Patents
Sitemap › B24 - Grinding; Polishing › B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents › B24B 37 - Lapping machines or devices; Accessories
Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
01/2011
01/05/2011CN201693445U Basket type grinder
01/05/2011CN201693444U Grinder
01/05/2011CN101934497A Single-sided chemically mechanical polishing method and device of silicon chip
01/05/2011CN101934496A Chemical mechanical polishing machine and chemical mechanical polishing equipment with same
01/05/2011CN101934495A Embedded retaining ring for chemical mechanical polishing
01/05/2011CN101934494A Chemical mechanical grinding method
01/05/2011CN101934491A Polishing apparatus
01/05/2011CN101708591B Side axial optical fiber grinder
01/05/2011CN101633151B Grinding device and locating method thereof
01/04/2011US7863195 Chemical solution feeding apparatus and method for preparing slurry
01/04/2011US7862402 Polishing apparatus and substrate processing apparatus
01/04/2011US7861400 Fabricating a write head with multiple electronic lapping guides
12/2010
12/30/2010US20100330885 Method For Polishing The Edge Of A Semiconductor Wafer
12/30/2010US20100330883 Method For The Local Polishing Of A Semiconductor Wafer
12/30/2010US20100330882 Polishing Pad and Method For Polishing A Semiconductor Wafer
12/30/2010US20100330881 Method For The Double Sided Polishing Of A Semiconductor Wafer
12/30/2010US20100330878 Polishing apparatus and polishing method
12/30/2010US20100330786 Method For Producing An Epitaxially Coated Semiconductor Wafer
12/30/2010US20100327414 Method For Producing A Semiconductor Wafer
12/30/2010DE102009030451A1 Method for machining e.g. honing cylinder bearing surface of internal combustion engine, involves rotating tool about rotational axis parallel to surface of component, and moving tool along directions perpendicular to normal of surface
12/30/2010DE102009030292A1 Verfahren zum beidseitigen Polieren einer Halbleiterscheibe A method for double-sided polishing of a semiconductor wafer
12/30/2010DE102009027211A1 Aqueous cerium oxide and silicon dioxide-containing dispersion, obtained by mixing cerium oxide-starting dispersion and silica-starting dispersion under stirring and dispersing at specified shear rate, useful to polish dielectric surface
12/30/2010DE102009025243A1 Verfahren zur Herstellung und Verfahren zur Bearbeitung einer Halbleiterscheibe Methods for making and method for processing a semiconductor wafer
12/30/2010DE102009025242A1 Verfahren zum beidseitigen chemischen Schleifen einer Halbleiterscheibe Method for two-sided chemical grinding a semiconductor wafer
12/29/2010WO2010150766A1 Polishing pad, manufacturing method therefor, and polishing method
12/29/2010WO2010150757A1 Glass disc polishing device and glass disc polishing method
12/29/2010WO2010150326A1 Holding pad
12/29/2010EP2266757A1 Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles
12/29/2010EP1918069B1 Double side polishing method for wafer
12/29/2010CN201685181U PCB metallographic slice grinding tool
12/29/2010CN201685180U Multifunctional valve grinding machine
12/29/2010CN201685179U Novel valve grinding machine
12/29/2010CN201685178U Mechanical sealing structure in super-fine horizontal type nanometer grinder
12/29/2010CN101933124A Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method
12/29/2010CN101930911A Method for producing an epitaxially coated semiconductor wafer
12/29/2010CN101930909A Method for producing a semiconductor wafer
12/29/2010CN101930908A Method for polishing the edge of a semiconductor wafer
12/29/2010CN101927455A Polishing pad and method for polishing a semiconductor wafer
12/29/2010CN101927454A Wafer grinding method
12/29/2010CN101927453A Grinding device of shallow trench isolation structure and method therefor
12/29/2010CN101927452A Multi-head high-speed grinder
12/29/2010CN101927451A Gantry type double-faced grinder
12/29/2010CN101927448A Method for the local polishing of a semiconductor wafer
12/29/2010CN101927447A Method of the double sided polishing of a semiconductor wafer
12/29/2010CN101648362B Crank pin end pore finishing process
12/29/2010CN101316683B Method for manufacturing microporous cmp materials having controlled pore size
12/29/2010CN101028700B Processing device with rotary table
12/29/2010CN101010736B Magnetic disk substrate and production method of magnetic disk
12/28/2010US7858527 Additive composition, slurry composition including the same, and method of polishing an object using the slurry composition
12/28/2010US7857876 artificial diamond particles having primary particle diameters of 20 nm or less and impurities attached around these diamond particles; density of non-diamond carbon contained in the impurities is 95-99 % , density of chlorine contained in other than non-diamond carbon in the impurities is 0.5 to 3.5%
