| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 01/27/2010 | CN101636247A Polishing pad |
| 01/27/2010 | CN101633152A Tool setter of sharpening grinding wheel of semiconductor wafer |
| 01/27/2010 | CN101633151A Grinding device and locating method thereof |
| 01/27/2010 | CN101633150A Polishing pad and method for forming microstructure thereof |
| 01/26/2010 | US7651761 Polishing layer is closed-cell resin foam, wherein number of closed cells in polishing layer is 200 to 600 per mm2, and average diameter of closed cells is 30 to 60 mu m, wherein resin constituting resin foam consists of polyurethane resin; for polishing silicone wafers, glass or aluminum substrates |
| 01/21/2010 | WO2010009420A1 Polishing pad with floating elements and method of making and using the same |
| 01/21/2010 | WO2010008824A2 Closed-loop control for effective pad conditioning |
| 01/21/2010 | WO2010008430A1 High porosity vitrified superabrasive products and method of preparation |
| 01/21/2010 | US20100016169 Method for polishing tape-shaped substrate for oxide superconductor, oxide superconductor, and base material for oxide superconductor |
| 01/21/2010 | US20100015893 Polishing pad |
| 01/21/2010 | US20100015890 Polishing method, polishing apparatus, and program for controlling polishing apparatus |
| 01/21/2010 | US20100015889 Processing end point detection method, polishing method,and polishing apparatus |
| 01/21/2010 | US20100015806 Cmp polishing slurry, additive liquid for cmp polishing slurry, and substrate-polishing processes using the same |
| 01/21/2010 | DE112008000481T5 Poliervorrichtung Polishing apparatus |
| 01/21/2010 | DE102009031356A1 Benetzungsmittel für Halbleiter, Polierzusammensetzung und sie verwendendes Polierverfahren Wetting agents for semiconductors, the polishing composition and polishing method-use |
| 01/20/2010 | EP2145732A2 A multilayer chemical mechanical polishing pad manufacturing process |
| 01/20/2010 | EP2145731A1 A chemical mechanical polishing pad manufacturing assembly |
| 01/20/2010 | CN201385254Y Loose pulley for grinding quartz crystal wafers |
| 01/20/2010 | CN201385253Y Grinding device of tapered inner bore with major diameter |
| 01/20/2010 | CN101632157A Additive for abrasive composition |
| 01/20/2010 | CN101631645A Incorporation of particulate additives into metal working surfaces |
| 01/20/2010 | CN101628395A Chemical mechanical polishing pad manufacturing assembly |
| 01/20/2010 | CN100582189C Methods for planarization of metal-containing surfaces using halogens and halides salts |
| 01/19/2010 | US7648410 Polishing pad and chemical mechanical polishing apparatus |
| 01/19/2010 | US7648409 Double side polishing method and apparatus |
| 01/14/2010 | WO2010005702A1 Chemical mechanical polishing with multi-zone slurry delivery |
| 01/14/2010 | WO2010005543A2 Method of polishing nickel-phosphorous |
| 01/14/2010 | WO2010005103A1 Polishing composition |
| 01/14/2010 | US20100009612 Polishing pad |
| 01/14/2010 | US20100009611 Method for manufacturing a polishing pad |
| 01/14/2010 | US20100009605 Method of manufacturing semiconductor wafer |
| 01/14/2010 | US20100009599 Apparatus and method for polishing semiconductor wafers using one or more polishing surfaces |
| 01/14/2010 | US20100009538 Silicon nitride polishing liquid and polishing method |
| 01/14/2010 | US20100009537 Method of polishing nickel-phosphorous |
| 01/14/2010 | US20100009155 Semiconductor wafer and production method thereof |
| 01/14/2010 | US20100006982 Method of producing semiconductor wafer |
| 01/14/2010 | US20100006428 Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate |
| 01/14/2010 | DE10147761B4 Verfahren zum Herstellen von Siliciumwafern A method for producing silicon wafers |
| 01/13/2010 | EP1570512B1 Slurry composition for secondary polishing of silicon wafer |
| 01/13/2010 | EP1542266B1 Semiconductor abrasive, process for producing the same and method of polishing |
| 01/13/2010 | CN201380431Y Grinding disc of plane grinding machine |
| 01/13/2010 | CN201380430Y Double grinding disc of plane grinding machine |
| 01/13/2010 | CN100580885C Polishing pad, polishing apparatus, protection film for the polishing apparatus and polishing method |
| 01/13/2010 | CN100579727C Polishing pad and its production method |
| 01/12/2010 | US7645702 Manufacturing method of silicon wafer |
| 01/12/2010 | US7645185 Substrate delivery mechanism |
| 01/12/2010 | US7645182 Apparatus and method for lapping slider using floating lapping head |
| 01/12/2010 | US7645181 Polishing state monitoring apparatus and polishing apparatus |
| 01/07/2010 | WO2010001743A1 Method of polishing glass substrate and process for producing glass substrate |
| 01/07/2010 | WO2010001028A1 Germanium layer polishing |
| 01/07/2010 | US20100003896 Polishing pad |
