| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
|---|
| 03/16/2010 | US7677959 Multilayer polishing pad and method of making |
| 03/16/2010 | US7677958 Retaining ring with flange for chemical mechanical polishing |
| 03/16/2010 | US7677957 Polishing apparatus, method for providing and mounting a polishing pad in a polishing apparatus, and method for producing a substrate using the polishing apparatus |
| 03/16/2010 | US7677956 Compositions and methods for dielectric CMP |
| 03/11/2010 | WO2010026792A1 Glass polishing material slurry |
| 03/11/2010 | WO2009063457A3 Improved multiple-phase surfaces, and method therefor |
| 03/11/2010 | US20100062691 Substrate holding mechanism, substrate polishing apparatus and substrate polishing method |
| 03/11/2010 | US20100062684 Polishing system with in-line and in-situ metrology |
| 03/11/2010 | US20100058671 Cerium oxide and method for producing the same |
| 03/10/2010 | EP2161737A1 Polishing composition and method for manufacturing semiconductor integrated circuit device |
| 03/10/2010 | CN201419358Y Slurry filter for double-side grooved grinding machine |
| 03/10/2010 | CN201419354Y Planet wafer for processing thin-type single crystal silicon wafer |
| 03/10/2010 | CN101669195A Polishing pad manufacturing method |
| 03/10/2010 | CN101664899A Chemical mechanical polishing method |
| 03/09/2010 | US7675634 Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus |
| 03/09/2010 | US7674154 Apparatus and method for polishing objects using object cleaners |
| 03/04/2010 | WO2010024404A1 Abrasive composition and method for manufacturing semiconductor integrated circuit device |
| 03/04/2010 | WO2010023829A1 Polishing head and polishing apparatus |
| 03/04/2010 | US20100056026 Polishing liquid composition |
| 03/04/2010 | US20100055909 Semiconductor polishing compound, process for its production and polishing method |
| 03/04/2010 | US20100055908 Method for producing a semiconductor wafer |
| 03/03/2010 | EP1205280B1 Wafer polishing method and wafer polishing device |
| 03/03/2010 | CN101663739A Polishing apparatus and program for the same |
| 03/03/2010 | CN101663132A Process for manufacturing polishing pad |
| 03/03/2010 | CN101659036A Polishing pad and manufacturing method thereof |
| 03/03/2010 | CN101659035A Polishing pad and manufacturing method thereof |
| 03/03/2010 | CN101659034A Method for performing chemical-mechanical polishing (cmp) |
| 03/03/2010 | CN101659033A 磨轮 Wheels |
| 03/03/2010 | CN101659032A Grinding device |
| 03/03/2010 | CN101659027A Method for producing a semiconductor wafer |
| 03/02/2010 | US7670942 Method of fabricating self-aligned contact pad using chemical mechanical polishing process |
| 03/02/2010 | US7670473 integrated circuits; semiconductors |
| 03/02/2010 | US7670466 Methods and apparatuses for electrochemical-mechanical polishing |
| 03/02/2010 | US7670206 Substrate polishing apparatus and substrate polishing method |
| 02/25/2010 | WO2010021297A1 Method and apparatus for polishing a substrate |
| 02/25/2010 | WO2010021086A1 Carrier for dual-surface polishing device, and dual-surface polishing device and dual-surface polishing method using the same |
| 02/25/2010 | WO2009140622A3 Polishing pad with endpoint window and systems and method using the same |
| 02/25/2010 | WO2009137764A3 Cmp pad thickness and profile monitoring system |
| 02/25/2010 | WO2009137685A3 Configuring of lapping and polishing machines |
| 02/25/2010 | WO2008084481A3 Tribological surface and lapping method and system therefor |
| 02/25/2010 | US20100048375 Method for polishing glass substrate and process for producing glass substrate |
| 02/25/2010 | US20100048105 Lapping Carrier and Method |
| 02/25/2010 | US20100048102 Polishing pad |
| 02/25/2010 | US20100048100 Method and system for endpoint detection |
| 02/25/2010 | US20100048007 High planarizing method for use in a gate last process |
| 02/25/2010 | DE10261306B4 Haltering mit reduzierter Abnutzungs- und Kontaminationsrate für einen Polierkopf einer CMP-Anlage und Polierkopf und CMP-Vorrichtung mit Haltering Retaining ring for minimal wear and contamination rate for a polishing head of a CMP-conditioning and polishing head and CMP apparatus with retaining ring |
| 02/24/2010 | EP2157052A2 Method for producing boehmite particles and method for producing alumina particles |
| 02/24/2010 | EP2156926A1 Method of polishing glass substrate |
| 02/24/2010 | EP2155435A1 Method of polishing glass substrate |
| 02/24/2010 | EP2155434A1 Stacked polishing pad for high temperature applications |
| 02/24/2010 | CN101654269A Method for producing boehmite particles and method for producing alumina particles |
