substrate |
| 06/23/2009 | US7550388 Polishing composition and polishing method |
| 06/23/2009 | US7550020 comprising cerium oxide abrasives, and cationic homo- or copolymer containing monomers of aminoalkyl group-containing (meth)acrylic ester or amide, aminoalkoxyalkyl group-containing (meth)acrylic ester; scratch resist; semiconductor production |
| 06/23/2009 | US7549909 Methods for optical endpoint detection during semiconductor wafer polishing |
| 06/18/2009 | WO2008023288A3 An apparatus for and method of polishing a semiconductor wafer using chemical mechanical planarization |
| 06/18/2009 | US20090156101 Polishing apparatus, polishing head and polishing method |
| 06/18/2009 | US20090156008 Polishing Composition and Polishing Method Using The Same |
| 06/18/2009 | US20090156007 Polishing slurry and polishing method |
| 06/18/2009 | US20090156000 Method of manufacturing semiconductor device |
| 06/17/2009 | EP2071615A1 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method for semiconductor device |
| 06/17/2009 | CN101456165A Polishing cloth, polishing cloth processing method, and substrate manufacturing method using same |
| 06/17/2009 | CN101456157A End-face grinding machine |
| 06/17/2009 | CN101456156A Method for adjusting chemical mechanical planarization speed |
| 06/17/2009 | CN101456154A Multiple zone carrier head with flexible membrane |
| 06/17/2009 | CN100500379C Glass substrate for information recording media and its fabricating method |
| 06/17/2009 | CN100500370C Method for correcting CMP working technology condition |
| 06/16/2009 | US7547335 Metal polishing composition and method of polishing using the same |
| 06/16/2009 | US7547243 Method of making and apparatus having polishing pad with window |
| 06/11/2009 | WO2009072405A1 Chemical mechanical polishing pad and chemical mechanical polishing method |
| 06/11/2009 | US20090149118 Silicon Wafer Grinding Apparatus, Retaining Assembly Used for the Same and Silicon Wafer Flatness Correcting Method |
| 06/11/2009 | US20090149115 Wafer edge characterization by successive radius measurements |
| 06/11/2009 | US20090149006 Methods of forming a phase-change material layer pattern, methods of manufacturing a phase-change memory device and related slurry compositions |
| 06/10/2009 | EP2067571A2 Polishing apparatus and polishing method |
| 06/10/2009 | CN101454121A Polishing composition and polishing method |
| 06/10/2009 | CN101450457A Polishing apparatus and polishing method |
| 06/10/2009 | CN101450449A CMP technique condition adjustment control method |
| 06/10/2009 | CN100497509C 抛光组合物和抛光方法 Polishing composition and polishing method |
| 06/10/2009 | CN100496896C Polishing pad |
| 06/10/2009 | CN100496893C Method of preparing a surface of a semiconductor wafer to to produce a satisfactory surface for epitaxial growth on SIC film |
| 06/10/2009 | CN100496892C 基片抛光机 Substrate polishing machine |
| 06/09/2009 | US7544307 Metal polishing liquid and polishing method using it |
| 06/04/2009 | WO2009069509A1 Working object grinding method |
| 06/04/2009 | US20090142996 Polishing apparatus and method |
| 06/04/2009 | US20090142992 Polishing apparatus and polishing method |
| 06/04/2009 | US20090142991 Silicon Wafer Grinding Apparatus, Retaining Assembly Used for the Same and Silicon Wafer Flatness Correcting Method |
| 06/04/2009 | US20090142990 Method for polishing a workpiece |
| 06/04/2009 | US20090139077 Method of manufacturing wafer carrier |
| 06/03/2009 | EP2065132A2 Polishing apparatus and method |
| 06/03/2009 | EP2065131A1 Method of manufacturing wafer carrier |
| 06/03/2009 | EP1366858B1 Polisher and polishing method |
| 06/03/2009 | CN201249404Y Grinding positioning ring |
| 06/03/2009 | CN101448607A 抛光垫 Polishing pad |
| 06/03/2009 | CN101444899A Method of manufacturing wafer carrier |
| 06/03/2009 | CN101444897A 抛光设备和方法 Polishing apparatus and method |
| 06/03/2009 | CN100493847C Polishing pad comprising hydrophobic region and endpoint detection port |
| 06/03/2009 | CN100493846C Finishing controlled ultra-precise polisher |
| 06/02/2009 | US7541287 Method for machining a semiconductor wafer on both sides in a carrier, carrier, and a semiconductor wafer produced by the method |
| 06/02/2009 | US7540800 Rough polishing method of semiconductor wafer and polishing apparatus of semiconductor wafer |
| 05/28/2009 | WO2009067393A1 Damping polyurethane cmp pads with microfillers |
| 05/28/2009 | WO2009066355A1 Polishing head, polishing apparatus and work removing method |