| 01/07/2010 | US20100003821 Wetting agent for semiconductors, and polishing composition and polishing method employing it |
| 01/07/2010 | US20100000877 with a polishing pad having thin cellular polymeric layer overlying a metal or alloy conductive substrate; improved electrical and thermal capabilities and control; porosity |
| 01/07/2010 | DE112008000396T5 Endpolierverfahren für Einkristall-Siliziumwafer und Einkristall-Siliziumwafer Endpolierverfahren for single crystal silicon wafers and single-crystal silicon wafer |
| 01/06/2010 | EP2141737A1 Polishing apparatus and program for the same |
| 01/06/2010 | CN101618520A Substrate supporting unit and single type substrate polishing apparatus using the same |
| 01/06/2010 | CN100578740C Abrasive for semiconductor integrated circuit device, grinding method and manufacturing method for semiconductor integrated circuit device |
| 01/06/2010 | CN100577407C Working surface and system for production thereof |
| 01/06/2010 | CN100577361C Method and device for controlling chemical mechanical polishing pad speed to improve pad life |
| 01/06/2010 | CN100577360C Abrasive cloth and method for preparing nano-fiber structure |
| 01/06/2010 | CN100577357C Abrasive articles and methods for manufacturing same |
| 01/05/2010 | US7641540 Polishing pad and cushion layer for polishing pad |
| 01/05/2010 | US7641169 Substrate for a stamper |
| 12/31/2009 | US20090325469 Substrate supporting unit and single type substrate polishing apparatus using the same |
| 12/31/2009 | US20090325383 Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method for semiconductor device |
| 12/31/2009 | US20090325323 Aqueous dispersion for chemical mechanical polishing, production method thereof, and chemical mechanical polishing method |
| 12/31/2009 | DE102008029931A1 Surface treatment device, especially for lapping/polishing semiconductors, uses tool having carrier /support plate with work-plate fixed on carrier/support plate |
| 12/30/2009 | WO2009158665A1 Polishing pad with porous elements and method of making and using the same |
| 12/30/2009 | WO2009158507A2 Chemical mechanical planarization pad conditioner and method of forming |
| 12/30/2009 | WO2009157306A1 Apparatus for polishing both sides of glass substrate for magnetic disk, polishing method, and production process |
| 12/30/2009 | WO2009157137A1 Method of producing abrasive head and abrasive apparatus |
| 12/30/2009 | EP2136964A2 Methods of removing defects in surfaces |
| 12/30/2009 | CN101616773A Process for producing polyurethane foam |
| 12/30/2009 | CN101612719A Polishing apparatus and polishing method |
| 12/30/2009 | CN100576432C Smart conditioner rinse station |
| 12/30/2009 | CN100575000C Method of forming a layered polishing pad |
| 12/30/2009 | CN100574997C Fault alarming device and fault alarm method |
| 12/30/2009 | CN100574996C Method for automatically adjusting silicon wafer grinding pressure of chemical-mechanical polisher |
| 12/29/2009 | US7637270 Method of washing a polished object |
| 12/24/2009 | US20090318060 Closed-loop control for effective pad conditioning |
| 12/24/2009 | US20090318059 Improved grinder/polisher |
| 12/24/2009 | DE102009024726A1 Verfahren zum Herstellen eines Halbleiter-Wafers A method of manufacturing a semiconductor wafer |
| 12/24/2009 | DE10057998B4 Poliergerät und Polierverfahren Polishing apparatus and polishing method |
| 12/23/2009 | WO2009155137A2 Improved grinder/polisher |
| 12/23/2009 | WO2009154164A1 Polishing composition and polishing method using the same |
| 12/23/2009 | EP2135707A1 Cushion for polishing pad and polishing pad using the cushion |
| 12/23/2009 | CN101611476A Metal polishing liquid and polishing method |
| 12/23/2009 | CN101607381A Chemical mechanical polishing (CMP) head, apparatus, and method and planarized semiconductor wafer produced thereby |
| 12/23/2009 | CN100571981C Methods and tool for maintenance of hard surfaces, and a method for manufacturing such a tool |
| 12/22/2009 | US7635292 Substrate holding device and polishing apparatus |
| 12/17/2009 | WO2009152008A2 Cmp pad identification and layer ratio modeling |
| 12/17/2009 | WO2009151120A1 Aluminum oxide particle and polishing composition containing the same |
| 12/17/2009 | WO2009150938A1 Polishing agent for synthetic quartz glass substrate |
| 12/17/2009 | WO2009129765A3 Method and device for working the surface of a hard material |
| 12/17/2009 | US20090311949 Method for producing semiconductor wafer |
| 12/17/2009 | US20090311948 Method for producing semiconductor wafer |
| 12/17/2009 | US20090311947 Polishing Composition for Silicon Wafer and Polishing Method of Silicon Wafer |
| 12/17/2009 | US20090311864 Polishing slurry |
| 12/17/2009 | US20090311863 Method for producing semiconductor wafer |
| 12/17/2009 | US20090311862 Method for manufacturing a semiconductor wafer |