Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
11/2009
11/05/2009US20090275268 Method for producing glass substrate for magnetic disk
11/04/2009EP1917123B1 Precision machining apparatus and precision machining method
11/03/2009US7611552 Includes aqueous dispersion solution of fumed silica; efficiently polishing semiconductor device such as wafer at high polishing speed without causing flaw
10/2009
10/29/2009WO2009131892A2 Methods and apparatus for measuring substrate edge thickness during polishing
10/29/2009WO2009131133A1 Polishing agent and method for polishing substrate using the polishing agent
10/29/2009WO2009131106A1 Polyurethane foam and polishing pad
10/29/2009WO2009129765A2 Method and device for working the surface of a hard material
10/29/2009US20090267021 Colloidal silica for semiconductor wafer polishing and production method thereof
10/29/2009US20090267020 Adjuvant for Controlling Polishing Selectivity and Chemical Mechanical Polishing Slurry
10/29/2009DE112007002571T5 Polierkopf und Poliervorrichtung Polishing head and polishing machine
10/28/2009CN201333664Y Lifting device for gear ring in grinder
10/28/2009CN201333663Y Device for mounting hanging wall in grinder
10/28/2009CN201333662Y Speed regulating device of grinder
10/28/2009CN201333661Y Device for controlling soft pressure of upper grinding plate in grinding machine
10/27/2009US7608543 Method for planarizing thin layer of semiconductor device
10/22/2009WO2009128494A1 Polishing solution for cmp and polishing method
10/22/2009WO2009128430A1 Polishing solution for metal films and polishing method using the same
10/22/2009US20090264052 Polishing method and polishing apparatus, and program for controlling polishing apparatus
10/21/2009CN201329543Y Chemical mechanical grinding device
10/21/2009CN101563188A Conditioning tools and techniques for chemical mechanical planarization
10/21/2009CN101560373A Polishing slurry for monox, additive liquid and polishing method
10/21/2009CN100553410C Multilayer wiring board, method for producing multilayer wiring board, polisher for multilayer wiring board and metal sheet for producing wiring board
10/21/2009CN100551626C Polishing pad and method of producing the same
10/21/2009CN100551625C Polishing pad and method of producing the same
10/21/2009CN100551624C Adsorption sheet for fixing polishing substrate and its manufacturing method and polishing device
10/21/2009CN100551623C Pad constructions for chemical mechanical planarization applications
10/20/2009US7604530 Inlaid polishing pad
10/20/2009US7604527 Methods and systems for planarizing workpieces, e.g., microelectronic workpieces
10/20/2009CA2607856C Polishing composition
10/15/2009WO2009126823A2 A polishing system having a track
10/15/2009WO2009089026A3 Composition and method for polishing nickel-phosphorous-coated aluminum hard disks
10/15/2009US20090258580 Aqueous abrasives dispersion medium composition
10/15/2009US20090258574 Polishing system having a track
10/15/2009US20090258493 Semiconductor device manufacturing method
10/15/2009US20090255189 Aluminum oxide particles
10/14/2009EP2108482A1 Flow control system
10/14/2009CN101554711A Micromachining methods and systems
10/14/2009CN100550311C Polishing pad for CMP, method for polishing substrate using it and method for producing polishing pad for CMP
10/14/2009CN100550290C Method for planarizing film of semiconductor device
10/14/2009CN100548577C Substrate polishing method and apparatus
10/14/2009CN100548576C 抛光垫和化学机械抛光方法 Chemical mechanical polishing pad and polishing method
10/13/2009US7601050 Polishing apparatus with grooved subpad
10/08/2009WO2009122472A1 Polishing apparatus and polishing method
10/08/2009US20090253358 Polishing article with integrated window stripe
10/08/2009US20090253355 Cmp abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for cmp abrasive
10/08/2009US20090253353 Polishing pad
10/08/2009US20090253351 Friction sensor for polishing system
10/08/2009US20090250790 Nitride semiconductor wafer and method of processing nitride semiconductor wafer
10/07/2009EP1095734B1 Polishing machine
10/07/2009EP1016133B1 Method of planarizing the upper surface of a semiconductor wafer
10/07/2009CN100547045C 抛光组合物 The polishing composition
10/06/2009US7599165 Palladium-containing particles, method and apparatus of manufacturing palladium-containing devices made therefrom
10/06/2009US7597769 forming a solar cell conductive feature using monodisperse silver or silver alloy fine particles coated with a ceramic or metal; silver particles made in an aerosol stream and coated by vapor deposition
