Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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02/09/2011 | CN101966698A Manufacturing method of polishing pad |
02/09/2011 | CN101966697A Manufacturing method of polishing pad |
02/09/2011 | CN101966689A Surface polishing method for carbon surface of large-diameter 4H-SiC wafer |
02/09/2011 | CN101966688A Low-pressure CMP (Chemico-mechanical Polishing) method for grand-scale integrated circuit copper wiring surface |
02/09/2011 | CN101966687A Chemical mechanical lapping method |
02/09/2011 | CN101966686A Grinding tool and grinding method for reheating main valve seat of steam turbine |
02/09/2011 | CN101058713B Polishing slurry and polishing method |
02/08/2011 | US7884020 Polishing cloth and method of manufacturing semiconductor device |
02/08/2011 | US7883397 Substrate retainer |
02/08/2011 | US7883394 Substrate holding mechanism, substrate polishing apparatus and substrate polishing method |
02/03/2011 | US20110028073 Cmp polishing slurry and polishing method |
02/03/2011 | US20110027997 Polishing liquid for cmp and polishing method |
02/03/2011 | DE102009035781A1 Method for lapping sealing surface of internal combustion engine, involves lapping injector sealing surface and ignition plug sealing surface of internal combustion engine by slip ring fastened to slip bolt using hand drilling machine |
02/02/2011 | EP1633528B1 Substrate polishing apparatus |
02/02/2011 | EP1316111B1 Method of processing a semiconductor wafer |
02/02/2011 | CN201728583U Wafer grinding machine capable of reducing times of pressure regulation |
02/02/2011 | CN201728582U Wafer grinding machine with higher lifting smoothness of hanging wall |
02/02/2011 | CN201728581U Wafer lapper with high lapping precision |
02/02/2011 | CN201728580U Wafer grinding machine with higher corrosion resistance |
02/02/2011 | CN201728579U Cutting liquid circle device |
02/02/2011 | CN201728578U Clamp for grinding special-shaped prism with spherical surface |
02/02/2011 | CN101961854A Multi-functional polishing pad |
02/02/2011 | CN101961853A Substrate polishing apparatus and method of polishing substrate using the same |
02/02/2011 | CN101961852A Chemical mechanical grinding method for interlayer dielectric layer |
02/02/2011 | CN101224552B Grinding method of a disk-shaped substrate and grinding apparatus |
02/01/2011 | US7879180 Polishing device and polishing method |
02/01/2011 | US7878882 Advanced workpiece finishing |
01/27/2011 | WO2011010423A1 Method for manufacturing carrier for double-side polishing apparatus, carrier for double-side polishing apparatus, and method for polishing double sides of wafer |
01/27/2011 | US20110021115 Substrate polishing apparatus and method of polishing substrate using the same |
01/27/2011 | DE102009047927A1 Rotor disk for supporting one or multiple disks for conditioning polishing cloth in polishing machine, has core made of material, which have high rigidity and core is fully and partially provided with coating |
01/27/2011 | DE102009033206A1 Polierverfahren und Poliervorrichtung zur Korrektur von geometrischen Abweichungsfehlern auf Präzisionsoberflächen A polishing method and the polishing apparatus for the correction of deviation errors on the geometric precision surfaces |
01/27/2011 | DE102007021411B4 Poliermaschine Polisher |
01/26/2011 | EP2276820A2 High porosity abrasive articles and methods of manufacturing same |
01/26/2011 | EP1910025B1 Abrasive agglomerate polishing method |
01/26/2011 | EP1324859B1 Polishing pad with built-in optical sensor |
01/26/2011 | CN201720764U Abrasive belt-correcting controller for lapping machines |
01/26/2011 | CN101960519A Composition and method for polishing nickel-phosphorous-coated aluminum hard disks |
01/26/2011 | CN101959647A Carrier for double-side polishing device, and double-side polishing device and double-side polishing method that use same |
01/26/2011 | CN101957186A Method for detecting surface evenness of wafer and chemically mechanical polishing method |
01/26/2011 | CN101955733A Method for preparing grinding fluid, grinding fluid, and chemical mechanical polishing (CMP) method for metal tungsten |
01/26/2011 | CN101954620A Method for chemically grinding a semiconductor wafer on both sides |
01/26/2011 | CN101386149B Cleaning device for chemical mechanical polishing device |
01/26/2011 | CN101296780B Cmp of copper/ruthenium substrates |
01/25/2011 | US7875501 Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure |
01/25/2011 | US7874894 Polishing pad |
01/20/2011 | WO2011008499A2 Leak proof pad for cmp endpoint detection |
01/20/2011 | WO2011007588A1 Cmp fluid and method for polishing palladium |
01/20/2011 | WO2011006650A1 Microstructuring, polishing method and polishing device for correcting geometric deviation defects on precision surfaces |
01/20/2011 | WO2010101925A3 System for magnetorheological finishing of a substrate |
01/20/2011 | US20110014852 Pick and place tool grinding |
01/20/2011 | US20110014851 Polishing apparatus and polishing method |