| 05/28/2009 | WO2009066351A1 Polishing head and polishing apparatus |
| 05/28/2009 | WO2007016498A3 Nonwoven polishing pads for chemical mechanical polishing |
| 05/28/2009 | US20090137760 Adhesive composition and adhesive film |
| 05/28/2009 | US20090137189 Polishing pad |
| 05/28/2009 | US20090137188 Polishing pad |
| 05/28/2009 | US20090137123 Polishing Composition and Polishing Method |
| 05/28/2009 | DE102007056122A1 Verfahren zur Herstellung einer Halbleiterscheibe mit polierter Kante A process for producing a semiconductor wafer with polished edge |
| 05/27/2009 | EP2063461A1 Polishing agent for semiconductor integrated circuit device, polishing method, and method for manufacturing semiconductor integrated circuit device |
| 05/27/2009 | EP2062932A1 Interpenetrating polymer network structure and polishing pad and processes for producing them |
| 05/27/2009 | CN201244774Y Stainless steel sheet grinding machine |
| 05/27/2009 | CN201244759Y Dry type erratic current grinding mill |
| 05/27/2009 | CN101443890A Method for producing polishing composition |
| 05/27/2009 | CN101443157A 抛光垫 Polishing pad |
| 05/27/2009 | CN101439496A Device and method for regualting grinding mat |
| 05/27/2009 | CN101439494A Cleaner for CMP equipment grinding head |
| 05/27/2009 | CN101439492A Polysilicon finishing method capable of improving performance of relief polishing |
| 05/27/2009 | CN100492597C Polishing mattress and its manufacture and usage method |
| 05/27/2009 | CN100492071C Optical fiber end surface grinding device |
| 05/26/2009 | US7538880 Turbidity monitoring methods, apparatuses, and sensors |
| 05/26/2009 | US7537446 Apparatus for forming a porous reaction injection molded chemical mechanical polishing pad |
| 05/22/2009 | WO2009064677A2 Cmp pad dressers |
| 05/22/2009 | WO2009064010A1 Polishing composition comprising a n-substituted imidazole and a method for polishing a copper film |
| 05/22/2009 | WO2009063457A2 Improved multiple-phase surfaces, and method therefor |
| 05/21/2009 | US20090130960 Method For Producing A Semiconductor Wafer With A Polished Edge |
| 05/21/2009 | US20090130956 Polishing apparatus and polishing method |
| 05/21/2009 | US20090127500 Polishing composition |
| 05/20/2009 | EP2061070A1 Polishing agent for semiconductor integrated circuit device, polishing method, and method for manufacturing semiconductor integrated circuit device |
| 05/20/2009 | EP0939431B1 Cerium oxide abrasive and method of abrading substrates |
| 05/20/2009 | DE102007022392A1 Polishing machine for surface finishing of workpieces, has two polishing stations with rotary working disks which are arranged around central turning disk and two guiding and pressing stations are mounted for workpiece holder |
| 05/20/2009 | CN201239914Y Lock ring spiro union structure for clamp of chemical-mechanical lapping bench |
| 05/20/2009 | CN101434047A Method for producing a semiconductor wafer with a polished edge |
| 05/20/2009 | CN100490082C Slurry composition for secondary polishing of silicon wafer |
| 05/20/2009 | CN100488729C Polishing state monitoring apparatus and polishing apparatus and method |
| 05/20/2009 | CN100488727C Magnetic fluid grinding device for ceramic ball surface grinding |
| 05/20/2009 | CN100488726C micro-robot for independently grinding and polishing large-scale curved surface |
| 05/19/2009 | US7535082 Nitride semiconductor wafer and method of processing nitride semiconductor wafer |
| 05/19/2009 | US7534364 Methods for a multilayer retaining ring |
| 05/19/2009 | US7534277 Slurry composition for secondary polishing of silicon wafer |
| 05/19/2009 | US7534163 Polishing pad |
| 05/19/2009 | US7534159 Processing method and apparatus |
| 05/14/2009 | WO2009060985A1 Fabric, composite sheet, polishing cloth, and wiping product |
| 05/14/2009 | WO2009060574A1 Spacer manufacturing method for spindle stock |
| 05/14/2009 | WO2009059384A1 Method and device for mechanically processing diamond |
| 05/14/2009 | US20090124175 Double-Side Polishing Method for Wafer |
| 05/14/2009 | US20090124172 Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, kit for chemical mechanical polishing, and kit for preparing aqueous dispersion for chemical mechanical polishing |
| 05/14/2009 | US20090120803 Pad for electrochemical processing |
| 05/14/2009 | DE102007052981A1 Loading and unloading device for silicon wafer, has contact surface sloped relative to horizontal plane such that wafer with outer edges and/or transition surface between edges and plane surfaces of wafer only lies on contact surface |