Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
06/2010
06/08/2010US7731566 Substrate polishing metrology using interference signals
06/03/2010WO2010061828A1 Mask blank substrate
06/03/2010US20100136886 Polishing apparatus and substrate processing apparatus
06/03/2010US20100136884 Substrate polishing apparatus and method of polishing substrate using the same
06/03/2010US20100136372 Glass substrate for magnetic disk and method for producing the same
06/02/2010EP2191936A2 Retaining ring with convex bottom surface
06/02/2010EP1512168B1 Subpad having robust, sealed edges
06/02/2010DE10314212B4 Verfahren zur Herstellung eines Maskenrohlings, Verfahren zur Herstellung einer Transfermaske A method of producing a mask blank, method of manufacturing a transfer mask
06/02/2010CN201493751U Improved grinding upper disc
06/02/2010CN1914004B Multi-step pad conditioning method for chemical planarization
06/02/2010CN1796482B Composition for selectively polishing silicon nitride layer and polishing method employing it
06/02/2010CN101716745A Device and method for polishing sapphire substrate material by ultrasound assisted chemical machinery
06/02/2010CN101716744A Board surface leveling method of loop-free blind hole high-density interconnection printing circuit board
06/02/2010CN101148031B Polishing pad and method of producing the same
06/01/2010US7727630 nickel powder batches include particles having a small particle size, narrow size distribution and a spherical morphology, encapulated by a metal oxide selected from ZrO2, SiO2, b2O3, TiO2, Cu2O, CuO, Bi2o3, V2O5 and Al2O3
06/01/2010US7727053 Double-side polishing method for wafer
06/01/2010US7727049 Friction sensor for polishing system
05/2010
05/27/2010US20100130111 Double side polishing method and apparatus
05/27/2010US20100130105 Substrate supporting unit, and apparatus and method for polishing substrate using the same
05/27/2010US20100130103 Polishing apparatus and program thereof
05/27/2010DE102008058638A1 Verfahren zum Betreiben einer Doppelseitenschleifmaschine sowie Doppelseitenschleifmaschine Method for operating a double side grinding and double side grinding
05/26/2010EP2189240A1 Method for operating a double sided grinding machine and double sided grinding machine
05/26/2010EP1694464B1 Retaining ring with shaped surface
05/26/2010EP1305139B1 Fluid dispensing fixed abrasive polishing pad
05/26/2010CN201483382U Grinding pad and grinding device
05/26/2010CN201483369U Polishing liquid transmitting device
05/26/2010CN201483366U Controller of numerical-control precise grinding and polishing machine
05/26/2010CN201483359U Chemical mechanical grinding equipment
05/26/2010CN201483358U Mechanical arm used for polishing pad adjusting device
05/26/2010CN201483357U Mirror surface grinding disk
05/26/2010CN201483356U Main shaft structure grinder wheelhead
05/26/2010CN201483355U Ring grinder
05/26/2010CN201483354U Grinding pan of vertical grinding machine
05/26/2010CN1890055B Chemical mechanical polishing method for reducing slurry reflux
05/26/2010CN1781668B Apparatus for forming a striation reduced chemical mechanical polishing pad
05/26/2010CN101712136A Automatic valve flashboard lapping machine
05/26/2010CN101346804B Polishing composition, polishing method, and method for forming copper wiring for semiconductor integrated circuit
05/26/2010CN101263583B Polishing compound, polishing device, and semiconductor integrated circuit device
05/26/2010CN101253022B Polishing pad
05/26/2010CN101037585B Polishing fluid and polishing method
05/25/2010US7725208 Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
05/25/2010US7722692 fluorination; high removal rate, less generation of scratches, high-precision polished surface with small surface roughness, and safe, simple and low-cost production; optical lens, hard disk, display panel, filter for cutting off specific frequency, or photomask
05/25/2010US7722439 Semiconductor device manufacturing apparatus and method
05/25/2010US7722436 Run-to-run control of backside pressure for CMP radial uniformity optimization based on center-to-edge model
05/25/2010US7722434 Apparatus for measurement of parameters in process equipment
05/20/2010WO2010019264A3 Chemical mechanical polisher having movable slurry dispensers and method
05/20/2010US20100124817 Method of fabricating self-aligned contact pad using chemical mechanical polishing process
05/19/2010CN201471296U Polishing pad dresser
05/19/2010CN201471289U Hole sealing surface grinding tool
