Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
10/2010
10/19/2010US7815489 Method for the simultaneous double-side grinding of a plurality of semiconductor wafers
10/13/2010CN201604071U 金相磨抛机 Metallographic grinding and polishing machine
10/13/2010CN101857773A Plastic soft composition for polishing and for surafec protective material application
10/13/2010CN101856805A Method for producing large-size synthetic quartz glass substrate
10/13/2010CN101856804A Full-automatic grinding device of semiconductor chip with four main shafts
10/13/2010CN101128285B Polishing device and polishing method
10/12/2010US7811972 Method of polishing tape-shaped substrate and substrate for oxide superconductor
10/07/2010WO2010113678A1 Working fluid for brittle material and working fluid for hard material
10/07/2010WO2010112225A1 Method for the material-removing machining of very thin work pieces in a double side grinding machine
10/07/2010US20100255756 Polishing apparatus and polishing method
10/07/2010US20100251624 Plastic soft composition for polishing and for surface protective material application
10/07/2010DE102009015878A1 Verfahren zum materialabtragenden Bearbeiten von flachen Werkstücken A method for material-processing of flat pieces
10/06/2010EP2237311A1 Polishing composition and polishing method using the same
10/06/2010EP2236574A1 Polishing composition
10/06/2010EP2236247A1 Plastic soft composition for polishing and for surafec protective material application
10/06/2010EP2236245A2 Equipment and method for cleaning polishing cloth
10/06/2010CN201596968U 柱塞球头研磨机 Plunger ball mill
10/06/2010CN101855309A Polishing composition comprising a N-substituted imidazole and a method for polishing a copper film
10/06/2010CN101853671A Method of manufacturing a substrate for a magnetic disk
10/06/2010CN101853670A Subastrate for a magnetic disk and method of manufacturing the same
10/06/2010CN101850539A Lower unit for glass polishing system and polishing method utilizing the same
10/06/2010CN101850538A Support jig of wafer and method for grinding, transferring and cutting wafer
10/05/2010US7807252 Chemical mechanical polishing pad having secondary polishing medium capacity control grooves
10/05/2010US7807038 with a polishing pad having thin cellular polymeric layer overlying a metal or alloy conductive substrate; improved electrical and thermal capabilities and control; porosity
09/2010
09/30/2010WO2010110834A1 Abrasive tool for use as a chemical mechanical planarization pad conditioner
09/30/2010WO2010110463A1 POLISHING METHOD, POLISHING APPARATUS AND GaN WAFER
09/30/2010US20100248595 Abrasive tool for use as a chemical mechanical planarization pad conditioner
09/30/2010US20100247978 Method of manufacturing a substrate for a magnetic disk
09/30/2010US20100247977 Subastrate for a magnetic disk and method of manufacturing the same
09/30/2010US20100243950 Polishing agent for synthetic quartz glass substrate
09/30/2010US20100242374 Polishing Composition and Polishing Method
09/29/2010CN1970232B Method of manufacturing chemical mechanical polishing pad and polishing pad
09/29/2010CN101849052A Fabric, composite sheet, polishing cloth, and wiping product
09/29/2010CN101848791A Method and device for mechanically processing diamond
09/29/2010CN101844330A Polishing pad trimmer
09/29/2010CN101844328A Equipment and method for cleaning polishing cloth
09/29/2010CN101450449B CMP technique condition adjustment control method
09/29/2010CN101346806B Metal polishing liquid and method for polishing film to be polished
09/29/2010CN101337336B Method for grinding semiconductor chip
09/23/2010WO2010082992A3 Polishing pad and system with window support
09/23/2010US20100240283 Method of Chemical Mechanical Polishing
09/23/2010US20100240281 Substrate polishing metrology using interference signals
09/23/2010US20100236288 Glass powders, methods for producing glass powders and devices fabricated from same
09/22/2010CN201586922U Grinding block
09/22/2010CN1849264B Cerium salt, process for producing the same, cerium oxide, and cerium-based abrasive material
09/22/2010CN1670116B Polishing composition and polishing method
09/22/2010CN1535796B Ion bombardment electric grinding indicator for reducing noise in course of grinding process
09/22/2010CN101842192A System and method for producing damping polyurethane cmp pads
09/22/2010CN101837565A Method for manufacturing disc-shaped substrate
09/22/2010CN101837564A Valve grinding machine
09/21/2010US7799688 Polishing fluid and method of polishing
09/21/2010US7799686 Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same
