B24B 37 - Lapping machines or devices; Accessories

Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
12/2009
12/17/2009	US20090311808 Method for producing semiconductor wafer
12/17/2009	US20090311522 Wafer polishing method and wafer produced thereby
12/17/2009	DE102004040429B4 Doppelseiten-Poliermaschine Double-side polishing machine
12/16/2009	CN201361820Y Planetary grinding machine
12/16/2009	CN201361819Y Planetary grinding disc
12/16/2009	CN201361816Y Wafer grinding positioning ring
12/16/2009	CN101605629A Surface treatment method for coated cutting insert
12/16/2009	CN100570826C Polishing mat and method of manufacturing semiconductor device
12/16/2009	CN100569448C Polishing pad and method of producing the same
12/15/2009	US7632378 Polishing apparatus
12/15/2009	US7632331 first phase as a disperse metallic phase that is dispersed on a support of the second metal oxides phase; ultrasonic transducers underlying and ultrasonically energizing a reservoir of liquid feed which forms droplets of aerosol
12/15/2009	US7632169 Polishing method and polishing apparatus
12/15/2009	US7631518 Glass powders, methods for producing glass powders and devices fabricated from same
12/10/2009	US20090305615 Carrier for double-side polishing apparatus, double-side polishing apparatus using the same, and double-side polishing method
12/10/2009	US20090305609 Cmp pad identification and layer ratio modeling
12/10/2009	US20090302266 Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, and kit for preparing aqueous dispersion for chemical mechanical polishing
12/10/2009	DE112008000366T5 Ceroxid und Verfahren zu dessen Herstellung Cerium oxide, and process for its preparation
12/10/2009	DE10361636B4 Verfahren und System zum Steuern des chemisch-mechanischen Polierens mittels eines seismischen Signals eines seismischen Sensors A method and system for controlling the chemical mechanical polishing by means of a seismic signal from a seismic sensor
12/09/2009	CN201357371Y Finisher
12/09/2009	CN101600540A Polishing pad and process for production of polishing pad
12/09/2009	CN101597477A Aquo dispersoid, circuit board and manufacture method thereof for chemical mechanical polishing
12/09/2009	CN100567441C Abrasive, method of polishing substrate and process for producing semiconductor device
12/09/2009	CN100566939C Hydrodynamic radial flux tool for polishing and grinding optical and semiconductor surfaces
12/09/2009	CN100566938C Substrate polishing method
12/08/2009	US7628905 Algorithm for real-time process control of electro-polishing
12/03/2009	WO2009146274A1 Semiconductor wafer polishing apparatus and method of polishing
12/03/2009	US20090298396 Method of grinding semiconductor wafers, grinding surface plate, and grinding device
12/03/2009	US20090298395 Apparatus and method for reducing removal forces for cmp pads
12/03/2009	US20090298394 Method of polishing silicon wafer
12/03/2009	US20090298393 Slurry supplying apparatus and method of polishing semiconductor wafer utilizing same
12/03/2009	US20090298392 Polymer material, foam obtained from same, and polishing pad using those
12/03/2009	US20090298389 Surface treating method and apparatus
12/03/2009	US20090298388 Method and apparatus for chemical mechanical polishing of large size wafer with capability of polishing individual die
12/03/2009	US20090298387 Polishing end point detection method
12/03/2009	US20090298290 Polishing liquid and polishing method
12/03/2009	US20090294749 Chemical Mechanical Polishing Slurry Composition for Polishing Phase-Change Memory Device and Method for Polishing Phase-Change Memory Device Using the Same
12/03/2009	DE112007003303T5 Additiv für eine Zusammensetzung zum Polieren An additive for a composition for polishing
12/02/2009	EP2128896A2 Method of polishing silicon wafer
12/02/2009	EP2128894A1 Metal film polishing pad and method for polishing metal film using the same
12/02/2009	EP2128893A1 Aqueous dispersion for chemical mechanical polishing and method of chemical mechanical polishing of semiconductor device
12/02/2009	EP2127810A1 Method and device for grinding both surfaces of semiconductor wafers
12/02/2009	EP2127806A2 Method of grinding semiconductor wafers, grinding surface plate, and grinding device
12/02/2009	CN201353725Y Single-disc grinder dresser
12/02/2009	CN201353724Y Gear part of safety valve grinder
12/02/2009	CN101590624A Chemical mechanical polishing method and polishing device
12/02/2009	CN101590615A Tungsten chemical mechanical polishing method
12/02/2009	CN100565832C Wafer transfer apparatus, polishing apparatus and wafer receiving method
12/02/2009	CN100565813C Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, and kit for preparing aqueous dispersion for chemical mechanical polishing
12/02/2009	CN100563934C Polishing pad and device
12/02/2009	CN100563931C Undulated pad conditioner and method of using same
