Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
05/2010
05/05/2010CN1550288B Abrasive pad, method and metal mold for manufacturing the same, and semiconductor wafer polishing method
05/04/2010US7709382 Electroprocessing profile control
05/04/2010US7708900 Chemical mechanical polishing slurry compositions, methods of preparing the same and methods of using the same
05/04/2010US7708854 Work carrier and method of processing a workpiece
05/04/2010US7708788 Cerium oxide abrasive and method of polishing substrates
05/04/2010US7708622 Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces
05/04/2010US7708618 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
04/2010
04/29/2010WO2010047520A1 Polisher, pressure plate of the polisher and method of polishing
04/29/2010WO2010047314A1 Composition for polishing silicon nitride and method for controlling selectivity using same
04/29/2010WO2010005543A3 Method of polishing nickel-phosphorous
04/29/2010US20100104806 Method for polishing both sides of a semiconductor wafer
04/29/2010DE102009038942A1 Vorrichtung zur beidseitigen Bearbeitung von flachen Werkstücken sowie Verfahren zur gleichzeitigen beidseitigen Material abtragenden Bearbeitung mehrerer Halbleiterscheiben Apparatus for two-sided machining flat workpieces and method for simultaneous two-sided material removing machining plurality of semiconductor wafers
04/28/2010EP1447841B1 Method of machining semiconductor wafer-use polishing pad and semiconductor wafer-use polishing pad
04/28/2010CN1791491B 基片抛光设备 Substrate polishing equipment
04/27/2010US7704122 Customized polish pads for chemical mechanical planarization
04/27/2010US7703193 Methods and apparatus for controlling the lapping of a slider based on an amplitude of a readback signal produced from an externally applied magnetic field
04/22/2010US20100099340 Textured platen
04/22/2010US20100099337 Device For The Double-Sided Processing Of Flat Workpieces and Method For The Simultaneous Double-Sided Material Removal Processing Of A Plurality Of Semiconductor Wafers
04/22/2010US20100099333 Method and apparatus for determining shear force between the wafer head and polishing pad in chemical mechanical polishing
04/22/2010US20100099259 Polishing composition and method for manufacturing semiconductor integrated circuit device
04/22/2010DE102009041386A1 Verfahren und Vorrichtung zum Läppen von Oberflächen Method and apparatus for lapping surfaces
04/22/2010DE102008049972A1 Verfahren zum Messen der Dicke von in einer Bearbeitungsmaschine bearbeiteten scheibenförmigen Werkstücken A method for measuring the thickness of machined in a machine tool disc-shaped workpieces
04/21/2010EP2177315A1 Chemical mechanical polishing pad having sealed window
04/21/2010EP2177313A1 A Chemical Mechanical Polishing Pad Having Integral Identification Feature
04/21/2010EP2177312A1 A chemical mechanical polishing pad having window with integral identification feature
04/21/2010EP1667816B1 Polishing pad with recessed window
04/21/2010CN201439182U 化学机械研磨装置 The chemical mechanical polishing apparatus
04/21/2010CN101695826A Grinder for charging roller of full-automatic printer
04/21/2010CN101327577B Fixed abrasive polishing pad with self-finishing function and even wear
04/20/2010US7699901 Alumina-film-polishing composition and chemical mechanical polishing method using the same
04/20/2010US7699684 CMP porous pad with component-filled pores
04/15/2010US20100093585 Post-cmp treating liquid and manufacturing method of semiconductor device using the same
04/15/2010US20100092366 Water-based polishing slurry for polishing silicon carbide single crystal substrate, and polishing method for the same
04/15/2010US20100090314 Final polishing method for silicon single crystal wafer and silicon single crystal wafer
04/15/2010US20100090159 Semiconductor polishing composition
04/14/2010CN201437215U 研磨机 Grinder
04/14/2010CN101693354A Substrate polishing apparatus
04/13/2010US7698012 Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
04/13/2010US7696273 Method for improving mechanical properties of polymer particles and its applications
04/13/2010US7695637 Slurry composition for chemical mechanical polishing and precursor composition thereof
04/13/2010US7695347 Method and pad for polishing wafer
04/13/2010US7695345 Polishing compound for semiconductor integrated circuit device, polishing method and method for producing semiconductor integrated circuit device
04/08/2010WO2010038725A1 Urethane resin composition for polishing pad, polyurethane polishing pad, and method for producing polyurethane polishing pad
04/08/2010WO2010038724A1 Two liquid-type urethane resin composition for polishing pad, polyurethane polishing pad obtained using the same, and method for producing polyurethane polishing pad
04/08/2010WO2010038706A1 Polishing liquid and polishing method
04/08/2010WO2010038646A1 Apparatus for polishing spherical body, method for polishing spherical body and method for manufacturing spherical member
