| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 07/22/2010 | US20100184359 Method for fabricating semiconductor device |
| 07/22/2010 | US20100180513 Method for improving mechanical properties of polymer particles and its applications |
| 07/22/2010 | DE102009056864A1 Method for treating surface of bearing of motor vehicle, involves arranging abrasive elements between contact surface of tool and surface of component, and selecting material on basis of value for surface energy |
| 07/21/2010 | EP1124912B1 A chemical mechanical polishing slurry system having an activator solution |
| 07/21/2010 | CN1810911B Cerium family raw grinding material and preparing process thereof, cerium family grinding material and preparing process thereof |
| 07/21/2010 | CN101508094B Bevel gear driven four-position plane grinding device |
| 07/20/2010 | US7757383 System for lapping a head having an electrical lapping guide (ELG) on a wafer |
| 07/20/2010 | US7757363 Support system for semiconductor wafers |
| 07/15/2010 | WO2010081084A2 Polishing pads for chemical mechanical planarization and/or other polishing methods |
| 07/15/2010 | US20100178765 Metal Polishing Slurry and Method of Polishing a Film to be Polished |
| 07/14/2010 | CN201526381U Internal combustion engine cylinder pore structure and processing tool |
| 07/14/2010 | CN201524951U Polishing table temperature control device for chemical mechanical polishing equipment |
| 07/14/2010 | CN1701136B Low-force electrochemical mechanical processing method and apparatus |
| 07/14/2010 | CN101778701A 抛光垫 Polishing pad |
| 07/14/2010 | CN101778697A Retaining ring with shaped profile |
| 07/14/2010 | CN101774146A Miniature non-spherical element grinding and polishing device |
| 07/14/2010 | CN101318309B CMP systems and methods utilizing amine-contained polymer |
| 07/13/2010 | US7754118 polishing layer comprising polymeric matrix, liquid non-water soluble microelements embedded in hydrophilic polymeric matrix, and pores defined by embedded liquid non-water soluble microelements on its surface; polishing operation can be performed at high precision. |
| 07/13/2010 | US7753974 Polishing composition for semiconductor wafer, method for production thereof and polishing method |
| 07/13/2010 | US7753761 Wafer polishing apparatus and wafer polishing method |
| 07/08/2010 | WO2010078312A1 Coated carrier for lapping and methods of making and using |
| 07/08/2010 | DE102009046750A1 Elektrochemisches Einebnungssystem mit verbesserter Elektrolytströmung Electrochemical Einebnungssystem with improved electrolyte flow |
| 07/07/2010 | EP2204261A2 High-rate groove pattern |
| 07/07/2010 | EP1724819B1 Polishing agent and polishing method |
| 07/07/2010 | CN201519904U Chip stripping device |
| 07/07/2010 | CN101767315A Method for prolonging service life of chemical mechanical polishing dresser |
| 07/07/2010 | CN101767311A Machine tool |
| 07/06/2010 | US7751911 Failure alarm device and failure alarm method |
| 07/06/2010 | US7749599 Cushioning material for a polishing pad |
| 07/01/2010 | WO2010074168A1 Polishing pad and method for producing same |
| 07/01/2010 | WO2010074002A1 Polishing liquid composition for magnetic-disk substrate |
| 07/01/2010 | WO2010072289A1 Device for grinding both sides of flat workpieces |
| 07/01/2010 | US20100167627 Precision Machining Apparatus and Precision Machining Method |
| 07/01/2010 | US20100167547 Polishing liquid |
| 07/01/2010 | US20100163787 Polishing composition |
| 07/01/2010 | US20100163786 Polishing composition for semiconductor wafer |
| 07/01/2010 | US20100163784 Polishing Composition for Planarizing Metal Layer |
| 07/01/2010 | US20100163426 Electrochemical planarization system comprising enhanced electrolyte flow |
| 07/01/2010 | US20100162631 Process for manufacturing polishing pad |
| 07/01/2010 | DE102008053610A1 Verfahren zum beidseitigen Polieren einer Halbleiterscheibe A method for double-sided polishing of a semiconductor wafer |
| 06/30/2010 | EP2202031A2 High-rate polishing method |
| 06/30/2010 | CN201516579U 精密研磨工具 Precision grinding tools |
| 06/30/2010 | CN101765647A Compositions and methods for chemical-mechanical polishing of phase change materials |
| 06/30/2010 | CN101763869A Stamper substrate and process for producing the same |
| 06/30/2010 | CN101758446A High-rate polishing method |
| 06/29/2010 | US7744444 Centerless feed-through super-finishing device having a lapping system containing a freely-disposed abrasive |
| 06/24/2010 | US20100160170 Method for polishing tape-shaped substrate for oxide superconductor, oxide superconductor, and base material for oxide superconductor |
| 06/24/2010 | US20100159810 High-rate polishing method |
| 06/24/2010 | US20100159804 Method of observing pattern evolution using variance and fourier transform spectra of friction forces in cmp |
| 06/24/2010 | DE102008063228A1 Vorrichtung zur beidseitigen schleifenden Bearbeitung flacher Werkstücke Apparatus for two-sided abrasive machining flat workpieces |