12/02/2009	CN100563927C Method of surface polishing and element
12/02/2009	CN100563926C Polishing apparatus
12/01/2009	US7625495 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
12/01/2009	US7625420 Small particle size, narrow size distribution, high crystallinity (large crystals) and spherical morphology; protective coatings; composites; alloys; green strength; thick film pastes; microelectronics; multilayer ceramic capacitors; multichip module;industrial scale
12/01/2009	US7625262 A fibrous substrate and a phosphoric acid-modified polymer having a hydroxyl value or 40mg KOH/g toadsorb a colloidal metal; inoexchanging for forming a metal chelate; cleaning/demetallization without changing the pH value; circulation'reuse of slurry; industrial scale
11/2009
11/26/2009	WO2009141961A1 Double-head grinding apparatus and wafer manufacturing method
11/26/2009	US20090291624 Substrate polishing apparatus and method
11/26/2009	US20090291623 Polishing head and polishing apparatus
11/26/2009	US20090291620 Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and chemical mechanical polishing aqueous dispersion preparation kit
11/25/2009	EP2123726A1 Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and chemical mechanical polishing aqueous dispersion preparation kit
11/25/2009	EP2123400A1 Polishing pad and process for production of polishing pad
11/25/2009	EP2121244A2 Methods for machining inorganic, non-metallic workpieces
11/25/2009	CN101588895A Process for producing glass substrate for magnetic disk
11/25/2009	CN101588894A Methods for machining inorganic, non-metallic workpieces
11/25/2009	CN101585164A Polishing apparatus
11/25/2009	CN100562552C CMP slurry for metal film, polishing method and method for manufacturing semiconductor
11/25/2009	CN100562402C Low surface energy cmp pad
11/25/2009	CN100562401C 抛光垫 Polishing pad
11/24/2009	US7622016 Retainer ring of chemical mechanical polishing device
11/24/2009	US7621976 forming a photovoltaic conductive feature; in a flowing aerosol stream, preparing silver-containing particles, then coating with a material other than silver by vapor deposition; disperse silver particles confined in metal or ceramic coatings; uses in electronics and electrochemical cells
11/24/2009	US7621799 Polishing method and polishing device
11/19/2009	WO2009140622A2 Polishing pad with endpoint window and systems and method using the same
11/19/2009	WO2009139401A1 Polishing pad
11/19/2009	WO2009138435A1 An abrasive material, wheel and tool for grinding semiconductor substrates, and method of manufacture of same
11/19/2009	DE112008000110T5 Leistungs-MOSFET mit planarisierter Metallisierung und hoher Dichte Power MOSFET with a planarized metallization and high density
11/18/2009	EP2118226A1 Abrasive articles with nanoparticulate fillers and method for making and using them
11/18/2009	CN201346740Y Wafer grinding positioning ring
11/18/2009	CN201346739Y Grooved fixed ring
11/18/2009	CN101583464A Polishing pad and method for producing the same
11/18/2009	CN101579840A High-precise ball highly-efficient grinding and polishing processing method
11/18/2009	CN101579838A Grinding method, grinding pad and grinding system
11/17/2009	US7618529 Thin cellular polymeric layer overlying a conductive substrate; improved electrical and thermal capabilities and control
11/17/2009	US7618528 Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate
11/12/2009	WO2009137764A2 Cmp pad thickness and profile monitoring system
11/12/2009	WO2009137685A2 Configuring of lapping and polishing machines
11/12/2009	WO2009137305A1 Apparatus and method for polishing semi-conductor dice
11/12/2009	WO2009081357A3 Pick and place tool grinding
11/12/2009	US20090280725 Interpenetrating network for chemical mechanical polishing
11/12/2009	US20090280724 Method for Polishing Semiconductor Layers
11/12/2009	US20090280723 Interpenetrating polymer network structure and polishing pad, and process for producing the same
11/12/2009	US20090280722 Grinding machine and method
11/12/2009	US20090280580 Cmp pad thickness and profile monitoring system
11/11/2009	EP1732732B1 Methods and apparatuses for electrochemical-mechanical polishing
11/11/2009	CN101577219A Method and apparatus for preparing wafer and cured resin composition
11/11/2009	CN101577213A Chemical and mechanical grinding method
11/11/2009	CN100559553C Chemico-mechanical polishing end-point detection method for integrated circuit device
11/10/2009	US7614939 Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
11/10/2009	US7614934 Double-side polishing apparatus
11/10/2009	US7614932 Method and system for endpoint detection
11/05/2009	WO2009133793A1 Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion for chemical mechanical polishing, and method of chemical mechanical polishing

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