Patents
Sitemap › B24 - Grinding; Polishing › B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents › B24B 37 - Lapping machines or devices; Accessories
Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
09/2010
09/02/2010US20100221984 Polishing pad manufacturing method
09/02/2010DE102008009507B4 Verfahren und Vorrichtung zur Oberflächenbearbeitung extrem harter Werkstoffe Method and apparatus for surface machining extremely hard materials
09/01/2010CN1748292B Slurry composition for chemical mechanical polishing, method for planarization of surface of semiconductor element using the same, and method for controlling selection ratio of slurry composition
09/01/2010CN101821835A Polishing composition
09/01/2010CN101821058A Polishing agent for synthetic quartz glass substrate
09/01/2010CN101817162A Multi-step, in-situ pad conditioning system for chemical mechanical planarization
09/01/2010CN101362308B Polishing apparatus, substrate manufacturing method, and electronic apparatus manufacturing method
09/01/2010CN101023429B Method and system for use in processing wafers
08/2010
08/31/2010US7786488 Nitride semiconductor wafer and method of processing nitride semiconductor wafer
08/31/2010US7785175 Method and apparatus for chemical mechanical polishing
08/31/2010US7785172 Combinatorial processing including rotation and movement within a region
08/26/2010WO2010095664A1 Method of manufacturing tube-like structure, and stent
08/26/2010US20100216309 Cmp polishing liquid and method for polishing substrate using the same
08/26/2010US20100216262 Method for producing bonded wafer
08/26/2010DE102010009332A1 Verfahren zum Herstellen von gebondeten Wafern A process for producing bonded wafers
08/25/2010EP2219821A1 Method and device for mechanically processing diamond
08/25/2010EP1860689B1 Polishing head for semiconductor wafer, polishing apparatus and polishing method
08/25/2010CN201559125U Cleaning device and chemo-mechanical grinding equipment
08/25/2010CN201559124U Grinding head assembly cleaning device and chemical mechanical grinding device
08/25/2010CN201559120U Grinding and polishing device for manufacturing sample for metallographic and transmission electron microscope film
08/25/2010CN201559119U Grinding head adjusting mechanism of wafer back grinding machine
08/25/2010CN201559118U Grinding device
08/25/2010CN201559117U On-site grinding assembly for repairing large-size rotor shaft neck
08/25/2010CN101816063A Polishing composition
08/25/2010CN101813692A Method for polishing glass and abrasive composition for polishing glass
08/25/2010CN101811284A Numerical-control silicon briquette double-surface lapping machine
08/25/2010CN101811283A Rotating support disc seat
08/25/2010CN101234482B Polishing pad with grooves to reduce slurry consumption
08/25/2010CN101148030B Polishing pad and method of producing the same
08/24/2010US7783375 Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
08/24/2010US7781281 Method of fabricating self-aligned contact pad using chemical mechanical polishing process
08/24/2010US7780504 Method for manufacturing disk-substrates for magnetic recording media, disk-substrates for magnetic recording media, method for manufacturing magnetic recording media, magnetic recording media, and magnetic recording device
08/24/2010US7780503 Polishing apparatus and polishing method
08/20/2010CA2671455A1 Method for producing bonded wafer
08/19/2010WO2010093342A1 Three-dimensional network in cmp pad
08/19/2010WO2010093011A1 Polishing agent for copper polishing and polishing method using same
08/19/2010WO2010092865A1 Abrading agent and abrading method
08/19/2010US20100210197 Polishing pad
08/19/2010US20100210192 Polishing head and polishing apparatus
08/19/2010US20100210109 Cmp polishing slurry and method of polishing substrate
08/19/2010US20100209742 Method of manufacturing a glass substrate for a magnetic recording medium, a glass substrate for a magnetic recording medium manufactured by the method, and a perpendicular magnetic recording medium
08/18/2010CN201552497U Suspended rotatable working table of wafer back grinder
08/18/2010CN201552496U Rotary grinding sucking disc regulating mechanism of wafer back grinder
08/18/2010CN201552495U Adjustable grinding tool
08/18/2010CN101804589A Method of processing synthetic quartz glass substrate for semiconductor
08/17/2010US7776793 System and method for polishing surface of tape-like metallic base material
08/17/2010US7776230 CMP system utilizing halogen adduct
08/17/2010US7776142 Bubble damper of slurry supply apparatus
08/17/2010US7775852 Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
08/12/2010WO2010090024A1 Silicon carbide monocrystal substrate and manufacturing method therefor
08/12/2010US20100203806 Semiconductor manufacturing apparatus