09/21/2010US7798309 Stabilizing substrate carriers during overhead transport
09/16/2010WO2010104085A1 Semiconductor polishing agent, method for producing the same, and polishing method
09/16/2010WO2007011158A9 Polishing pad containing interpenetrating liquified vinyl monomer network with polyurethane matrix therein
09/16/2010US20100233945 Polishing head, polishing apparatus and method for demounting workpiece
09/16/2010US20100233937 Method for predicting worked shape, method for determining working conditions, working method, working system, semiconductor device manufacturing method, computer program and computer program storage medium
09/16/2010US20100231088 Wafer, wafer polishing apparatus, wafer polishing method, method of fabricating piezoelectric vibrator, piezoelectric vibrator, oscillator, electronic apparatus and radiowave timepiece
09/16/2010US20100230841 Aerosol method and apparatus, particulate products, and electronic devices made therefrom
09/15/2010EP2227353A1 Damping polyurethane cmp pads with microfillers
09/15/2010EP2227352A2 Improved multiple-phase surfaces, and method therefor
09/15/2010CN201579694U CD local grinding machine
09/15/2010CN201579693U CD surface grinding device
09/15/2010CN101834270A Production method of langasite crystal element
09/15/2010CN101829948A Method for the simultaneous grinding of a plurality of semiconductor wafers
09/15/2010CN101829947A Feeding mechanism for numerical control double surface lapping machine
09/14/2010US7795866 Method and device for forecasting polishing end point
09/10/2010WO2010101925A2 System for magnetorheological finishing of a substrate
09/09/2010US20100227537 Glass Polishing System
09/09/2010US20100227536 Glass Polishing System
09/09/2010US20100227535 System and Method for Polishing Glass
09/09/2010US20100227534 Lower Unit for Glass Polishing System and Glass Polishing Method Using the Same
09/09/2010US20100227532 Method of surface treatment of group iii nitride crystal film, group iii nitride crystal substrate, group iii nitride crystal substrate with epitaxial layer, and semiconductor device
09/09/2010US20100224256 Slurry system for semiconductor fabrication
09/08/2010EP2225070A1 Nanotopography control and optimization using feedback from warp data
09/08/2010EP1722925B1 Insulated pad conditioner and method of using same
09/08/2010CN201573111U Silicon wafer fixing device for chemical-mechanical polishing device
09/08/2010CN201573110U Polishing table device
09/08/2010CN201573109U Safety device for transfer device for chemical mechanical polishing
09/08/2010CN1972780B Polishing apparatus and polishing method
09/08/2010CN1951634B Method of adhering polishing pads and jig for adhering the same
09/08/2010CN101827686A Method of polishing glass substrate and process for producing glass substrate
09/08/2010CN101827685A Polishing head and polishing apparatus
09/08/2010CN101827684A Polishing head, polishing apparatus and work removing method
09/08/2010CN101823234A Planarization slurry feed system and planarization slurry mixture feed method of chemical mechanical planarization station
09/08/2010CN101823233A System and method for polishing glass
09/08/2010CN101823232A 玻璃抛光系统 Glass polishing system
09/08/2010CN101823231A Multi-axial section and axial surface grinder and method thereof
09/08/2010CN101823230A Triaxial non-spherical processing clamp with adjustable inclination angle
09/08/2010CN101823229A Nonequilibrium humidity control for jet milling
09/08/2010CN101823223A 玻璃抛光系统 Glass polishing system
09/08/2010CN101410956B Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method
09/08/2010CN101258106B Cerium oxide powder for one-component CMP slurry, preparation method thereof, one-component CMP slurry composition comprising the same, and method of shallow trench isolation using the slurry
09/07/2010US7790788 Method for producing chemical mechanical polishing pad
09/07/2010US7790046 Method of texturing
09/07/2010US7790015 determining removal of material from a wafer during polishing; biasing via electrodes; electro-chemical mechanical polishing; for semiconductor wafers/integrated circuits
09/02/2010WO2010098278A1 Composition for metal film polishing
09/02/2010WO2010097903A1 Glass substrate polishing method, package manufacturing method, piezoelectric oscillator, oscillator, electronic device, and radio-controlled watch
09/02/2010WO2010097902A1 Glass substrate polishing method, package manufacturing method, piezoelectric oscillator, oscillator, electronic device, and radio-controlled watch
09/02/2010US20100221987 Double Side Polishing Machine
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