| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 07/30/2009 | US20090191795 Composition for forming polishing layer of chemical mechanical polishing pad, chemical mechanical polishing pad and chemical mechanical polishing method |
| 07/30/2009 | US20090191791 Polishing method and polishing apparatus |
| 07/30/2009 | US20090191790 Substrate polishing apparatus |
| 07/30/2009 | US20090188170 artificial diamond particles having primary particle diameters of 20 nm or less and impurities attached around these diamond particles; density of non-diamond carbon contained in the impurities is 95-99 % , density of chlorine contained in other than non-diamond carbon in the impurities is 0.5 to 3.5% |
| 07/30/2009 | US20090188146 Rest for cleaning a rifle and for sighting a scope, a stock, and a bore of the rifle |
| 07/29/2009 | EP2083027A2 Composition for forming polishing layer of chemical mechanical polishing pad, chemical mechanical polishing pad and chemical mechanical polishing method |
| 07/29/2009 | EP2082834A1 Method of operating substrate processing apparatus and substrate processing apparatus |
| 07/29/2009 | EP1680271A4 Working surface and system for production thereof |
| 07/29/2009 | EP1639630A4 Polishing apparatus and polishing method |
| 07/29/2009 | CN101496118A Method for polishing tape substrate for oxide superconductor, oxide superconductor, and base material for oxide superconductor |
| 07/29/2009 | CN101495271A Compositions, methods and systems for polishing aluminum oxide and aluminum oxynitride substrates |
| 07/29/2009 | CN101494164A Method of operating substrate processing apparatus and substrate processing apparatus |
| 07/29/2009 | CN101491889A Flow control system |
| 07/29/2009 | CN101491885A Grinding method of wafer control slice |
| 07/29/2009 | CN100521108C Method of manufacturing semiconductor device |
| 07/29/2009 | CN100521095C Method of forming inkjet print head |
| 07/29/2009 | CN100519079C In situ activation device and method of a three-dimensional fixed abrasive article |
| 07/29/2009 | CN100519078C Polishing apparatus and polishing method |
| 07/23/2009 | WO2009090897A1 Electropolishing pad manufacturing method |
| 07/23/2009 | WO2009090551A1 'head for the treatment of stone and ceramic material |
| 07/23/2009 | US20090186560 Wafer de-chucking |
| 07/23/2009 | US20090186557 Method of operating substrate processing apparatus and substrate processing apparatus |
| 07/22/2009 | EP2006890A9 Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, kit for chemical mechanical polishing, and kit for preparing aqueous dispersion for chemical mechanical polishing |
| 07/22/2009 | EP1628298B1 Stamper substrate and process for producing the same |
| 07/22/2009 | CN101490815A System and method for delivering chemicals |
| 07/22/2009 | CN101490814A Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method for semiconductor device |
| 07/22/2009 | CN101489724A System and method for processing high purity materials |
| 07/22/2009 | CN101489722A Carrier for double-sided polishing device, double-sided polishing device using the same and double-sided polishing method |
| 07/22/2009 | CN101489721A Polishing pad |
| 07/22/2009 | CN101489720A 抛光垫 Polishing pad |
| 07/22/2009 | CN100516159C 抛光组合物及抛光方法 Polishing composition and polishing method |
| 07/22/2009 | CN100516157C Aqueous dispersion body for chemical mechanical grinding |
| 07/22/2009 | CN100515685C 一种抛光垫及抛光方法 A polishing pad and polishing method |
| 07/22/2009 | CN100515679C Method and apparatus for lapping magnetic head slider |
| 07/21/2009 | US7563716 Polishing method |
| 07/21/2009 | US7563294 Abrasive particles and methods of making and using the same |
| 07/21/2009 | US7563157 Apparatus for conditioning chemical-mechanical polishing pads |
| 07/16/2009 | WO2009089026A2 Composition and method for polishing nickel-phosphorous-coated aluminum hard disks |
| 07/16/2009 | WO2009088945A1 Chemical-mechanical planarization pad |
| 07/16/2009 | WO2009088832A1 Nanotopography control and optimization using feedback from warp data |
| 07/16/2009 | WO2009088609A1 Detecting the presence of a workpiece relative to a carrier head |
| 07/16/2009 | US20090181541 Polishing process of a semiconductor substrate |
| 07/16/2009 | US20090181539 Polishing agent for semiconductor integrated circuit device, polishing method, and method for manufacturing semiconductor integrated circuit device |
| 07/16/2009 | US20090179172 Polishing composition |
| 07/15/2009 | EP2079106A2 Chemical mechanical polishing method and chemical mechanical polishing device |
| 07/15/2009 | EP1910026B1 Self-contained conditioning abrasive article |
| 07/15/2009 | CN101484979A Method and apparatus for chemical mechanical polishing of large size wafer with capability of polishing individual die |
