Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
02/2011
02/09/2011CN101966698A Manufacturing method of polishing pad
02/09/2011CN101966697A Manufacturing method of polishing pad
02/09/2011CN101966689A Surface polishing method for carbon surface of large-diameter 4H-SiC wafer
02/09/2011CN101966688A Low-pressure CMP (Chemico-mechanical Polishing) method for grand-scale integrated circuit copper wiring surface
02/09/2011CN101966687A Chemical mechanical lapping method
02/09/2011CN101966686A Grinding tool and grinding method for reheating main valve seat of steam turbine
02/09/2011CN101058713B Polishing slurry and polishing method
02/08/2011US7884020 Polishing cloth and method of manufacturing semiconductor device
02/08/2011US7883397 Substrate retainer
02/08/2011US7883394 Substrate holding mechanism, substrate polishing apparatus and substrate polishing method
02/03/2011US20110028073 Cmp polishing slurry and polishing method
02/03/2011US20110027997 Polishing liquid for cmp and polishing method
02/03/2011DE102009035781A1 Method for lapping sealing surface of internal combustion engine, involves lapping injector sealing surface and ignition plug sealing surface of internal combustion engine by slip ring fastened to slip bolt using hand drilling machine
02/02/2011EP1633528B1 Substrate polishing apparatus
02/02/2011EP1316111B1 Method of processing a semiconductor wafer
02/02/2011CN201728583U Wafer grinding machine capable of reducing times of pressure regulation
02/02/2011CN201728582U Wafer grinding machine with higher lifting smoothness of hanging wall
02/02/2011CN201728581U Wafer lapper with high lapping precision
02/02/2011CN201728580U Wafer grinding machine with higher corrosion resistance
02/02/2011CN201728579U Cutting liquid circle device
02/02/2011CN201728578U Clamp for grinding special-shaped prism with spherical surface
02/02/2011CN101961854A Multi-functional polishing pad
02/02/2011CN101961853A Substrate polishing apparatus and method of polishing substrate using the same
02/02/2011CN101961852A Chemical mechanical grinding method for interlayer dielectric layer
02/02/2011CN101224552B Grinding method of a disk-shaped substrate and grinding apparatus
02/01/2011US7879180 Polishing device and polishing method
02/01/2011US7878882 Advanced workpiece finishing
01/2011
01/27/2011WO2011010423A1 Method for manufacturing carrier for double-side polishing apparatus, carrier for double-side polishing apparatus, and method for polishing double sides of wafer
01/27/2011US20110021115 Substrate polishing apparatus and method of polishing substrate using the same
01/27/2011DE102009047927A1 Rotor disk for supporting one or multiple disks for conditioning polishing cloth in polishing machine, has core made of material, which have high rigidity and core is fully and partially provided with coating
01/27/2011DE102009033206A1 Polierverfahren und Poliervorrichtung zur Korrektur von geometrischen Abweichungsfehlern auf Präzisionsoberflächen A polishing method and the polishing apparatus for the correction of deviation errors on the geometric precision surfaces
01/27/2011DE102007021411B4 Poliermaschine Polisher
01/26/2011EP2276820A2 High porosity abrasive articles and methods of manufacturing same
01/26/2011EP1910025B1 Abrasive agglomerate polishing method
01/26/2011EP1324859B1 Polishing pad with built-in optical sensor
01/26/2011CN201720764U Abrasive belt-correcting controller for lapping machines
01/26/2011CN101960519A Composition and method for polishing nickel-phosphorous-coated aluminum hard disks
01/26/2011CN101959647A Carrier for double-side polishing device, and double-side polishing device and double-side polishing method that use same
01/26/2011CN101957186A Method for detecting surface evenness of wafer and chemically mechanical polishing method
01/26/2011CN101955733A Method for preparing grinding fluid, grinding fluid, and chemical mechanical polishing (CMP) method for metal tungsten
01/26/2011CN101954620A Method for chemically grinding a semiconductor wafer on both sides
01/26/2011CN101386149B Cleaning device for chemical mechanical polishing device
01/26/2011CN101296780B Cmp of copper/ruthenium substrates
01/25/2011US7875501 Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure
01/25/2011US7874894 Polishing pad
01/20/2011WO2011008499A2 Leak proof pad for cmp endpoint detection
01/20/2011WO2011007588A1 Cmp fluid and method for polishing palladium
01/20/2011WO2011006650A1 Microstructuring, polishing method and polishing device for correcting geometric deviation defects on precision surfaces
01/20/2011WO2010101925A3 System for magnetorheological finishing of a substrate
01/20/2011US20110014852 Pick and place tool grinding
01/20/2011US20110014851 Polishing apparatus and polishing method