12/28/2010US7857683 CMP retaining ring
12/23/2010WO2010146982A1 Polyurethane, composition for formation of polishing layers that contains same, pad for chemical mechanical polishing, and chemical mechanical polishing method using same
12/23/2010US20100323586 Methods for producing and processing semiconductor wafers
12/23/2010US20100323585 Method For Chemically Grinding A Semiconductor Wafer On Both Sides
12/23/2010US20100323522 Polishing composition and polishing method
12/23/2010DE112007003705T5 Polierkopf, Poliervorrichtung und Verfahren zum Ablösen eines Werkstücks Polishing head, the polishing apparatus and method for detaching a workpiece
12/22/2010CN201677236U Liquid conveying system and chemical mechanical grinding device
12/22/2010CN201677232U Grinding sheet
12/22/2010CN201677231U Connecting device for millstone of flooring grinder
12/22/2010CN201677230U Device for monitoring rotation of disc of steel ball lapping machine
12/22/2010CN1947943B Method and device for internally machining cylinder jacket
12/22/2010CN1874874B Pad assembly for electrochemical mechanical processing
12/22/2010CN101920479A Dividing device for honing machine
12/22/2010CN101920477A Methods for producing and processing semiconductor wafers
12/22/2010CN101920476A Chemical mechanical polishing equipment and conveying method of grinding fluid thereof
12/22/2010CN101407039B Sprayer capable of preventing abrasive on grinder table from aggregating and use method thereof
12/21/2010US7854777 Fine oxide particles, oxidizing agent, benzotriazole derivative, water and solvent; reduced dishing, erosion and scratching; chemical mechanical polishing; high removal rate
12/21/2010US7854646 Substrate polishing apparatus and substrate polishing method
12/16/2010WO2010143649A1 Aqueous cutting fluid and aqueous cutting agent
12/16/2010WO2010143579A1 Abrasive slurry, abrasive set, and method for grinding substrate
12/16/2010WO2010142520A1 Grinding and/or polishing tool, and production method
12/16/2010US20100317263 Polishing pad
12/16/2010US20100314078 Cooler with ground heated plane and grinding method and apparatus thereof
12/16/2010DE102007035405B4 Poliermaschine Polisher
12/15/2010EP2260977A1 Cooler with ground heated plane and grinding method and apparatus thereof
12/15/2010EP2260975A1 Surface grinding machine and method for processing workpieces with surface grinding
12/15/2010EP2259900A1 Non-planar cvd diamond-coated cmp pad conditioner and method for manufacturing
12/15/2010CN201669614U Ultrasonic normal probe grinding machine
12/15/2010CN1910011B Chemical mechanical planarization process control utilizing in-situ conditioning process
12/15/2010CN1803964B Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using same
12/15/2010CN1680509B Polishing composition
12/15/2010CN101918177A Damping polyurethane cmp pads with microfillers
12/14/2010US7851236 Film thickness prediction method, layout design method, mask pattern design method of exposure mask, and fabrication method of semiconductor integrated circuit
12/14/2010US7850817 Polishing device and substrate processing device
12/14/2010US7850509 Substrate holding apparatus
12/09/2010WO2010140684A1 Fixed-abrasive-grain machining apparatus, fixed-abrasive-grain machining method, and semiconductor-wafer manufacturing method
12/09/2010WO2010140671A1 Silicon wafer polishing method and silicon wafer
12/09/2010WO2010140592A1 Surface treatment composition, surface treatment method, and method for manufacturing semiconductor device
12/09/2010WO2010139397A1 Method for machining flat workpieces
12/09/2010US20100311630 Surface treatment composition, surface treatment method, and method for manufacturing semiconductor device
12/09/2010US20100311312 Double-side polishing apparatus and method for polishing both sides of wafer
12/09/2010US20100311308 Apparatus and Method for Deterministic Control of Surface Figure During Full Aperture Polishing
12/09/2010US20100306991 Method for manufacturing spacers for spindle device
12/09/2010DE112008002972T5 Verfahren zur Herstellung von Abstandshaltern für Spindeln A process for producing spacers for spindles
12/09/2010DE102009024125A1 Verfahren zum Bearbeiten von flachen Werkstücken Method for processing flat workpieces
12/08/2010CN1791490B Substrate polishing apparatus
12/08/2010CN101909817A Nanotopography control and optimization using feedback from warp data
12/08/2010CN101909816A Polishing slurry, process for producing same, method of polishing, and process for producing glass substrate for magnetic disk
12/08/2010CN101909814A Polishing apparatus and polishing method
12/08/2010CN101906346A Aqueous cutting fluid and aqueous cutting agent
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