01/20/2011 | DE102009030297B3 Verfahren zum Polieren einer Halbleiterscheibe A method of polishing a semiconductor wafer |
01/19/2011 | EP2274136A1 Chemical mechanical planarization pad with void network |
01/19/2011 | CN201711859U Grinding mill capable of measuring frequency |
01/19/2011 | CN1837319B Polishing composition and polishing method |
01/19/2011 | CN101952943A Polishing pad |
01/19/2011 | CN101950565A Glass substrate for information recording medium and method for manufacturing the same, and magnetic recording medium |
01/19/2011 | CN101350302B GaN基板 GaN substrates |
01/18/2011 | US7871309 Polishing pad |
01/18/2011 | US7871308 Abrasive, method of polishing target member and process for producing semiconductor device |
01/13/2011 | WO2011004793A1 Polishing liquid composition for silicon wafers |
01/13/2011 | WO2011004764A1 Grinding machine for plate-like bodies and method of grinding plate-like bodies |
01/13/2011 | WO2011004473A1 Optical disc polishing apparatus |
01/13/2011 | US20110008965 Polishing composition and polishing method |
01/13/2011 | US20110008649 Glass substrate for information recording medium and method for manufacturing the same, and magnetic recording medium |
01/13/2011 | US20110005143 Polishing oil slurry for polishing hard crystal substrate |
01/13/2011 | DE102010025067A1 Method for forming e.g. lubrication channels in cylindrical crankcase borehole, involves placing lubrication structure by partial deformation, and reworking of sliding or storage surface by smoothing, honing, lapping process |
01/12/2011 | EP2271463A1 Polishing pad with controlled void formation |
01/12/2011 | EP1444308B1 Cerium-based polish and cerium-based polish slurry |
01/12/2011 | CN201702672U Improved combination machine |
01/12/2011 | CN201702671U Clamping tool for preventing grinding product from dropping |
01/12/2011 | CN201702627U Measurement correction system applied for base plate grinding mechanism |
01/12/2011 | CN1852786B Polishing cloth, polishing cloth processing method, and substrate manufacturing method using same |
01/12/2011 | CN101946309A Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method |
01/12/2011 | CN101941181A Method for grinding wafer |
01/12/2011 | CN101941180A Chemically mechanical polishing method |
01/12/2011 | CN101941179A Chemical mechanical grinding equipment |
01/12/2011 | CN101941178A Grinding tool of carburetor enrichment valve |
01/12/2011 | CN101941177A Large-sized column-shaped workpiece thermal spraying surface treating polishing and grinding structure |
01/12/2011 | CN101528416B Polishing head and polishing apparatus |
01/12/2011 | CN101240159B Polishing liquid composition |
01/11/2011 | US7867909 contains at least one water soluble polymer selected from polyvinylpyrrolidone and poly(N-vinylformamide), and an alkali, and preferably further contains at least one of a chelating agent and an abrasive grain of colloidal silica or fumed silica; for a finish stage of preliminary polishing |
01/11/2011 | US7867303 Cerium oxide abrasive and method of polishing substrates |
01/11/2011 | US7867066 Polishing pad |
01/11/2011 | US7867063 Substrate holding apparatus and polishing apparatus |
01/11/2011 | US7867060 Retainer ring used for polishing a structure for manufacturing magnetic head, and polishing method using the same |
01/06/2011 | WO2011002149A2 Cmp polishing pad with pores formed therein, and method for forming pores |
01/06/2011 | WO2011001755A1 Two-pack urethane resin composite for use in an abrasive pad, polyurethane abrasive pad, and method for manufacturing a polyurethane abrasive pad |
01/05/2011 | EP2270848A2 Multilayer protective sheet for a semiconductor wafer and structure comprising said wafer and sheet, method for protecting semiconductor wafer and method for processing semiconductor wafer |
01/05/2011 | EP2268451A2 Method and device for working the surface of a hard material |
01/05/2011 | EP1338636B1 Abrasive material |
01/05/2011 | DE102009031337A1 Method for processing surface of component i.e. cylinder barrel of internal combustion engine, involves brushing component surface by brushing process, and processing component surface by machining process i.e. lapping-honing process |
01/05/2011 | DE102009030296A1 Verfahren zur Herstellung einer epitaxierten Halbleiterscheibe A process for producing an epitaxially coated semiconductor wafer, |
01/05/2011 | DE102009030295A1 Verfahren zur Herstellung einer Halbleiterscheibe A process for producing a semiconductor wafer |
01/05/2011 | DE102009030294A1 Verfahren zur Politur der Kante einer Halbleiterscheibe A method for polishing the edge of a semiconductor wafer |
01/05/2011 | CN201693450U Chip double-side grinding and polishing machine |
01/05/2011 | CN201693449U Force regulation balance sample polishing platform |
01/05/2011 | CN201693448U Boring hole grinder |
01/05/2011 | CN201693447U Gland locking device of grinding machine |
01/05/2011 | CN201693446U Copper powder subsidence recovery tank of sand belt grinding machine |