| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 09/09/2009 | EP2097221A2 Lapping carrier and method |
| 09/09/2009 | EP2097216A1 Surface treatment method for coated cutting insert |
| 09/09/2009 | EP1833640B1 Substrate holding device and polishing apparatus |
| 09/09/2009 | CN201304606Y Combined grinder |
| 09/09/2009 | CN101528416A Polishing head and polishing apparatus |
| 09/09/2009 | CN101525522A An oligosaprobic polishing composition |
| 09/09/2009 | CN101524829A A method and device for measuring film thickness by coupling eddy current sensors |
| 09/09/2009 | CN101524826A Substrate carrier system, and method of polishing substrate |
| 09/09/2009 | CN100537144C Chemical mechanical polishing pad and chemical mechanical polishing process |
| 09/09/2009 | CN100537143C Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method |
| 09/08/2009 | US7585425 Polishing pads joined to low-adhesion materials such as polytetrafluoroethylene (PTFE) by conventional adhesives resist distortion during polishing but are readily removed for replacement; for semiconductor wafer chemical mechanical polishing (CMP) |
| 09/08/2009 | US7585341 Polishing material comprising diamond clusters |
| 09/08/2009 | US7585205 Substrate polishing apparatus and method |
| 09/08/2009 | US7585204 Substrate polishing apparatus |
| 09/08/2009 | US7585202 Computer-implemented method for process control in chemical mechanical polishing |
| 09/03/2009 | WO2009107472A1 Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method using the same, and method for regenerating aqueous dispersion for chemical mechanical polishing |
| 09/03/2009 | WO2009107334A1 Polishing head, and polishing device and polishing method |
| 09/03/2009 | WO2009107333A1 Carrier for double-side polishing device, and double-side polishing device and double-side polishing method that use same |
| 09/03/2009 | WO2007024807A9 Apparatus and methods for spectrum based monitoring of chemical mechanical polishing |
| 09/03/2009 | US20090221223 Multilayer retaining ring for chemical mechanical polishing |
| 09/03/2009 | US20090221213 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method for semiconductor device |
| 09/03/2009 | US20090221145 Metal polishing slurry and chemical mechanical polishing method |
| 09/03/2009 | DE10142400B4 Halbleiterscheibe mit verbesserter lokaler Ebenheit und Verfahren zu deren Herstellung Semiconductor wafer having improved flatness and local processes for their preparation |
| 09/02/2009 | EP2094441A1 Process and apparatus for treating exhausted abrasive slurries from the lapping process for the recovery of their reusable abrasive component |
| 09/02/2009 | EP2094439A2 Sapphire substrates and methods of making same |
| 09/02/2009 | CN101523565A Machining end point detecting method, grinding method, and grinder |
| 09/02/2009 | CN101522370A Stepped retaining ring |
| 09/02/2009 | CN101518887A Adhesive sheet for grinding back surface of semiconductor wafer and method for grinding back surface of semiconductor wafer using the same |
| 09/02/2009 | CN101518886A High-precision ball double-rotation V-shaped groove efficient grinding unit |
| 09/02/2009 | CN100534718C Double-sided polishing apparatus |
| 09/01/2009 | US7582134 first phase as a disperse metallic phase that is dispersed on a support of the second material phase selected from carbides, borides and nitrides, metal oxides, glass; ultrasonic transducers underlying and ultrasonically energizing a reservoir of liquid feed) which forms droplets of aerosol |
| 08/27/2009 | WO2009104517A1 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method |
| 08/27/2009 | WO2009104465A1 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method |
| 08/27/2009 | WO2009104334A1 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method |
| 08/27/2009 | WO2009064677A3 Cmp pad dressers |
| 08/27/2009 | US20090215270 Polishing liquid and polishing method |
| 08/27/2009 | US20090211167 Slurry for wire saw |
| 08/26/2009 | CN101517709A Polishing agent for semiconductor integrated circuit device, polishing method, and method for manufacturing semiconductor integrated circuit device |
| 08/26/2009 | CN101514726A Once grinding technology of steel ball for high-grade car transmission shaft |
| 08/26/2009 | CN100533675C Baffle and wafer grinding appts. |
| 08/25/2009 | US7579071 Polishing pad containing embedded liquid microelements and method of manufacturing the same |
| 08/25/2009 | US7578923 Electropolishing system and process |
| 08/25/2009 | US7578862 Polishing glass substrate for optic and magnetic disks using aqueous slurry of cerium abrasives |
| 08/25/2009 | US7578728 Lapping system having a polymeric lapping tool |
| 08/25/2009 | US7578724 Incorporation of particulate additives into metal working surfaces |
| 08/20/2009 | WO2009102047A1 Polishing apparatus |
| 08/20/2009 | US20090209185 Chemical mechanical polishing pad |
| 08/20/2009 | US20090209176 Method and apparatus for polishing object |
| 08/20/2009 | US20090209175 Polishing apparatus and substrate processing method |
