Patents
Sitemap › B24 - Grinding; Polishing › B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents › B24B 37 - Lapping machines or devices; Accessories
Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
12/2010
12/08/2010CN101905442A Double-side polishing apparatus, method for polishing both sides of wafer and carrier of apparatus
12/08/2010CN101905434A Rotary grinding sucking disc adjusting mechanism of wafer back grinder
12/08/2010CN101905433A Grinding head adjusting mechanism of wafer back grinding machine
12/08/2010CN101905432A Suspension type rotatable operating platform for wafer mill
12/08/2010CN101314211B Compound semiconductor substrate, method of polishing the same, epitaxial substrate andmethod for manufacturing compound semiconductor
12/08/2010CN101297010B 粘接剂组合物以及粘接薄膜 Adhesive composition and adhesive film
12/08/2010CN101293333B Carrier ring for grinding head
12/08/2010CN101269476B Method for the simultaneous grinding of a plurality of semiconductor wafers
12/08/2010CN101121237B Device for grinding wafer
12/08/2010CN101012313B Polishing composition
12/07/2010CA2340906C Abrasive diamond particles and method for producing the same
12/02/2010WO2010138724A1 Polishing pad, polyurethane layer therefor, and method of polishing a silicon wafer
12/02/2010US20100304644 Method and device for mechanically processing diamond
12/02/2010US20100301265 Polishing slurry and method of polishing
12/02/2010DE112007003710T5 Polierkopf und Poliervorrichtung Polishing head and polishing machine
12/02/2010DE10196254B4 Verfahren zum Polieren von Halbleiterwafern unter Verwendung eines beidseitigen Polierers A method of polishing semiconductor wafers using a two-sided polisher
12/01/2010CN101903132A Pick and place tool grinding
12/01/2010CN101903131A CMP pad dressers
12/01/2010CN101899265A Chemical mechanical polishing composition for removing saw cut
12/01/2010CN101898329A Precise high-efficiency ball grinding device
12/01/2010CN101355032B Method for polishing a substrate composed of semiconductor material
12/01/2010CN101237960B 精密加工设备和精密加工方法 Precision machining equipment and precision machining method
11/2010
11/30/2010US7842191 chemical mechanical polishing (CMP) copper films via slurry of polyvinylpyrrolidone, oxidizing agent, protective film-forming agent containing complexing agent (containing quinaldinic acid, quinolinic acid, and alkylbenzene sulfonate) for forming water-insoluble complex, and colloidal sol
11/30/2010US7842169 Method and apparatus for local polishing control
11/30/2010US7842158 Multiple zone carrier head with flexible membrane
11/30/2010US7841926 Substrate polishing metrology using interference signals
11/30/2010US7841925 Polishing article with integrated window stripe
11/25/2010US20100297917 Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
11/25/2010DE102009022223A1 Rotor disk set forming method for polishing semiconductor wafer, involves selecting one rotor disk based on material properties for rotor disk set, where characterization of selected rotor disk is marked by engraving identification mark
11/24/2010CN201645316U Multi-station automatic metallic phase polishing machine
11/24/2010CN201645315U Ball auto-unloading device for the 3M7780 mill
11/24/2010CN201645314U Planer-type two-sided grinder
11/24/2010CN201645313U Multi-head high-speed grinder
11/24/2010CN201645301U Band steel sand washing machine
11/24/2010CN101892032A Polishing composition for glass substrate
11/24/2010CN101890673A Three-head grinding machine
11/24/2010CN101023512B Cmp polishing agent and method for polishing substrate
11/23/2010US7838482 CMP polishing compound and polishing method
11/23/2010US7837800 cerium oxide particles, a dispersing agent (lauryl betaine), a water-soluble polymer containing N-mono-substituted product and an N,N-di-substituted product of any one selected from acrylamide, methacrylamide and alpha -substituted product; polishing a silicon dioxide film
11/23/2010US7837534 Apparatus for heating or cooling a polishing surface of a polishing apparatus
11/18/2010WO2010132342A2 Process for resurfacing plastic lens
11/18/2010US20100291838 Polishing head and polishing apparatus having the same
11/17/2010CN201632927U Leak-tightness device on horizontal type steel ball flashing machine
11/17/2010CN1799957B Method and apparatus for conveying workpieces, and working machine
11/17/2010CN1754657B Method of forming a polishing pad having reduced striations
11/17/2010CN101885162A Numeric control micro-nano grinding and polishing machine for optical fiber lens
11/17/2010CN101885161A Polishing system used for square silicon ingot for solar cell
11/17/2010CN101347923B Method and apparatus for improving insufficiency of wafer grinding and thick thickness