05/19/2010CN201471288U Abrasive wheel grinding machine
05/19/2010CN201471287U Mirror face grinding machine
05/19/2010CN201471286U Numerical control precision grinding polishing machine
05/19/2010CN201471285U Grinding device for conducting roller
05/19/2010CN101708592A Base disc used for suspension polishing
05/19/2010CN101708591A Side axial optical fiber grinder
05/19/2010CN101352834B Grinding pad collating unit and grinding pad collating method
05/19/2010CN101232968B Self-contained conditioning abrasive article, method and polishing system
05/19/2010CN101184582B Polishing pad and its manufacture method, a polishing device and polishing method
05/19/2010CN101180158B Polishing pad
05/18/2010US7720562 Polishing method and polishing apparatus
05/18/2010US7718535 Slurry compositions and CMP methods using the same
05/18/2010US7718534 Planarization of a heteroepitaxial layer
05/18/2010US7718102 forming high density open-cell microstructures in a fast and efficient manner; formed by mixing polyurethanes, surfactants, foaming and curing agents, then pouring into molds; specific gravity
05/18/2010US7717769 Manufacture of lapping board
05/18/2010US7717768 Wafer polishing apparatus and method for polishing wafers
05/14/2010WO2010053804A2 Endpoint control of multiple-wafer chemical mechanical polishing
05/14/2010WO2010053206A1 Polishing agent composition and method for polishing magnetic disc substrate
05/14/2010WO2010053096A1 Polishing liquid composition for magnetic disk substrate
05/14/2010WO2010052990A1 Abrasive, polishing method, method for manufacturing semiconductor integrated circuit device
05/14/2010WO2010052983A1 Abrasive composition and method for manufacturing semiconductor integrated circuit device
05/14/2010WO2010052945A1 Aspherical silica sol, process for producing the same, and composition for polishing
05/13/2010US20100120343 Cushion for polishing pad and polishing pad using the cushion
05/13/2010US20100120336 Polishing method and polishing apparatus
05/13/2010US20100120249 Process for producing polyurethane foam
05/13/2010US20100116685 Methods and apparatuses for electrochemical-mechanical polishing
05/12/2010EP2184770A1 Polishing apparatus
05/12/2010EP2184131A1 Method for lapping, grinding, honing and polishing seal surfaces on inner diameter of semi-blind cavity in valve body
05/12/2010EP2183333A2 Compositions and methods for chemical-mechanical polishing of phase change materials
05/12/2010CN201455802U Special jig for abrading gauge block
05/12/2010CN201455801U Rotary swinging device of high-precision small spherical grinder
05/12/2010CN201455800U High-efficiency grinding device for dual autorotation V-shaped grooves of high-precision ball
05/12/2010CN1954967B Lapping pad and its manufacturing method
05/12/2010CN1792553B Finishing Apparatus of polishing pat and finishing method
05/12/2010CN1670114B Grinding abrasive grains, abrasive, abrasive solution, abrasive solution preparation method, grinding method, and semiconductor device fabrication method
05/12/2010CN1653594B Apparatus, system and method to reduce wafer warpage
05/12/2010CN101704218A Silicon slice positioning and loading device of chemical mechanical polishing equipment
05/12/2010CN101704174A Light scraping method of main bearing black golden tile of ball mill
05/11/2010US7714572 Method of detecting characteristics of films using eddy current
05/11/2010US7712204 Manufacturing method of a thin-film magnetic head
05/06/2010WO2010008824A4 Closed-loop control for effective pad conditioning
05/06/2010US20100112914 Retaining ring with tapered inner surface
05/06/2010US20100112911 Method and device for the injection of cmp slurry
05/06/2010US20100112901 Substrate polishing apparatus and substrate polishing method
05/06/2010DE10139086B4 Verfahren zum Trennen eines plattenartigen Werkstückes, welches durch Adsorption an einem elastischen Adsorptionskissen gehalten wird A method of separating a plate-like workpiece which is held by adsorption on a sorbent elastic
05/05/2010EP2180977A1 Retaining ring with shaped profile
05/05/2010EP1138071B1 A method and system for polishing semiconductor wafers
05/05/2010CN201446490U Ceramic ferrule outer-circle polishing machine for optical fiber connectors
05/05/2010CN1782013B Polishing composition for a semiconductor substrate
05/05/2010CN1781971B Polishing composition
05/05/2010CN1646650B Free radical-forming activator attached to solid and used to enhance CMP formulations
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