10/06/2009US7597729 edge polishing a semiconductor substrate using a mixture containing imidazole and the imidazole derivative contribute to an improvement of the polishing ability; silica abrasives, tetramethylammonium hydroxide, a water-soluble polymer, a chelating agent, and water, and containing no oxidizing agent
10/06/2009US7597606 Fabrication process of semiconductor device and polishing method
10/01/2009WO2009119485A1 Metal polishing liquid and polishing method using the polishing liquid
10/01/2009WO2009119178A1 Colloidal silica with modified surface and polishing composition for cmp containing the same
10/01/2009US20090247060 Retainer ring used for polishing a structure for manufacturing magnetic head, and polishing method using the same
10/01/2009US20090247057 Polishing platen and polishing apparatus
10/01/2009US20090247054 Method to prevent slurry caking on cmp conditioner
10/01/2009US20090246957 Polishing liquid and polishing method
10/01/2009US20090246956 Metal polishing composition and chemical mechanical polishing method
10/01/2009DE102008016463A1 Verfahren zur Planarisierung einer Halbleiterstruktur Method for planarizing a semiconductor structure
09/2009
09/30/2009EP2105255A1 Wafer and method of producing the same
09/30/2009CN100544892C Stirring mill
09/24/2009US20090239450 Process for producing glass substrate for magnetic disks
09/24/2009US20090239446 Polishing Apparatus and Polishing Method
09/24/2009US20090239380 Polishing liquid for metal and polishing method using the same
09/24/2009US20090239373 Chemical mechanical polishing method and method of manufacturing semiconductor device
09/24/2009DE10229346B4 Verfahren zur Herstellung eines Halbleiterelementes A process for producing a semiconductor element
09/23/2009CN101542690A Aqueous dispersion for chemical mechanical polishing and method of chemical mechanical polishing of semiconductor device
09/23/2009CN101541910A Slurry composition and method for polishing organic polymer-based ophthalmic substrates
09/23/2009CN101541477A Lapping carrier and method
09/23/2009CN101541476A Polishing slurry, method for manufacturing the polishing slurry, nitride crystalline material and method for polishing surface of the nitride crystalline material
09/23/2009CN101537601A Polishing pad
09/23/2009CN101537599A Chemical mechanical polishing method
09/23/2009CN100542748C Polishing pad conditioner and methods of manufacture and recycling
09/23/2009CN100542747C Polished state monitoring apparatus and polishing apparatus using the same
09/23/2009CN100542746C Grinding disk for power driven portable grinding tool
09/22/2009US7591713 Polishing pad, method for processing polishing pad, and method for producing substrate using it
09/22/2009US7591711 Apparatus and method for polishing semiconductor wafers using one or more polishing surfaces
09/22/2009US7591708 Method and apparatus of eddy current monitoring for chemical mechanical polishing
09/22/2009US7591061 Method for securing a subpad to a subpad support
09/17/2009WO2009114413A1 Non-planar cvd diamond-coated cmp pad conditioner and method for manufacturing
09/17/2009WO2009113399A1 Polishing pad
09/17/2009US20090233532 Substrate holding apparatus and polishing apparatus
09/17/2009US20090233525 Method for Detecting Polishing End in CMP Polishing Device, CMP Polishing Device, and Semiconductor Device Manufacturing Method
09/17/2009US20090229189 Method for preparing a polishing slurry having high dispersion stability
09/16/2009EP2100666A1 Method for purifying chemical added with chelating agent
09/16/2009EP2100325A1 Water-based polishing slurry for polishing silicon carbide single crystal substrate, and polishing method for the same
09/16/2009CN101530988A Polishing pad
09/16/2009CN101530983A Polishing state monitoring apparatus and polishing apparatus and method
09/16/2009CN101530982A Grinding clamp for changing wafer orientation
09/16/2009CN100540221C Polishing pad and method of producing the same
09/15/2009US7589023 Method of manufacturing semiconductor wafer
09/15/2009US7588481 Wafer polishing method and polished wafer
09/11/2009WO2009110180A1 Method for manufacturing template and polishing method wherein the template is used
09/10/2009US20090227183 Working Surface, And System And Method For Production Thereof
09/10/2009US20090226697 Polishing sheet and manufacturing method of elastic plastic foam sheet
09/10/2009US20090223136 Polishing compound for semiconductor wafer polishing and polishing method
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