| 07/15/2009 | CN101484277A Wafer de-chucking |
| 07/15/2009 | CN101484276A Polishing liquid for cmp and polishing method |
| 07/15/2009 | CN101484274A System and method for polishing surface of tape-like metal base material |
| 07/15/2009 | CN101480743A Electroprocessing profile control |
| 07/15/2009 | CN100514581C Measuring alignment between a wafer chuck and polishing/plating receptacle |
| 07/15/2009 | CN100513078C Real time polishing process monitoring |
| 07/15/2009 | CN100513077C Planarization system and method using a carbonate containing fluid |
| 07/15/2009 | CN100513076C Polishing apparatus and polishing method |
| 07/15/2009 | CN100513075C Glass substrate for information recording medium and making method thereof |
| 07/14/2009 | US7559823 Substrate processing apparatus and substrate processing method |
| 07/09/2009 | WO2009086557A1 Chemical-mechanical planarization pad |
| 07/09/2009 | WO2009085087A1 A cmp system and method using individually controlled temperature zones |
| 07/09/2009 | US20090176373 Polishing agent for semiconductor integrated circuit device, polishing method, and method for manufacturing semiconductor integrated circuit device |
| 07/09/2009 | US20090176372 Chemical mechanical polishing slurry and semiconductor device manufacturing method |
| 07/09/2009 | US20090173910 Polishing composition |
| 07/08/2009 | EP2076359A1 Stepped retaining ring |
| 07/08/2009 | CN101479075A Abrasive articles, CMP monitoring system and method |
| 07/08/2009 | CN101474773A Method for processing surface and edge of film coating epitaxial round silicon chip |
| 07/08/2009 | CN101474772A Substrate holding device and polishing apparatus |
| 07/08/2009 | CN101474771A Substrate holding apparatus and polishing apparatus |
| 07/08/2009 | CN100511598C Method for machining a semiconductor wafer |
| 07/08/2009 | CN100509289C Polishing head and polishing apparatus |
| 07/08/2009 | CN100509288C Reflective resistant layer for polsihig pad window |
| 07/08/2009 | CN100509287C Substrate holding device and polishing apparatus |
| 07/02/2009 | WO2009081357A2 Pick and place tool grinding |
| 07/02/2009 | US20090170410 Chemical-mechanical planarization pad |
| 07/02/2009 | US20090170404 Apparatus and method for polishing media discs |
| 07/02/2009 | US20090170323 Chemical mechanical polishing method and chemical mechanical polishing device |
| 07/02/2009 | US20090170320 Cmp system and method using individually controlled temperature zones |
| 07/02/2009 | DE112007002066T5 Polierkissen Polishing pad |
| 07/02/2009 | DE102007063232A1 CMP-System und Verfahren unter Verwendung individuell gesteuerter Temperaturzonen CMP system and method of using individually controlled temperature zones |
| 07/01/2009 | EP2075089A1 Polishing apparatus and polishing method |
| 07/01/2009 | EP1350827B1 Abrasive, abrasive slurry, and method for manufacturing abrasive |
| 07/01/2009 | CN101471288A Semiconductor device using CMP and manufacturing method thereof |
| 07/01/2009 | CN101469253A Grinding composition |
| 07/01/2009 | CN101469252A Polishing composition |
| 07/01/2009 | CN100508132C Grooved polishing pad and method |
| 07/01/2009 | CN100506490C Sandpaper for grinding supporting utensil membrane |
| 07/01/2009 | CN100506485C Chemical mechanical grinding device and its control system and regulating method of grinding pad profile |
| 07/01/2009 | CN100506484C Method for lapping and a lapping apparatus |
| 06/30/2009 | US7553768 Substrate and a method for polishing a substrate |
| 06/30/2009 | US7553433 Producing large quantities of a high quality, dense aerosol for spray pyrolysis operations; multi-phase small particles for use in manufacturing electrically-conductive metallic films for electronic products; powder coatings for thick films |
| 06/30/2009 | US7553214 Polishing article with integrated window stripe |
| 06/25/2009 | WO2009078277A1 Abrasives |
| 06/25/2009 | US20090163122 System and method for polishing surface of tape-like metallic base material |
| 06/25/2009 | US20090163117 Method of producing glass substrate for perpendicular magnetic recording disk |
| 06/25/2009 | US20090163114 Systems and Methods for Dynamic Slurry Blending and Control |
| 06/25/2009 | US20090159845 Polishing slurry, method of treating surface of gaxin1-xasyp1-y crystal and gaxin1-xasyp1-y crystal substrate |
| 06/24/2009 | EP2072185A1 Removable polishing pad for chemical mechanical polishing |
| 06/24/2009 | CN201261164Y 研磨垫以及研磨装置 Polishing pad and polishing apparatus |
| 06/24/2009 | CN100505172C Polishing composition and its stock solution, and polishing method using same |
| 06/24/2009 | CN100505171C 抛光垫 Polishing pad |
| 06/24/2009 | CN100503169C Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control |