04/08/2010WO2010038617A1 Polishing slurry, process for producing same, method of polishing, and process for producing glass substrate for magnetic disk
04/08/2010WO2010038503A1 Cerium oxide and process for producing the same
04/08/2010WO2010038407A1 Silicon carbide single crystal substrate
04/08/2010WO2010037527A1 Apparatus and method for processing a stent
04/08/2010WO2010037469A1 Method for measuring the thickness of disc-shaped work pieces machined in a machine tool
04/08/2010WO2010037452A1 Method for measuring the thickness of a discoidal workpiece
04/08/2010US20100087128 Polishing pad, and method for manufacturing polishing pad
04/08/2010US20100086864 Method of polishing glass substrate
04/08/2010US20100084373 Method for manufacturing perpendicular magnetic recording medium
04/07/2010CN201436147U Wafer grinding and cutting protection structure
04/06/2010US7691279 Method of producing a glass substrate for a mask blank and method of producing a mask blank
04/01/2010WO2010035404A1 Chemical mechanical polishing apparatus, chemical mechanical polishing method, and control program
04/01/2010WO2009158507A3 Chemical mechanical planarization pad conditioner and method of forming
04/01/2010DE10195941B4 Halbleiter-Bearbeitungsverfahren zum Entfernen leitfähigen Materials Semiconductor processing method of removing conductive material
03/2010
03/31/2010EP2169710A1 Metal film polishing liquid and polishing method
03/31/2010EP2168721A1 Apparatus and method for processing a stent
03/31/2010EP2167278A1 Scratch removal device and method
03/31/2010CN101689494A Polishing liquid for metal film and polishing method
03/31/2010CN101689493A Polishing composition and method for manufacturing semiconductor integrated circuit device
03/31/2010CN101687307A Stacked polishing pad for high temperature applications
03/31/2010CN101683723A Dead halt alarm method for CMP equipment and apparatus therefor
03/30/2010US7687393 Polishing composition and rinse composition
03/30/2010US7686673 Working shape prediction method, working requirement determination method, working method, working system, method of manufacturing semiconductor device, computer program, and computer program storage medium
03/25/2010WO2010032715A1 Polishing pad
03/25/2010WO2010008824A3 Closed-loop control for effective pad conditioning
03/25/2010WO2009155137A3 Improved grinder/polisher
03/25/2010WO2009152008A3 Cmp pad identification and layer ratio modeling
03/25/2010US20100076588 Polishing apparatus and polishing method
03/25/2010US20100075577 Method of polishing glass substrate
03/25/2010US20100075576 Polishing state monitoring apparatus and polishing apparatus and method
03/25/2010US20100075501 Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
03/25/2010US20100075500 Metal polishing slurry and chemical mechanical polishing method
03/25/2010US20100072418 Polishing slurry
03/25/2010DE102008044646A1 Verfahren zur Herstellung einer Halbleiterscheibe A process for producing a semiconductor wafer
03/25/2010DE102007035266B4 Verfahren zum Polieren eines Substrates aus Silicium oder einer Legierung aus Silicium und Germanium A method for polishing a substrate of silicon or an alloy of silicon and germanium
03/24/2010CN201427275Y Weight for reduction of semiconductor wafer wear
03/24/2010CN101681825A Metal film polishing pad and method for polishing metal film using the same
03/24/2010CN101678529A Methods and apparatus for polishing a semiconductor wafer
03/24/2010CN101678528A Process for producing glass substrate for magnetic disk
03/24/2010CN101678527A Cushion for polishing pad and polishing pad using the cushion
03/24/2010CN101677055A Wafer grinding process
03/24/2010CN101676235A Heat-resistant roll, production method thereof, and method of producing sheet glass using heat-resistant roll
03/24/2010CN100595892C 研磨组合物 Polishing composition
03/24/2010CN100595035C Method of surface treatment, crystal substrate, and semiconductor device
03/23/2010US7682976 Methods of forming a phase-change material layer pattern, methods of manufacturing a phase-change memory device and related slurry compositions
03/23/2010US7682225 Polishing apparatus and substrate processing apparatus
03/23/2010US7682221 Integrated endpoint detection system with optical and eddy current monitoring
03/18/2010US20100068974 Abrasive particles having a unique morphology
03/17/2010EP2164095A1 Cerium oxide abrasive and method of polishing substrates
03/17/2010CN101675138A Cmp compositions containing a soluble peroxometalate complex and methods of use thereof
03/17/2010CN101674919A Polishing tool and polishing device
03/17/2010CN101673668A Method for polishing gallium nitride crystals
03/17/2010CN101670547A Polishing apparatus and method for separating a substrate from a substrate holding part
03/16/2010US7678245 Method and apparatus for electrochemical mechanical processing
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