| 06/24/2010 | DE102008063227A1 Verfahren zum Bearbeiten von Werkstücken in einer Doppelseitenbearbeitungsmaschine sowie Doppelseitenbearbeitungsmaschine Method for processing workpieces in a double-page and double-page processing machine processing machine |
| 06/23/2010 | EP2199015A2 Method for processing workpieces in a double sided processing machine and double sided processing machine |
| 06/23/2010 | EP1494835B1 Lapping carrier for use in fabricating sliders |
| 06/23/2010 | CN1941310B Method of fabricating self-aligned contact pad using chemical mechanical polishing process |
| 06/23/2010 | CN101745870A Plunger ball grinder |
| 06/23/2010 | CN101745865A Substrate polishing apparatus and method of polishing substrate using the same |
| 06/23/2010 | CN101745852A Glass substrate for magnetic disk and method for producing the same |
| 06/23/2010 | CN101379598B 化学机械研磨垫 Chemical mechanical polishing pad |
| 06/23/2010 | CN101310929B Polishing pad, method for manufacturing same and polishing system and method |
| 06/23/2010 | CN101148025B Method for polishing a semiconductor wafer and semiconductor wafer polished by the method |
| 06/22/2010 | US7740521 Polishing head, polishing apparatus and polishing method for semiconductor wafer |
| 06/17/2010 | WO2010067844A1 Polishing solution for cmp and polishing method using the polishing solution |
| 06/17/2010 | WO2010067732A1 Grinding device, grinding method, and method of manufacturing glass sheet |
| 06/17/2010 | WO2009060574A8 Spacer manufacturing method for spindle stock |
| 06/17/2010 | US20100152875 Estimation apparatus and estimation method |
| 06/17/2010 | US20100151771 Polishing apparatus and polishing method |
| 06/17/2010 | US20100151684 Slurry composition for primary chemical mechanical polishing and chemical mechanical polishing method |
| 06/16/2010 | CN1929955B Insulated pad conditioner and method of using same |
| 06/16/2010 | CN1766028B 抛光组合物 The polishing composition |
| 06/16/2010 | CN1760240B 抛光垫 Polishing pad |
| 06/16/2010 | CN1746253B Polishing composition and polishing method using the same |
| 06/16/2010 | CN1735481B Method for finishing wafer surface |
| 06/16/2010 | CN1693411B Polishing composition and polishing method |
| 06/16/2010 | CN101743624A Polishing composition |
| 06/16/2010 | CN101740450A Substrate supporting unit, and apparatus and method for polishing substrate using the same |
| 06/16/2010 | CN101733701A Chemical mechanical polishing equipment |
| 06/16/2010 | CN101733557A Improved silicon slice laser cutting reduction process |
| 06/16/2010 | CN101376232B Chemical mechanical polishing method capable of enhancing polishing performance |
| 06/16/2010 | CN101104791B Cerium based polishing material and raw materials therefor |
| 06/10/2010 | WO2010063647A1 Abrasive disc |
| 06/10/2010 | US20100144255 Retaining ring and articles for carrier head |
| 06/10/2010 | US20100144249 Polishing apparatus |
| 06/10/2010 | US20100144245 Methods and apparatus for chemical-mechanical polishing utilizing low suspended solids polishing compositions |
| 06/09/2010 | EP2194570A1 Materials for polishing liquid for metal, polishing liquid for metal, mehtod for preparation thereof and polishing method using the same |
| 06/09/2010 | EP2194568A1 Semiconductor wafer manufacturing method |
| 06/09/2010 | EP2193010A1 Polishing pad |
| 06/09/2010 | EP2193008A1 System and method for producing damping polyurethane cmp pads |
| 06/09/2010 | EP2193007A1 Optimized cmp conditioner design for next generation oxide/metal cmp |
| 06/09/2010 | CN201500928U Clamp pressure fine-adjustment device for surface lapping machine |
| 06/09/2010 | CN1816251B Method of forming periphery of substrate |
| 06/09/2010 | CN101728259A Method for cutting semi-conducting material composite rod into a plurality of wafers |
| 06/09/2010 | CN101722475A CMP pad dressers with hybridized abrasive surface and related methods |
| 06/09/2010 | CN101722470A Method for manufacturing large-size ultra-thin laser crystal |
| 06/09/2010 | CN101722469A Chemical mechanical polish process control for improvement in within-wafer thickness uniformity |
| 06/09/2010 | CN101722468A Chemical mechanical polishing method, grinding fluid nozzle and chemical mechanical polishing device |
| 06/09/2010 | CN101722462A Method for polishing both sides of a semiconductor wafer |
| 06/09/2010 | CN101722447A Device for the double-sided processing of flat workpieces and method for the simultaneous double-sided material removal processing of a plurality of semiconductor wafers |
| 06/09/2010 | CN101396804B Deburring method and device of steps inner-holes |
| 06/08/2010 | US7732101 polishing the surfaces of substrates using abrasive grains comprising silica sol and applying pressure to suppress surface projections; phase shifting masks used for producing semiconductors |
| 06/08/2010 | US7731568 Polishing pad and semiconductor device manufacturing method |