11/17/2010CN101339893B Method for judging wafer thinning, device structure and device and its manufacture method
11/17/2010CN101147242B Polishing compound for semiconductor integrated circuit device, polishing method and method for producing semiconductor integrated circuit device
11/16/2010US7833431 Aqueous dispersion for CMP, polishing method and method for manufacturing semiconductor device
11/11/2010WO2010128631A1 Semiconductor wafer polishing method and polishing pad shaping jig
11/11/2010US20100285665 Semiconductor wafer manufacturing method
11/10/2010EP1238755B1 Table of wafer polisher, method of polishing wafer, and method of manufacturing semiconductor wafer
11/10/2010CN1746255B Polishing compound and method for polishing substrate
11/10/2010CN101879700A Chemical mechanical polishing device, polishing method and system for wafer
11/10/2010CN101879699A Circulating progressive planarization method and semiconductor grinding cleaning device used for method
11/10/2010CN101879698A Dual-cylinder carriage and combined oilstone clamp mechanism of bearing roller super-precision grinding machine
11/10/2010CN101362313B Chemical-mechanical grinding device and chemical-mechanical grinding method
11/09/2010US7829406 forming insulating film above semiconductor substrate having recess and stopper film above substrate excluding the recess, thereby filling the recess with the insulating film, performing first and second polishings by means of cerium oxide and anionic surfactants and chemical mechanical polishing
11/09/2010US7828628 Method of polishing hard crystal substrate
11/09/2010US7828626 Apparatus for conditioning processing pads
11/04/2010US20100279440 Nitride semiconductor wafer and method of processing nitride semiconductor wafer
11/04/2010US20100276392 Cmp system utilizing halogen adduct
11/04/2010DE112008002628T5 Polierzusammensetzung Polishing composition
11/03/2010EP0985007B2 Oxygen-containing phosphor powders, methods for making phosphor powders and devices incorporating same
11/03/2010CN201619013U Clamp of SRP systematic grinding machine
11/03/2010CN1935927B Cerium oxide abrasive and method of polishing substrates
11/03/2010CN1626599B 抛光组合物和抛光方法 Polishing composition and polishing method
11/03/2010CN101878092A Working object grinding method
11/03/2010CN101875182A Method for chemical mechanical polishing a substrate
10/2010
10/28/2010WO2010122985A1 Polishing liquid for semiconductor substrate and method for polishing semiconductor substrate
10/28/2010US20100273405 Polishing apparatus
10/28/2010US20100273404 Polishing Pad and Polishing Device
10/28/2010US20100273398 Customized polish pads for chemical mechanical planarization
10/28/2010US20100273396 Polishing method, polishing apparatus and method of monitoring a substrate
10/28/2010US20100270403 Recycling method and recycling apparatus of slurry for use in wafer polishing
10/27/2010EP2242615A1 Chemical-mechanical planarization pad
10/27/2010EP2242614A1 Chemical-mechanical planarization pad
10/27/2010EP2242609A1 Methods and apparatus for forming a slurry polishing pad
10/27/2010EP1545835B1 Flow control system
10/27/2010CN101870085A Method for simultaneous grinding of a plurality of semiconductor wafers
10/26/2010US7822500 Polishing apparatus and polishing method
10/26/2010US7819723 Retainer ring and polishing machine
10/21/2010WO2010120128A2 Method for manufacturing a polishing retainer ring and retainer ring manufactured thereby
10/21/2010WO2010119847A1 Work carrier, bristle material for brush and method of producing brush, work carrier and bristle material for brush
10/21/2010WO2010119833A1 Method for producing silicon epitaxial wafer
10/21/2010WO2010119606A1 Method of preparing polishing head and polishng apparatus
10/21/2010WO2010119585A1 Method for detecting amount of processing and processing apparatus
10/21/2010WO2010118553A1 A cerium-based particle composition and the preparation thereof
10/21/2010WO2010081084A3 Polishing pads for chemical mechanical planarization and/or other polishing methods
10/21/2010US20100267318 Polishing pad with projecting portion
10/21/2010US20100267315 Polishing composition
10/21/2010DE112008002802T5 Polierkopf und diesen aufweisende Poliervorrichtung Polishing head and polishing apparatus having this
10/21/2010CA2758315A1 A cerium-based particle composition and the preparation thereof
10/20/2010CN201609867U 多工位自动磨抛机 Multi-position automatic grinding and polishing machine
10/20/2010CN101862991A Large and inner grinding eccentric hole processing jig
10/20/2010CN101862990A Polishing device of non-spherical surface optical parts
10/20/2010CN101862989A Polishing method of non-spherical surface optical parts
10/20/2010CN101862987A Adsorption gasket with discontinuous laminating points and manufacturing method thereof
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