| 08/20/2009 | DE102008009507A1 Verfahren und Vorrichtung zur Oberflächenbearbeitung extrem harter Werkstoffe Method and apparatus for surface machining extremely hard materials |
| 08/19/2009 | EP2090401A1 Chemical mechanical polishing pad |
| 08/19/2009 | EP2090400A1 Cmp polishing agent, additive solution for cmp polishing agent, and method for polishing substrate by using the polishing agent and the additive solution |
| 08/19/2009 | EP2089186A2 Methods and apparatus for polishing a semiconductor wafer |
| 08/19/2009 | EP1722926B1 Undulated pad conditioner and method of using same |
| 08/19/2009 | CN201291419Y Step inner bore deburring apparatus |
| 08/19/2009 | CN101512733A Polishing agent for semiconductor integrated circuit device, polishing method, and method for manufacturing semiconductor integrated circuit device |
| 08/19/2009 | CN101511539A Polishing apparatus and polishing method |
| 08/19/2009 | CN101511538A CMP polishing agent, additive solution for cmp polishing agent, and method for polishing substrate by using the polishing agent and the additive solution |
| 08/19/2009 | CN101511537A 抛光垫 Polishing pad |
| 08/19/2009 | CN101511536A Method for production of polishing pad |
| 08/19/2009 | CN101511532A Composition and method for polishing a sapphire surface |
| 08/19/2009 | CN101510767A Wafer and polishing device and method, piezoelectric vibrating piece, method and apparatus for fabricating piezoelectric vibrating piece |
| 08/19/2009 | CN101508094A Bevel gear driven four-position plane grinding device |
| 08/19/2009 | CN101508093A Planet grinding device |
| 08/19/2009 | CN101508092A Grinding pressure transition type high-speed grinding method |
| 08/19/2009 | CN100528487C Polishing pad and polishing method for polishing products |
| 08/19/2009 | CN100528486C Polishing apparatus and method of polishing work piece |
| 08/19/2009 | CN100528485C Flow control system |
| 08/19/2009 | CN100528484C Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces |
| 08/18/2009 | US7575501 Advanced workpiece finishing |
| 08/13/2009 | WO2009098951A1 Aqueous dispersion for chemical mechanical polishing, kit for preparing the dispersion, method for preparing aqueous dispersion for chemical mechanical polishing using the kit, and chemical mechanical polishing method for semiconductor device |
| 08/13/2009 | WO2009098924A1 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method |
| 08/13/2009 | WO2009098917A1 Polishing pad manufacturing method |
| 08/13/2009 | US20090203300 Carrier for holding an object to be polished |
| 08/13/2009 | US20090203215 Metal polishing slurry and chemical mechanical polishing method |
| 08/12/2009 | EP2087965A1 Surface grinding machine |
| 08/12/2009 | CN201287297Y Abrasive machining apparatus |
| 08/12/2009 | CN100526409C Slurry compositions and CMP methods using the same |
| 08/12/2009 | CN100526018C Chemical mechanical polishing and pad dressing method |
| 08/12/2009 | CN100526017C Chemomechanical grinder and its grinding pad regulating method |
| 08/11/2009 | US7572354 Electrochemical processing of conductive surface |
| 08/11/2009 | US7572169 Advanced finishing control |
| 08/06/2009 | WO2009096495A1 Polishing composition and polishing method using the same |
| 08/06/2009 | WO2009096294A1 Process for producing glass substrate for magnetic disk |
| 08/06/2009 | US20090197415 Polishing fluid composition |
| 08/06/2009 | US20090197414 Polishing Composition and Polishing Method Using The Same |
| 08/06/2009 | US20090197413 Polishing Composition and Polishing Method Using The Same |
| 08/06/2009 | US20090197412 Chemical mechanical polishing composition and process |
| 08/06/2009 | US20090197359 Methods for evaluating and manufacturing semiconductor wafer |
| 08/05/2009 | EP2085181A1 Substrate holding apparatus and substrate polishing apparatus |
| 08/05/2009 | EP2083967A1 Conditioning tools and techniques for chemical mechanical planarization |
| 08/05/2009 | CN201283537Y CMP edge pressure dressing ring |
| 08/05/2009 | CN201283522Y Single face lapping mill |
| 08/05/2009 | CN101501112A Interpenetrating polymer network structure and polishing pad and processes for producing them |
| 08/05/2009 | CN101497182A Grinding pad and method for producing the same |
| 08/05/2009 | CN100522480C Surface polishing method and apparatus thereof |
| 08/04/2009 | US7569135 Chemical mechanical polishing semiconductor wafers having a a processing end point detecting section to detect a frictional force change between the workpiece and the processing or feeding electrode; an ion exchanger between the substrate and the processing or feeding electrode |
| 08/04/2009 | US7569134 Electropolishing by having a conductive rotating contact element extending from a polishing surface of a pad body which rotates while in contact with the substrate and is in a fluid channel formed in the pad through which an electrolyte is flowing to activate the conductive rotating contact element |
| 08/04/2009 | US7568970 Chemical mechanical polishing pads |
| 07/30/2009 | US20090191797 Polishing apparatus |