| 02/24/2010 | CN100592474C Grinding pad and method of producing the same |
| 02/24/2010 | CN100591483C Multi-layer polishing pad material for CMP |
| 02/24/2010 | CN100591482C Method for determining abrasive time in chemical mechanical polishing process |
| 02/24/2010 | CN100591480C Polishing apparatus |
| 02/23/2010 | US7666063 Rough polishing method of semiconductor wafer and polishing apparatus of semiconductor wafer |
| 02/23/2010 | US7666061 Method for conditioning processing pads |
| 02/18/2010 | WO2010019264A2 Chemical mechanical polisher having movable slurry dispensers and method |
| 02/18/2010 | US20100041323 Cmp retaining ring |
| 02/18/2010 | US20100041317 Workpiece processing method |
| 02/18/2010 | US20100040536 Method for producing boehmite particles and method for producing alumina particles |
| 02/18/2010 | DE10226235B4 Verfahren zum Erhöhen der Abtragrate von Oxid unter Verwendung eines fixierten Schleifmittels A method for increasing the removal rate of oxide by using a fixed abrasive |
| 02/17/2010 | CN201405264Y Device for cleaning grooves on slotting lapping machine |
| 02/17/2010 | CN201405261Y grinding machine for polishing |
| 02/17/2010 | CN201405260Y Chemical-mechanical abrasive burnishing head pressure ring mounting device |
| 02/17/2010 | CN101649182A Cerium oxide abrasive and method of polishing substrates |
| 02/17/2010 | CN101648362A Crank pin end pore finishing process |
| 02/17/2010 | CN100589934C Transparent microporous materials for CMP |
| 02/16/2010 | US7662239 Low surface roughness and high yield obtained by pasting gallium nitride as-grown wafers on a polishing plate with notches facing forward, backward, or inward, with thermoplastic wax having a thickness of < 10 mu m , grinding,lapping, polishing into mirror wafers and beveling |
| 02/16/2010 | US7662025 Polishing apparatus including separate retainer rings |
| 02/16/2010 | US7662022 Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting |
| 02/11/2010 | WO2010016510A1 Method for manufacturing a semiconductor wafer |
| 02/11/2010 | WO2010016486A1 Polishing pad and method for manufacturing the polishing pad |
| 02/11/2010 | WO2010016390A1 Polishing solution for cmp, and method for polishing substrate using the polishing solution for cmp |
| 02/11/2010 | US20100035526 Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion |
| 02/11/2010 | US20100035523 Semiconductor device fabricating method, and semiconductor fabricating device |
| 02/11/2010 | US20100035521 Metal film polishing pad and method for polishing metal film using the same |
| 02/11/2010 | US20100035438 Method for manufacturing semiconductor device, and polishing apparatus |
| 02/11/2010 | US20100035367 Film thickness prediction method, layout design method, mask pattern design method of exposure mask, and fabrication method of semiconductor integrated circuit |
| 02/11/2010 | DE10333810B4 Verfahren zum Bearbeiten eines Halbleiterwafers einschließlich Schleifen der Rückseite A method of processing a semiconductor wafer including grinding the back |
| 02/10/2010 | EP2151299A2 Chemical mechanical polishing pad |
| 02/10/2010 | CN101645398A Method for manufacturing semiconductor device, and polishing apparatus |
| 02/10/2010 | CN100588698C Cerium oxide abrasive and slurry containing the same |
| 02/04/2010 | WO2010013390A1 Wafer polishing method and double side polishing apparatus |
| 02/04/2010 | US20100029185 Polishing pad and a method for manufacturing the same |
| 02/04/2010 | US20100029182 Polishing pad |
| 02/04/2010 | US20100029177 Polishing apparatus and polishing method |
| 02/04/2010 | US20100025623 Additive for polishing composition |
| 02/03/2010 | CN101641184A Methods of removing defects in surfaces |
| 02/03/2010 | CN101638556A Polishing composition and polishing method |
| 02/03/2010 | CN101637884A Method for grinding through-silicon vias wafer and grinding component used by same |
| 02/03/2010 | CN100587918C Grinding agent for silicon oxide, added liquid, and grinding method |
| 02/02/2010 | US7655565 Electroprocessing profile control |
| 02/02/2010 | US7655559 Post-CMP treating liquid and manufacturing method of semiconductor device using the same |
| 02/02/2010 | US7654887 Vacuum chuck and suction board |
| 02/02/2010 | US7654885 Multi-layer polishing pad |
| 02/02/2010 | US7654883 Polishing apparatus, polishing head and polishing method |
| 01/28/2010 | WO2009131892A3 Methods and apparatus for measuring substrate edge thickness during polishing |
| 01/28/2010 | WO2009126823A3 A polishing system having a track |
| 01/27/2010 | CN101636248A Polishing pad |