01/20/2011DE102009030297B3 Verfahren zum Polieren einer Halbleiterscheibe A method of polishing a semiconductor wafer
01/19/2011EP2274136A1 Chemical mechanical planarization pad with void network
01/19/2011CN201711859U Grinding mill capable of measuring frequency
01/19/2011CN1837319B Polishing composition and polishing method
01/19/2011CN101952943A Polishing pad
01/19/2011CN101950565A Glass substrate for information recording medium and method for manufacturing the same, and magnetic recording medium
01/19/2011CN101350302B GaN基板 GaN substrates
01/18/2011US7871309 Polishing pad
01/18/2011US7871308 Abrasive, method of polishing target member and process for producing semiconductor device
01/13/2011WO2011004793A1 Polishing liquid composition for silicon wafers
01/13/2011WO2011004764A1 Grinding machine for plate-like bodies and method of grinding plate-like bodies
01/13/2011WO2011004473A1 Optical disc polishing apparatus
01/13/2011US20110008965 Polishing composition and polishing method
01/13/2011US20110008649 Glass substrate for information recording medium and method for manufacturing the same, and magnetic recording medium
01/13/2011US20110005143 Polishing oil slurry for polishing hard crystal substrate
01/13/2011DE102010025067A1 Method for forming e.g. lubrication channels in cylindrical crankcase borehole, involves placing lubrication structure by partial deformation, and reworking of sliding or storage surface by smoothing, honing, lapping process
01/12/2011EP2271463A1 Polishing pad with controlled void formation
01/12/2011EP1444308B1 Cerium-based polish and cerium-based polish slurry
01/12/2011CN201702672U Improved combination machine
01/12/2011CN201702671U Clamping tool for preventing grinding product from dropping
01/12/2011CN201702627U Measurement correction system applied for base plate grinding mechanism
01/12/2011CN1852786B Polishing cloth, polishing cloth processing method, and substrate manufacturing method using same
01/12/2011CN101946309A Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method
01/12/2011CN101941181A Method for grinding wafer
01/12/2011CN101941180A Chemically mechanical polishing method
01/12/2011CN101941179A Chemical mechanical grinding equipment
01/12/2011CN101941178A Grinding tool of carburetor enrichment valve
01/12/2011CN101941177A Large-sized column-shaped workpiece thermal spraying surface treating polishing and grinding structure
01/12/2011CN101528416B Polishing head and polishing apparatus
01/12/2011CN101240159B Polishing liquid composition
01/11/2011US7867909 contains at least one water soluble polymer selected from polyvinylpyrrolidone and poly(N-vinylformamide), and an alkali, and preferably further contains at least one of a chelating agent and an abrasive grain of colloidal silica or fumed silica; for a finish stage of preliminary polishing
01/11/2011US7867303 Cerium oxide abrasive and method of polishing substrates
01/11/2011US7867066 Polishing pad
01/11/2011US7867063 Substrate holding apparatus and polishing apparatus
01/11/2011US7867060 Retainer ring used for polishing a structure for manufacturing magnetic head, and polishing method using the same
01/06/2011WO2011002149A2 Cmp polishing pad with pores formed therein, and method for forming pores
01/06/2011WO2011001755A1 Two-pack urethane resin composite for use in an abrasive pad, polyurethane abrasive pad, and method for manufacturing a polyurethane abrasive pad
01/05/2011EP2270848A2 Multilayer protective sheet for a semiconductor wafer and structure comprising said wafer and sheet, method for protecting semiconductor wafer and method for processing semiconductor wafer
01/05/2011EP2268451A2 Method and device for working the surface of a hard material
01/05/2011EP1338636B1 Abrasive material
01/05/2011DE102009031337A1 Method for processing surface of component i.e. cylinder barrel of internal combustion engine, involves brushing component surface by brushing process, and processing component surface by machining process i.e. lapping-honing process
01/05/2011DE102009030296A1 Verfahren zur Herstellung einer epitaxierten Halbleiterscheibe A process for producing an epitaxially coated semiconductor wafer,
01/05/2011DE102009030295A1 Verfahren zur Herstellung einer Halbleiterscheibe A process for producing a semiconductor wafer
01/05/2011DE102009030294A1 Verfahren zur Politur der Kante einer Halbleiterscheibe A method for polishing the edge of a semiconductor wafer
01/05/2011CN201693450U Chip double-side grinding and polishing machine
01/05/2011CN201693449U Force regulation balance sample polishing platform
01/05/2011CN201693448U Boring hole grinder
01/05/2011CN201693447U Gland locking device of grinding machine
01/05/2011CN201693446U Copper powder subsidence recovery tank of sand belt grinding machine
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