08/12/2010DE10252049B4 Chemisch-mechanische Polier-Aufschlämmung und chemisch-mechanisches Polierverfahren unter Verwendung derselben The chemical mechanical polishing slurry and chemical mechanical polishing method using the same
08/11/2010EP2216132A1 Method of processing synthetic quartz glass substrate for semiconductor
08/11/2010CN201544116U GMP grinding device
08/11/2010CN201544115U Grinding device for bead decoration
08/11/2010CN1958236B Method for processing grooves of grinding pads in chemical-mechanical polishing
08/11/2010CN1753961B Cmp composition comprising a sulfonic acid and a method for polishing noble metals
08/11/2010CN101802981A Polishing composition
08/11/2010CN101801605A Work polishing head, and polishing apparatus having the polishing head
08/11/2010CN101801601A Polishing pad and method of use
08/11/2010CN101797718A Method for implementing quasi-elliptic grinding track of stylus pressure head
08/11/2010CN101797717A Device and method for detecting upper/lower positions of sink of chemical machinery grinding machine
08/11/2010CN101352830B Device for stabilizing current velocity liquid and lapping liquid feeding device of
08/11/2010CN101073880B Grinding pad and its production
08/10/2010US7771251 Three-dimensional network for chemical mechanical polishing
08/05/2010US20100197207 Chemical mechanical polishing apparatus
08/05/2010US20100197204 Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces
08/05/2010US20100197197 Polishing pad thickness measuring method and polishing pad thickness measuring device
08/05/2010US20100192472 Abrasive compounds for semiconductor planarization
08/05/2010US20100192471 Froth and method of producing froth
08/05/2010DE102005000645B4 Vorrichtung und ein Verfahren zum Behandeln von Substraten Apparatus and method for treating substrates
08/04/2010EP2213418A2 Polishing pad thickness measuring method and polishing pad thickness measuring device
08/04/2010EP2213415A1 Device for polishing the edge of a semiconductor substrate
08/04/2010EP2213412A2 Apparatus and method for deterministic control of surface figure during full aperture polishing
08/04/2010CN201537849U Valve seat grinding tool
08/04/2010CN1498725B Vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof
08/04/2010CN101795817A Polishing pad
08/04/2010CN101792929A Group iii nitride crystal substrate and semiconductor device
08/04/2010CN101791783A Device and method for controlling determinacy of surface profile during full aperture polishing period
08/04/2010CN101791782A 研磨装置 Grinding device
08/04/2010CN101791781A Monitoring method of polishing state, monitor of polishing state, polishing apparatus, processed wafer, semiconductor device manufacturing method, and semiconductor device
08/04/2010CN101791780A Device for polishing the edge of a semiconductor substrate
08/03/2010US7767581 comprising imine compounds and hydrazine compounds; for polishing tantalum-containing barrier; abrasive free
07/2010
07/29/2010WO2010085587A1 Structured fixed abrasive articles including surface treated nano-ceria filler, and method for making and using the same
07/29/2010WO2010084538A1 Semiconductor device and method for manufacturing same
07/29/2010US20100190418 Lapping plate-conditioning grindstone segment, lapping plate-conditioning lapping machine, and method for conditioning lapping plate
07/29/2010US20100190416 Device for polishing the edge of a semiconductor substrate
07/29/2010US20100190414 Method of processing synthetic quartz glass substrate for semiconductor
07/29/2010US20100190413 Polishing composition
07/29/2010US20100187200 Cmp sensor and control system
07/29/2010DE10084938B4 Vorrichtung und Verfahren zum Konditionieren und Überwachen von Medien, die für die chemisch-mechanische Planarisierung verwendet werden Apparatus and method for conditioning and monitoring of media that are used for the chemical mechanical planarization
07/28/2010EP2209864A1 Polishing composition comprising a n-substituted imidazole and a method for polishing a copper film
07/28/2010CN101786262A Apparatus for dressing a polishing pad, chemical mechanical polishing apparatus and method
07/28/2010CN101786260A Grinding method for eliminating corner effect in shallow trench isolation
07/28/2010CN101786259A Flexible film for chemical machinery grinding machine
07/27/2010US7762870 Polishing pad and cushion layer for polishing pad
07/27/2010CA2691136A1 Method of processing synthetic quartz glass substrate for semiconductor
07/22/2010WO2010082992A2 Polishing pad and system with window support
07/22/2010WO2010082249A1 Method for manufacturing semiconductor device
07/22/2010WO2010053804A3 Endpoint control of multiple-wafer chemical mechanical polishing
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